TMS320DM6437ZWTQ4 datasheet, PDF

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TMS320DM6437ZWTQ4: DescriptionDigital Signal Processors & Controllers - DSP, DSC Dig Media Proc; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，306 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc

TMS320DM6437ZWTQ4 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA, BGA361,19X19,32
Contacts	361
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Factory Lead Time	1 week
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	32
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	27 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B361
JESD-609 code	e1
length	16 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels	72
Number of terminals	361
Number of timers	5
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA361,19X19,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.2,1.8,3.3 V
Certification status	Not Qualified
RAM (number of words)	81920
ROM programmability	MROM
Maximum seat height	1.4 mm
Maximum supply voltage	1.89 V
Minimum supply voltage	1.71 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER

TMS320DM6437ZWTQ4 Related Products

	TMS320DM6437ZWTQ4	TMS320DM6437ZDUQ5	TMS320DM6437ZWT4	TMS320DM6437ZWT6	TMS320DM6437ZWTQ6
Description	Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc	Digital Signal Processors & Controllers - DSP, DSC Digital Media Processor	Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc	Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc	Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc
Brand Name	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	-	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	-	conform to	conform to	conform to
Maker	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	-	BGA	BGA	BGA
package instruction	LFBGA, BGA361,19X19,32	-	LFBGA, BGA361,19X19,32	LFBGA, BGA361,19X19,32	LFBGA, BGA361,19X19,32
Contacts	361	-	361	361	90
Reach Compliance Code	compliant	-	compliant	compliant	compliant
ECCN code	3A991.A.2	-	3A991.A.2	3A991.A.2	3A991.A.2
Factory Lead Time	1 week	-	16 weeks	1 week	6 weeks
Other features	ALSO REQUIRES 3.3V SUPPLY	-	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY
Address bus width	32	-	32	32	32
barrel shifter	NO	-	NO	NO	NO
bit size	32	-	32	32	32
boundary scan	YES	-	YES	YES	YES
maximum clock frequency	27 MHz	-	27 MHz	27 MHz	27 MHz
External data bus width	32	-	32	32	32
Format	FIXED POINT	-	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	-	YES	YES	YES
Internal bus architecture	MULTIPLE	-	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B361	-	S-PBGA-B361	S-PBGA-B361	S-PBGA-B361
JESD-609 code	e1	-	e1	e1	e1
length	16 mm	-	16 mm	16 mm	16 mm
low power mode	YES	-	YES	YES	YES
Humidity sensitivity level	3	-	3	3	3
Number of DMA channels	72	-	72	72	72
Number of terminals	361	-	361	361	90
Number of timers	5	-	5	5	5
On-chip data RAM width	8	-	8	8	8
On-chip program ROM width	8	-	8	8	8
Maximum operating temperature	125 °C	-	90 °C	90 °C	125 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	-	LFBGA	LFBGA	LFBGA
Encapsulate equivalent code	BGA361,19X19,32	-	BGA361,19X19,32	BGA361,19X19,32	BGA361,19X19,32
Package shape	SQUARE	-	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	-	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	-	260	260	260
power supply	1.2,1.8,3.3 V	-	1.2,1.8,3.3 V	1.2,1.8,3.3 V	1.2,1.8,3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	81920	-	81920	81920	61440
ROM programmability	MROM	-	MROM	MROM	MROM
Maximum seat height	1.4 mm	-	1.4 mm	1.4 mm	1.4 mm
Maximum supply voltage	1.89 V	-	1.89 V	1.89 V	1.26 V
Minimum supply voltage	1.71 V	-	1.71 V	1.71 V	1.14 V
Nominal supply voltage	1.8 V	-	1.8 V	1.8 V	1.2 V
surface mount	YES	-	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	-	OTHER	OTHER	AUTOMOTIVE
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	-	BALL	BALL	BALL
Terminal pitch	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16 mm	-	16 mm	16 mm	16 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	-	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER

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