MM912F634DV2AP datasheet, PDF - EEWORLD Datasheet

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MM912F634DV2AP: Description16-bit Microcontrollers - MCU 32KS12 LIN2xLS/HS Isense; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，296 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MM912F634DV2AP Overview

16-bit Microcontrollers - MCU 32KS12 LIN2xLS/HS Isense

MM912F634DV2AP Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFP
package instruction	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-48
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.A.2
JESD-30 code	S-PQFP-G48
JESD-609 code	e3
length	7 mm
Humidity sensitivity level	3
Number of terminals	48
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Maximum seat height	1.6 mm
Maximum supply voltage	18 V
Minimum supply voltage	5.5 V
Nominal supply voltage	7 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

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Freescale Semiconductor

Technical Data

Document Number: MM912F634

Rev. 9.0, 6/2015

Integrated S12 Based Relay

Driver with LIN

The MM912F634 is an integrated single package solution integrating an

HCS12 microcontroller with a SMARTMOS analog control IC. The Die to

Die Interface (D2D) controlled analog die combines system base chip

and application specific functions, including a LIN transceiver.

Features

•

16-Bit S12 CPU, 32 kByte FLASH, 2.0 kByte RAM

Background debug (BDM) & debug module (DBG)

Die to die bus interface for transparent memory mapping

On-chip oscillator & two independent watchdogs

LIN 2.1 physical layer interface with integrated SCI

Six digital MCU GPIOs shared with SPI (PA5…0)

10-Bit, 15 channel - analog to digital converter (ADC)

16-Bit, four channel - timer module (TIM16B4C)

8-Bit, two channel - pulse width modulation module (PWM)

Six high-voltage / wake-up inputs (L5.0)

Three low-voltage GPIOs (PB2.0)

MM912F634

48-PIN LQFP

98ASH00962A

7.0 mm x 7.0 mm

AP SUFFIX: Non-exposed Pad

48-PIN LQFP-EP

98ASA00173D

7.0 mm x 7.0 mm

AE SUFFIX: Exposed Pad

•

Low-power modes with cyclic sense & forced wake-up

Current sense module with selectable gain

Reverse battery protected voltage sense module

Two protected low-side outputs to drive inductive loads

Two protected high-side outputs

Chip temperature sensor

Hall sensor supply

Integrated voltage regulator(s)

MM912F634

Battery Sense

Power Supply

VSENSE

VS1

VS2

LIN interface

LIN

LGND

ADC2p5

ADC Supply

AGND

2.5V Supply

5V Supply

VDD

EVDD

VDDX

EVDDX

DGND

EVSS

EVSSX

RESET

RESET_A

PA0/MISO

PA1/MOSI

PA2/SCK

PA3/SS

PA4

PA5

BKGD/MODC

EXTAL

XTAL

TEST

LS1

PGND

LS2

ISENSEH

Current Sense Module

ISENSEL

Low-Side Drivers

HSUP

Hall Sensor supply

Hall Sensor

PTB0/AD0/RX/TIM0CH0

PTB1/AD1/TX/TIM0CH1

PTB2/AD2/PWM/TIM0CH2

HS1

Digital Ground

5V GPI/O with optional

pull-up (shared with

ADC, PWM, Timer, SCI)

Reset

HS2

12V Light/LED

and switch supply

5V digital I/O

Debug and

external

Oscillator

MCU Test

TCLK

TEST_A

Analog/Digital Inputs

(High Voltage- and Wake

Up capable)

Analog Test

Feature not available in all Analog Options

Figure 1. Simplified Application Diagram

ORDERING INFORMATION

Table of Contents

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1

MM912F634 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2

MCU Die Signal Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.1

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.2

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.3

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.4

Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.5

Static Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.6

Dynamic Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.7

Thermal Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.8

ESD Protection and Latch-up Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.9

Additional Test Information ISO7637-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Functional Description and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

4.2

MM912F634 - Analog Die Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

4.3

Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

4.4

Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

4.5

Die to Die Interface - Target . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

4.6

Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

4.7

Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

4.8

Wake-up / Cyclic Sense. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

4.9

Window Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

4.10 Hall Sensor Supply Output - HSUP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

4.11 High-side Drivers - HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

4.12 Low-side Drivers - LSx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

4.13 PWM Control Module (PWM8B2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

4.14 LIN Physical Layer Interface - LIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

4.15 Serial Communication Interface (S08SCIV4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

4.16 High Voltage Inputs - Lx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

4.17 General Purpose I/O - PTB[0…2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

4.18 Basic Timer Module - TIM (TIM16B4C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

4.19 Analog Digital Converter - ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

4.20 Current Sense Module - ISENSE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

4.21 Temperature Sensor - TSENSE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

4.22 Supply Voltage Sense - VSENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

4.23 Internal Supply Voltage Sense - VS1SENSE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

4.24 Internal Bandgap Reference Voltage Sense - BANDGAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

4.25 MM912F634 - Analog Die Trimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

4.26 MM912F634 - MCU Die Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

4.27 Port Integration Module (9S12I32PIMV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

4.28 Memory Mapping Control (S12SMMCV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

4.29 Interrupt Module (S12SINTV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163

4.30 Background Debug Module (S12SBDMV1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167

4.31 S12S Debug (S12SDBGV1) Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

4.32 S12S Clocks and Reset Generator (S12SCRGV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211

4.33 External Oscillator (S12SOSCFPV1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222

4.34 Real Time Interrupt (S12SRTIV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224

4.35 Computer Operating Properly (S12SCOPV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228

4.36 32 kbyte Flash Module (S12SFTSR32KV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233

4.37 Die-to-Die Initiator (D2DIV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260

4.38 Serial Peripheral Interface (S12SPIV4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289

5.1

Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289

Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294

MM912F634

Analog Integrated Circuit Device Data

Freescale Semiconductor

MM912F634DV2AP Related Products

	MM912F634DV2AP	MM912F634CV2AER2	MM912F634CV1AE	MM912F634CV2APR2	KIT912F634EVME	MM912F634DV2AER2	MM912F634DV2AE	MM912F634DV1AER2	MM912F634DV1AE
Description	16-bit Microcontrollers - MCU 32KS12 LIN2xLS/HS Isense	16-bit Microcontrollers - MCU DUAL LS/HS SWITCH W. LIN	16-bit Microcontrollers - MCU DUAL LS/HS SWITCH W. LIN	16-bit Microcontrollers - MCU 32KS12 LIN2XLS/HS ISENSE	Development Boards u0026 Kits - S08 / S12 INTEGRATED DUAL L/H SWIT	16-bit Microcontrollers - MCU DUAL LS/HS SWITCH W. LIN	16-bit Microcontrollers - MCU DUAL LS/HS SWITCH W. LIN	16-bit Microcontrollers - MCU DUAL LS/HS SWITCH W. LIN	16-bit Microcontrollers - MCU DUAL LS/HS SWITCH W. LIN
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	-	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	-	NXP	NXP	NXP	NXP
Parts packaging code	QFP	QFP	QFP	QFP	-	QFP	QFP	QFP	QFP
package instruction	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-48	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-026BBC, LQFP-48	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-026BBC, LQFP-48	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-026BBC, LQFP-48	-	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-48	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-48	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-48	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-48
Contacts	48	48	48	48	-	48	48	48	48
Reach Compliance Code	compliant	unknown	unknown	unknown	-	compliant	compliant	compliant	compliant
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	-	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
JESD-30 code	S-PQFP-G48	S-PQFP-G48	S-PQFP-G48	S-PQFP-G48	-	S-PQFP-G48	S-PQFP-G48	S-PQFP-G48	S-PQFP-G48
JESD-609 code	e3	e3	e3	e3	-	e3	e3	e3	e3
length	7 mm	7 mm	7 mm	7 mm	-	7 mm	7 mm	7 mm	7 mm
Humidity sensitivity level	3	3	3	3	-	3	3	3	3
Number of terminals	48	48	48	48	-	48	48	48	48
Maximum operating temperature	105 °C	105 °C	105 °C	105 °C	-	105 °C	105 °C	105 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	HLFQFP	HLFQFP	LFQFP	-	HLFQFP	HLFQFP	HLFQFP	HLFQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	-	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	-	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	-	260	260	260	260
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum supply voltage	18 V	18 V	18 V	18 V	-	18 V	18 V	18 V	18 V
Minimum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V
Nominal supply voltage	7 V	-	-	-	-	7 V	7 V	7 V	7 V
surface mount	YES	YES	YES	YES	-	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	-	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	40	40	40	40	-	40	40	40	40
width	7 mm	7 mm	7 mm	7 mm	-	7 mm	7 mm	7 mm	7 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	-	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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