EEWORLDEEWORLDEEWORLD

Part Number

Search

FX11B-80P-SV0521

Description
Board to Board u0026 Mezzanine Connectors 80P M HDR STRT SMT NO GDE PST NO GRD PL
CategoryThe connector   
File Size691KB,16 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
Download Datasheet Parametric View All

FX11B-80P-SV0521 Online Shopping

Suppliers Part Number Price MOQ In stock  
FX11B-80P-SV0521 - - View Buy Now

FX11B-80P-SV0521 Overview

Board to Board u0026 Mezzanine Connectors 80P M HDR STRT SMT NO GDE PST NO GRD PL

FX11B-80P-SV0521 Parametric

Parameter NameAttribute value
Product CategoryBoard to Board & Mezzanine Connectors
ManufacturerHirose
RoHSDetails
ProductHeaders
Number of Positions80 Position
Termination StyleSMD
Mounting AngleHorizontal
PackagingReel
Stack Height3 mm
Factory Pack Quantity1000
0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm
High-Speed Board-to-Board Connections
FX11 Series
Stacking height : 2mm
Stacking height : 2.5mm, 3mm
Dec.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
■Features
1. Low Profile Design
The board-to-board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs. (Fig.2)
10 Signal : 1 Ground Arrangement
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through a design
that fixes ground plates to both sides of the header and receptacle.
Housing
m
5m
0.7
Ground Plate
Signal contact
m
5m
0.7
mm
0.5
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10 : 1 with the ground plate connected to
the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1)
Metal fitting
Ground plate and metal fitting make contact
Fig.1
4. Metal Fittings for Added Strength
Metal fittings provide for greater adhesion to the board, which
protects the connector against sheaning forces. The unique
connector design provides a connection between the fitting and the
ground plate for a stronger ground.
Stacking Height Variation
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm affords a compact connector,
and reduces mounting space on the board.
Note: 2.0mm type product cannot be used or interchanged
with the 2.5mm or 3.0mm type product.
Fig.2
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT portion to
prevent solder wicking. (Fig.3)
Structure Prevent Solder Wicking
7. High Contact Reliability
Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm,
3mm height) for signal contacts.
8. Optional Ground Plate
An alternate style is also available without the ground plate. The
space provided by the absence of the ground plate is filled with
additional signal contacts.
Fig.3
Signal Integrity Features
●Insertion-Loss-to-Crosstalk
Ratio (ICR)
The insertion-loss-to-crosstalk
ratio (ICR) with five differential
FEXT aggressors meets the
extrapolated IEEE802.3ap
specification to 10
+
Gbps.
●Differential
Impedance
The differential impedance is
100 + /- 10ø for FX11 at 50 ps
rise time(20% to 80%).
ICR 3mm(Without GND)
60
50
40
30
20
10
0
ICR
IEEEspec
0
1
2
3
4
5
6
7
8
9
10
120
115
110
105
Impedance 3mm(Without GND)
ICR(dB)
Z(ø)
100
95
90
85
80
0.8
FX11- 3mm DifferentialTDR
0.9
1
1.1
1.2
1.3
1.4
1.5
Frequency(GHz)
Time(ns)
2017.11e
1
A problem when using the read function
I wrote an ADC driver whose function is to return 100 ADC values continuously each time it reads. However, when running on an ARM2440 board, it can only return about the first 20 numbers each time. Wh...
sphshine Embedded System
Android Bluetooth Issues
[backcolor=rgb(239, 245, 249)]myText1 = (TextView) findViewById(R.id.textView1);[/backcolor] [backcolor=rgb(239, 245, 249)]myText1.setText("STOP:");[/backcolor] [backcolor=rgb(239, 245, 249)]sendCmd("...
chenbingjy Linux and Android
Analysis of LED packaging devices in several cutting-edge fields [Transfer]
Analysis of LED packaging devices in several cutting-edge fields [Transfer]1. Overview  The packaging of LED devices has a history of 40 years. In recent years, with the rapid development of the LED i...
analog LED Zone
Gain Amplifier
What does G=10V/V mean in the amplifier chip data sheet? Does it mean 10dB amplification or 10 times amplification?...
小霸小东小 PCB Design
How realistic are Shenzhen women?
Every city is a big dye vat, and the environment will change people's ideas and lifestyles. After living in Shenzhen for a few years, many women have become very realistic. Shenzhen women are generall...
jxb01033016 Talking
I hope you can predict the topic of this year's competition.
[i=s]This post was last edited by paulhyde on 2014-9-15 09:00[/i] The topic of this year's competition has been announced. Anyone interested can come and predict the topic....
kxxiaoxuanzikx Electronics Design Contest

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2001  2884  1194  1303  2067  41  59  25  27  42 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号