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74LV125PW118

Description
Buffers u0026 Line Drivers QUAD BUFR/DRVR OE ACTIVE LOW
Categorysemiconductor    logic   
File Size92KB,16 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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74LV125PW118 Overview

Buffers u0026 Line Drivers QUAD BUFR/DRVR OE ACTIVE LOW

74LV125PW118 Parametric

Parameter NameAttribute value
Product CategoryBuffers & Line Drivers
ManufacturerNXP
RoHSDetails
Number of Input Lines4 Input
Number of Output Lines4 Output
PolarityNon-Inverting
Supply Voltage - Max5.5 V
Supply Voltage - Min1 V
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 125 C
Mounting StyleSMD/SMT
Package / CaseSOT-402-14
PackagingReel
FunctionBuffer/Line Driver
Height0.95 mm (Max)
High Level Output Current- 16 mA
Input Signal TypeSingle-Ended
Length5.1 mm (Max)
Logic FamilyLV
Low Level Output Current16 mA
Number of Channels4
Operating Supply Voltage3.3 V
Output Type3-State
Propagation Delay Time55 ns at 1.2 V, 19 ns at 2 V, 14 ns at 2.7 V, 10 ns at 3.3 V
Quiescent Current160 uA
Factory Pack Quantity2500
Supply Current - Max160 uA
TechnologyCMOS
Width4.5 mm (Max)
74LV125
Quad buffer/line driver; 3-state
Rev. 03 — 7 April 2009
Product data sheet
1. General description
The 74LV125 is a low-voltage Si-gate CMOS device that is pin and function compatible
with 74HC125 and 74HCT125.
The 74LV125 provides four non-inverting buffer/line drivers with 3-state outputs. The
3-state outputs (nY) are controlled by the output enable input (nOE). A HIGH at nOE
causes the outputs to assume a high-impedance OFF-state.
2. Features
I
I
I
I
I
Wide operating voltage: 1.0 V to 5.5 V
Optimized for low voltage applications: 1.0 V to 3.6 V
Accepts TTL input levels between V
CC
= 2.7 V and V
CC
= 3.6 V
Typical output ground bounce < 0.8 V at V
CC
= 3.3 V and T
amb
= 25
°C
Typical HIGH-level output voltage (V
OH
) undershoot: > 2 V at V
CC
= 3.3 V and
T
amb
= 25
°C
I
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74LV125N
74LV125D
74LV125DB
74LV125PW
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
Name
DIP14
SO14
SSOP14
TSSOP14
Description
plastic dual in-line package; 14 leads (300 mil)
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT27-1
SOT108-1
SOT337-1
SOT402-1
Type number

74LV125PW118 Related Products

74LV125PW118 74LV125N 74LV125DB-T 74LV125D 74LV125N112 74LV125D112 74LV125DB
Description Buffers u0026 Line Drivers QUAD BUFR/DRVR OE ACTIVE LOW Buffers u0026 Line Drivers QUAD BUFR/DRVR OE ACTIVE LOW Buffers u0026 Line Drivers QUAD BUFR/DRVR OE ACTIVE LOW Buffers u0026 Line Drivers QUAD BUFR/DRVR OE ACTIVE LOW Buffers u0026 Line Drivers QUAD BUFR/DRVR OE Aluminum Organic Polymer Capacitors 220uF 6.3V 2.8mm ESR 10mOhms Buffers u0026 Line Drivers QUAD BUFR/DRVR OE ACTIVE LOW
Is it Rohs certified? - conform to conform to conform to - - conform to
Maker - NXP NXP NXP - - NXP
Parts packaging code - MO-001 SSOP SOIC - - SSOP
package instruction - DIP, DIP14,.3 SSOP, SOP, SOP14,.25 - - SSOP, SSOP14,.3
Contacts - 14 14 14 - - 14
Reach Compliance Code - unknown unknown unknown - - unknown
series - LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H - - LV/LV-A/LVX/H
JESD-30 code - R-PDIP-T14 R-PDSO-G14 R-PDSO-G14 - - R-PDSO-G14
JESD-609 code - e4 e4 e4 - - e4
length - 19.025 mm 6.2 mm 8.65 mm - - 6.2 mm
Load capacitance (CL) - 50 pF 50 pF 50 pF - - 50 pF
Logic integrated circuit type - BUS DRIVER BUS DRIVER BUS DRIVER - - BUS DRIVER
Number of digits - 1 1 1 - - 1
Number of functions - 4 4 4 - - 4
Number of ports - 2 2 2 - - 2
Number of terminals - 14 14 14 - - 14
Maximum operating temperature - 125 °C 125 °C 125 °C - - 125 °C
Minimum operating temperature - -40 °C -40 °C -40 °C - - -40 °C
Output characteristics - 3-STATE 3-STATE 3-STATE - - 3-STATE
Output polarity - TRUE TRUE TRUE - - TRUE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY
encapsulated code - DIP SSOP SOP - - SSOP
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR - - RECTANGULAR
Package form - IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE - - SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) - NOT SPECIFIED 260 260 - - 260
propagation delay (tpd) - 31 ns 31 ns 31 ns - - 31 ns
Certification status - Not Qualified Not Qualified Not Qualified - - Not Qualified
Maximum seat height - 4.2 mm 2 mm 1.75 mm - - 2 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V - - 5.5 V
Minimum supply voltage (Vsup) - 1 V 1 V 1 V - - 1 V
Nominal supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V - - 3.3 V
surface mount - NO YES YES - - YES
technology - CMOS CMOS CMOS - - CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - - AUTOMOTIVE
Terminal surface - Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) - - Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form - THROUGH-HOLE GULL WING GULL WING - - GULL WING
Terminal pitch - 2.54 mm 0.65 mm 1.27 mm - - 0.65 mm
Terminal location - DUAL DUAL DUAL - - DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED 30 30 - - 30
width - 7.62 mm 5.3 mm 3.9 mm - - 5.3 mm
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