MC9S08LG16CLF datasheet, PDF - EEWORLD Datasheet

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MC9S08LG16CLF: CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，52 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC9S08LG16CLF Parametric

Parameter Name	Attribute value
Brand Name	Freescale
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFP
package instruction	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BBC, LQFP-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	EAR99
Samacsys Description	Microcontroller
Has ADC	YES
Address bus width
bit size	8
maximum clock frequency	40 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G48
JESD-609 code	e3
length	7 mm
Humidity sensitivity level	3
Number of I/O lines	39
Number of terminals	48
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP48,.35SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
RAM (bytes)	1984
rom(word)	18432
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	40 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

Document Number: MC9S08LG32

Rev. 10, 04/2015

MC9S08LG32 Series with Addendum

Covers: MC9S08LG32 and

MC9S08LG16

Rev. 10 of the MC9S08LG32 Series data sheet (covering MC9S08LG32 and MC9S08LG16) has two parts:

• The addendum to revision 9 of the data sheet, immediately following this cover page.

• Revision 9 of the data sheet, following the addendum. The changes described in the addendum have

not been implemented in the specified pages.

Table of Contents

Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

2.2 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . .10

2.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .10

2.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .11

2.5 ESD Protection and Latch-Up Immunity . . . . . . . . . . . .12

2.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

2.7 Supply Current Characteristics . . . . . . . . . . . . . . . . . . .17

2.8 External Oscillator (XOSC) Characteristics . . . . . . . . .22

2.9 Internal Clock Source (ICS) Characteristics . . . . . . . . .24

2.10 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .25

2.11 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

2.11.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . .29

2.11.2 TPM Module Timing . . . . . . . . . . . . . . . . . . . . .30

2.11.3 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

2.12 LCD Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

2.13 Flash Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .34

2.14 EMC Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

2.14.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . . .35

2.14.2 Conducted Transient Susceptibility . . . . . . . . . .35

Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

3.1 Device Numbering System . . . . . . . . . . . . . . . . . . . . . .39

Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

4.1 Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . .39

4.1.1 80-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . .40

4.1.2 64-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . .43

4.1.3 48-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . .46

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48

Figure 17.Internal Oscillator Deviation from Trimmed Frequency 25

Figure 18.ADC Input Impedance Equivalency Diagram. . . . . . . 26

Figure 19.Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Figure 20.IRQ/KBIPx Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Figure 21.Timer External Clock . . . . . . . . . . . . . . . . . . . . . . . . . 30

Figure 22.Timer Input Capture Pulse . . . . . . . . . . . . . . . . . . . . . 30

Figure 23.SPI Master Timing (CPHA = 0) . . . . . . . . . . . . . . . . . 32

Figure 24.SPI Master Timing (CPHA =1) . . . . . . . . . . . . . . . . . . 32

Figure 25.SPI Slave Timing (CPHA = 0) . . . . . . . . . . . . . . . . . . 33

Figure 26.SPI Slave Timing (CPHA = 1) . . . . . . . . . . . . . . . . . . 33

Figure 27.4 MHz, Positive Polarity Pins 1 – 41 . . . . . . . . . . . . . 36

Figure 28.4 MHz, Positive Polarity Pins 42 – 80 . . . . . . . . . . . . 36

Figure 29.4 MHz, Negative Polarity Pins 1 – 41. . . . . . . . . . . . . 37

Figure 30.4 MHz, Negative Polarity Pins 42 – 80. . . . . . . . . . . . 37

Figure 31.Device Number Example for Auto Parts. . . . . . . . . . . 39

Figure 32.Device Number Example for IMM Parts. . . . . . . . . . . 39

Figure 33.80-pin LQFP Package Drawing

(Case 917A, Doc #98ASS23237W) . . . . . . . . . . . . . . . . . . . . . . 42

Figure 34.64-pin LQFP Package Drawing

(Case 840F, Doc #98ASS23234W) . . . . . . . . . . . . . . . . . . . . . . 45

Figure 35.48-pin LQFP Package Drawing

(Case 932, Doc #98ASH00962A) . . . . . . . . . . . . . . . . . . . . . . . 47

List of Tables

Table 1. MC9S08LG32 Series Features by MCU and Package . 4

Table 2. Pin Availability by Package Pin-Count . . . . . . . . . . . . . . 8

Table 3. Parameter Classifications . . . . . . . . . . . . . . . . . . . . . . 10

Table 4. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . 11

Table 5. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . 11

Table 6. ESD and Latch-Up Test Conditions . . . . . . . . . . . . . . . 12

Table 7. ESD and Latch-Up Protection Characteristics. . . . . . . 13

Table 8. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 9. Supply Current Characteristics. . . . . . . . . . . . . . . . . . 17

Table 10.Oscillator Electrical Specifications

(Temperature Range = –40

C

to 105

C

Ambient) . . . . . . . . . . 22

Table 11.ICS Frequency Specifications

(Temperature Range = –40

C

to 105

C

Ambient) . . . . . . . . . . 24

Table 12.12-bit ADC Operating Conditions . . . . . . . . . . . . . . . . 25

Table 13.12-bit ADC Characteristics

REFH

= V

DDAD

, V

REFL

= V

SSAD

) . . . . . . . . . . . . . . . . . . . . . . . 27

Table 14.Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Table 15.TPM Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Table 16.SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Table 17.LCD Electricals, 3 V Glass . . . . . . . . . . . . . . . . . . . . . 34

Table 18.Flash Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Table 19.Radiated Emissions, Electric Field . . . . . . . . . . . . . . . 35

Table 20.Conducted Susceptibility, EFT/B . . . . . . . . . . . . . . . . . 35

Table 21.Susceptibility Performance Classification . . . . . . . . . . 38

Table 22.Device Numbering System . . . . . . . . . . . . . . . . . . . . . 38

Table 23.Package Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . 39

Table 24.Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

List of Figures

Figure 1. MC9S08LG32 Series Block Diagram . . . . . . . . . . . . . . 3

Figure 2. 80-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 3. 64-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 4. 48-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 5. Typical Low-side Drive (sink) characteristics –

High Drive (PTxDSn = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 6. Typical Low-side Drive (sink) characteristics –

Low Drive (PTxDSn = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 7. Typical High-side Drive (source) characteristics –

High Drive (PTxDSn = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 8. Typical High-side Drive (source) characteristics –

Low Drive (PTxDSn = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 9. Typical Run I

for FBE Mode at 1 MHz. . . . . . . . . . . 19

Figure 10.Typical Run I

for FBE Mode at 20 MHz . . . . . . . . . 20

Figure 11.Typical Run I

for FEE Mode at 1 MHz . . . . . . . . . . 20

Figure 12.Typical Run I

for FEE Mode at 20 MHz . . . . . . . . . 21

Figure 13.Typical Stop2 I

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 14.Typical Stop3 I

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 15.Typical Crystal or Resonator Circuit: High Range and Low

Range/High Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 16.Typical Crystal or Resonator Circuit: Low Range/Low

Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

MC9S08LG32 Series Data Sheet, Rev. 9

Freescale Semiconductor

MC9S08LG16CLF Related Products

	MC9S08LG16CLF	S9S08LG32J0VLKR	S9S08LG32J0CLK	S9S08LG32J0CLKR	S9S08LG32J0VLK	S9S08LG16J0VLF	S9S08LG32J0VLFR
Description			8-bit Microcontrollers - MCU LG32 AUTO 80LQFP F/G	8-bit Microcontrollers - MCU 8-bit MCU, S08 core, 32KB Flash, 40MHz, -40/+85degC, Automotive Qualified, QFP 80	8-bit Microcontrollers - MCU LG32 AUTO 80LQFP F/G	8-bit Microcontrollers - MCU 8-bit MCU, S08 core, 18KB Flash, 40MHz, -40/+105degC, Automotive Qualified, QFP 48	8-bit Microcontrollers - MCU LG32 AUTO 48LQFP
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Reach Compliance Code	unknown	compliant	unknown	compliant	unknown	unknown	unknown
Humidity sensitivity level	3	3	3	3	3	3	3
Brand Name	Freescale	-	Freescale	-	Freescale	-	Freescale
Is it lead-free?	Lead free	-	Lead free	-	Lead free	Lead free	Lead free
Parts packaging code	QFP	-	QFP	-	QFP	QFP	QFP
package instruction	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BBC, LQFP-48	-	14 X 14 MM, 1.4 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, LQFP-80	-	14 X 14 MM, 1.4 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, LQFP-80	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BBC, LQFP-48	-
Contacts	48	-	80	-	80	48	48
ECCN code	EAR99	-	3A991.A.2	-	3A991.A.2	3A991.A.2	-
Has ADC	YES	-	YES	-	YES	YES	-
bit size	8	-	8	-	8	8	8
maximum clock frequency	40 MHz	-	40 MHz	-	40 MHz	40 MHz	-
DAC channel	NO	-	NO	-	NO	NO	-
DMA channel	NO	-	NO	-	NO	NO	-
JESD-30 code	S-PQFP-G48	-	S-PQFP-G80	-	S-PQFP-G80	S-PQFP-G48	S-PQFP-G48
JESD-609 code	e3	-	e3	-	e3	e3	e3
length	7 mm	-	14 mm	-	14 mm	7 mm	-
Number of I/O lines	39	-	69	-	69	39	-
Number of terminals	48	-	80	-	80	48	48
Maximum operating temperature	85 °C	-	85 °C	-	105 °C	105 °C	105 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-40 °C	-40 °C	-40 °C
PWM channel	YES	-	YES	-	YES	YES	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC
encapsulated code	LFQFP	-	LQFP	-	LQFP	LFQFP	QFP
Encapsulate equivalent code	QFP48,.35SQ,20	-	QFP80,.64SQ	-	QFP80,.64SQ	QFP48,.35SQ,20	QFP48,.35SQ,20
Package shape	SQUARE	-	SQUARE	-	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	-	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	260	NOT SPECIFIED	260	260	-
power supply	3/5 V	-	3/5 V	-	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	1984	-	1984	-	1984	1984	1984
rom(word)	18432	-	32768	-	32768	18432	32768
ROM programmability	FLASH	-	FLASH	-	FLASH	FLASH	FLASH
Maximum seat height	1.6 mm	-	1.6 mm	-	1.6 mm	1.6 mm	-
speed	40 MHz	-	40 MHz	-	40 MHz	40 MHz	40 MHz
Maximum supply voltage	5.5 V	-	5.5 V	-	5.5 V	5.5 V	-
Minimum supply voltage	2.7 V	-	2.7 V	-	2.7 V	2.7 V	-
Nominal supply voltage	5 V	-	5 V	-	5 V	5 V	-
surface mount	YES	-	YES	-	YES	YES	YES
technology	CMOS	-	CMOS	-	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	-	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	-	GULL WING	-	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	-	0.65 mm	-	0.65 mm	0.5 mm	0.5 mm
Terminal location	QUAD	-	QUAD	-	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	40	NOT SPECIFIED	40	NOT SPECIFIED	40	40	-
width	7 mm	-	14 mm	-	14 mm	7 mm	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-
Filter level	-	-	AEC-Q100	-	AEC-Q100	AEC-Q100	AEC-Q100

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Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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