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TMS320DM6437ZDUQ5

Description
Digital Signal Processors & Controllers - DSP, DSC Digital Media Processor
Categorysemiconductor    The embedded processor and controller   
File Size2MB,306 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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TMS320DM6437ZDUQ5 Overview

Digital Signal Processors & Controllers - DSP, DSC Digital Media Processor

TMS320DM6437ZDUQ5 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTexas Instruments
Product CategoryDigital Signal Processors & Controllers - DSP, DSC
RoHSDetails
Mounting StyleSMD/SMT
Package / CaseBGA-376
ProductDSPs
CoreTMS320C64x
Maximum Clock Frequency500 MHz
L1 Cache Instruction Memory32 kB
L1 Cache Data Memory80 kB
Operating Supply Voltage1.2 V
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 125 C
Interface TypeAudio, Ethernet, I2C, SPI, UART, USB, Video
Number of I/Os111 I/O
Data Bus Width32 bit
Development KitTMDSVDP6437
I/O Voltage1.8 V, 3.3 V
Instruction TypeFixed Point
L2 Cache Instruction / Data Memory128 kB
Moisture SensitiveYes
Number of Cores1 Core
Number of Timers/Counters2 x 64 bit
Processor SeriesDaVinci
Factory Pack Quantity60
Watchdog TimersWatchdog Timer

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Description Digital Signal Processors & Controllers - DSP, DSC Digital Media Processor Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc
Brand Name - Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? - Lead free Lead free Lead free Lead free
Is it Rohs certified? - conform to conform to conform to conform to
Maker - Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code - BGA BGA BGA BGA
package instruction - LFBGA, BGA361,19X19,32 LFBGA, BGA361,19X19,32 LFBGA, BGA361,19X19,32 LFBGA, BGA361,19X19,32
Contacts - 361 361 361 90
Reach Compliance Code - compliant compliant compliant compliant
ECCN code - 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2
Factory Lead Time - 16 weeks 1 week 1 week 6 weeks
Other features - ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY
Address bus width - 32 32 32 32
barrel shifter - NO NO NO NO
bit size - 32 32 32 32
boundary scan - YES YES YES YES
maximum clock frequency - 27 MHz 27 MHz 27 MHz 27 MHz
External data bus width - 32 32 32 32
Format - FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache - YES YES YES YES
Internal bus architecture - MULTIPLE MULTIPLE MULTIPLE MULTIPLE
JESD-30 code - S-PBGA-B361 S-PBGA-B361 S-PBGA-B361 S-PBGA-B361
JESD-609 code - e1 e1 e1 e1
length - 16 mm 16 mm 16 mm 16 mm
low power mode - YES YES YES YES
Humidity sensitivity level - 3 3 3 3
Number of DMA channels - 72 72 72 72
Number of terminals - 361 361 361 90
Number of timers - 5 5 5 5
On-chip data RAM width - 8 8 8 8
On-chip program ROM width - 8 8 8 8
Maximum operating temperature - 90 °C 125 °C 90 °C 125 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - LFBGA LFBGA LFBGA LFBGA
Encapsulate equivalent code - BGA361,19X19,32 BGA361,19X19,32 BGA361,19X19,32 BGA361,19X19,32
Package shape - SQUARE SQUARE SQUARE SQUARE
Package form - GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) - 260 260 260 260
power supply - 1.2,1.8,3.3 V 1.2,1.8,3.3 V 1.2,1.8,3.3 V 1.2,1.8,3.3 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
RAM (number of words) - 81920 81920 81920 61440
ROM programmability - MROM MROM MROM MROM
Maximum seat height - 1.4 mm 1.4 mm 1.4 mm 1.4 mm
Maximum supply voltage - 1.89 V 1.89 V 1.89 V 1.26 V
Minimum supply voltage - 1.71 V 1.71 V 1.71 V 1.14 V
Nominal supply voltage - 1.8 V 1.8 V 1.8 V 1.2 V
surface mount - YES YES YES YES
technology - CMOS CMOS CMOS CMOS
Temperature level - OTHER AUTOMOTIVE OTHER AUTOMOTIVE
Terminal surface - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form - BALL BALL BALL BALL
Terminal pitch - 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location - BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 16 mm 16 mm 16 mm 16 mm
uPs/uCs/peripheral integrated circuit type - DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER

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