M24C64-WBN6P datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> M24C64-WBN6P

M24C64-WBN6P: DescriptionUSB Interface IC USB to Basic Serial UART IC SSOP-16; Categorystorage storage; File Size820KB，54 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

Download Datasheet Parametric Compare View All

M24C64-WBN6P Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	M24C64-WBN6P	-	-	View	Buy Now

M24C64-WBN6P Overview

USB Interface IC USB to Basic Serial UART IC SSOP-16

M24C64-WBN6P Parametric

Parameter Name	Attribute value
Brand Name	STMicroelectronics
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Samacsys Confidence	3
Samacsys Status	Released
Samacsys PartID	221858
Samacsys Pin Count	8
Samacsys Part Category	Integrated Circuit
Samacsys Package Category	Dual-In-Line Packages
Samacsys Footprint Name	DIP8
Samacsys Released Date	2015-09-17 10:56:35
Is Samacsys	N
Maximum clock frequency (fCLK)	0.4 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDDR
JESD-30 code	R-PDIP-T8
JESD-609 code	e3
length	9.27 mm
memory density	65536 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	8192 words
character code	8000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	5.33 mm
Serial bus type	I2C
Maximum standby current	0.000002 A
Maximum slew rate	0.005 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE
Base Number Matches	1

Preview

Download Datasheet

View All

M24C64-W M24C64-R

M24C64-F M24C64-DF

64-Kbit serial I²C bus EEPROM

Datasheet

production data

Features

•

Compatible with all I

C bus modes:

– 1 MHz

– 400 kHz

– 100 kHz

•

Memory array:

– 64 Kbit (8 Kbyte) of EEPROM

– Page size: 32 byte

– Additional Write lockable page (M24C64-D

order codes)

TSSOP8 (DW)

169 mil width

SO8 (MN)

150 mil width

•

Single supply voltage:

– 1.7 V to 5.5 V over –40 °C / +85 °C

– 1.6 V to 5.5 V over 0 °C / +85 °C

•

Write:

– Byte Write within 5 ms

– Page Write within 5 ms

PDIP8 (BN)

UFDFPN8 (MC)

DFN8 - 2x3 mm

UFDFPN5 (MH)

DFN5 -1.7x1.4 mm

•

Random and sequential Read modes

•

Write protect of the whole memory array

•

Enhanced ESD/Latch-Up protection

•

More than 4 million Write cycles

•

More than 200-years data retention

WLCSP (CS)

Thin WLCSP (CT)

Packages

•

PDIP8 ECOPACK2

•

SO8 ECOPACK2

•

TSSOP8 ECOPACK2

•

UFDFPN ECOPACK2

WLCSP

(CU)

Unsawn wafer

•

WLCSP ECOPACK2

•

Unsawn wafer (each die is tested)

November 2017

This is information on a product in full production.

DocID16891 Rev 35

1/54

www.st.com

Contents

M24C64-W M24C64-R M24C64-F M24C64-DF

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.1

2.2

2.3

2.4

2.5

2.6

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chip Enable (E2, E1, E0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

(ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.6.1

2.6.2

2.6.3

2.6.4

Operating supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.1

4.2

4.3

4.4

4.5

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.1

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Identification Page (M24C64-D only) . . . . . . . . . . . . . . . . . . . . . . 18

Lock Identification Page (M24C64-D only) . . . . . . . . . . . . . . . . . . . . . . 18

ECC (Error Correction Code) and Write cycling . . . . . . . . . . . . . . . . . . 18

Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 19

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

5.2

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.2.1

2/54

DocID16891 Rev 35

List of tables

M24C64-W M24C64-R M24C64-F M24C64-DF

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signals vs. bump position . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Most significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Least significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Operating conditions (voltage range W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Operating conditions (voltage range R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Operating conditions (voltage range F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Cycling performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

DC characteristics (M24C64-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

DC characteristics (M24C64-R device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

DC characteristics (M24C64-F, M24C64-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . . 29

400 kHz AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

1 MHz AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

UFDFPN5 - 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead - package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package,

no lead - package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 40

Ultra Thin WLCSP- 4-bump, 0.795 x 0.674 mm, wafer level chip

scale package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

WLCSP- 5-bump, 0.959 x 1.073 mm, 0.4 mm pitch wafer level chip scale

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Ordering information scheme (unsawn wafer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

4/54

DocID16891 Rev 35

M24C64-W M24C64-R M24C64-F M24C64-DF

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Figure 23.

Figure 24.

Figure 25.

Figure 26.

Figure 27.

Figure 28.

Figure 29.

Figure 30.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

UFDFPN5 (DFN5) package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

WLCSP 4 bump Ultra thin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5-bump WLCSP connections (M24C64-FCS6TP/K) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

8-bump thin WLCSP connections (M24C64-DFCT6TP/K) . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip enable inputs connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Maximum Rbus value versus bus parasitic capacitance (Cbus) for

an I2C bus at maximum frequency fC = 400 kHz

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Maximum R

bus

value versus bus parasitic capacitance C

bus

) for

an I

C bus at maximum frequency f

= 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

UFDFPN5 – 1.7x1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

UFDFPN5 - 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch

dual flat package, no lead - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package outline . 38

SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 40

Ultra Thin WLCSP- 4-bump, 0.795 x 0.674 mm,wafer level chip

scale package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Thin WLCSP- 4-bump, 0.795 x 0.674 mm, wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

WLCSP 5-bump, 0.959 x 1.073 mm, 0.4 mm pitch wafer level chip scale

(M24C64-FCS6TP/K)- package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

WLCSP - 5-bump, 0.959 x 1.073 mm, 0.4 mm pitch wafer level chip scale

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

DocID16891 Rev 35

5/54

M24C64-WBN6P Related Products

	M24C64-WBN6P	M24C64-DFDW6TP	M24C64-DFMN6TP	M24C64-FDW6TP
Description	USB Interface IC USB to Basic Serial UART IC SSOP-16	EEPROM 64 Kbit Serial I2C 1.7V to 5.5V EEPROM	Clock Synthesizer / Jitter Cleaner Jitter Attenuartor 4-output 1GHz	Ferrite Beads 0603 120 OHM
Brand Name	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Is it Rohs certified?	conform to	conform to	conform to	conform to
package instruction	DIP, DIP8,.3	TSSOP, TSSOP8,.25	SOP, SOP8,.25	TSSOP, TSSOP8,.25
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	0.4 MHz	1 MHz	1 MHz	0.4 MHz
Data retention time - minimum	40	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
length	9.27 mm	4.4 mm	4.9 mm	4.4 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
word count	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	8KX8	8KX8	8KX8	8KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSSOP	SOP	TSSOP
Encapsulate equivalent code	DIP8,.3	TSSOP8,.25	SOP8,.25	TSSOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/5 V	1.8/5 V	1.8/5 V	1.8/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.33 mm	1.2 mm	1.75 mm	1.2 mm
Serial bus type	I2C	I2C	I2C	I2C
Maximum standby current	0.000002 A	0.000001 A	0.000001 A	0.000001 A
Maximum slew rate	0.005 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.5 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	5 V	2.5 V	2.5 V	1.8 V
surface mount	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	0.65 mm	1.27 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	3 mm	3.9 mm	3 mm
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	10 ms
write protect	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Base Number Matches	1	1	1	1
Factory Lead Time	-	13 weeks	13 weeks	13 weeks

Recommended Resources

Analysis of various power supply filter circuits

High voltage series switching power supply circuit

One of the operational amplifier stabilized power supply circuits

STK078G audio IC circuit diagram

MAX663 series output voltage setting method circuit PMOS direct output circuit diagram

Circuit for converting 3-digit BCD code to analog level

Have you ever used profilestart and profilestop?: I want to test the efficiency of a program. I have tested this efficiency through the pb platform (if it is not embedded in this platform, it will not show the name of this program, but unknown instea...; 冰山一角 Embedded System

【SensorTag】Environment Construction: Download: swrc258d.zip swrc258d.zip Reference: http://processors.wiki.ti.com/index.php/BLE_Device_Monitor_User_Guide 141076 141076[/size][/font][/align][align=left][font=宋体]Completed desktop:[/font][/...; wuyanyanke Wireless Connectivity

I want to learn microcontrollers. Should I learn assembly or C51? I don't have any basic knowledge.: I want to learn microcontrollers. Should I learn assembly or C51? I have no foundation. Thanks for your guidance!...; tyl810 51mcu

PWM output DA power regulation solution: I used a second-order filter, which was divided into 1024 parts. The 430 ADC at the output could not be detected, but the multimeter had digital signals, so I added a first-order emitter follower. The...; aewill Analogue and Mixed Signal

Share a book about synthesis: A book about synthesizable coding style The attachment uploaded in this post is a special compressed volume for the HaoZip forum. Friends who don't have HaoZip installed may not be able to decompress ...; 碧水2012 FPGA/CPLD

Regarding the instantiation reference problem, please help: Hello prawns! We are newbies, and there seems to be a problem with the following instantiation reference. Please help us: Cry:reg clkb,rdb,wrb;reg [11:0]datab;wire[11:0]qb;assign qb = ( channelout == ...; elin6518 FPGA/CPLD

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components