ZSSC3026Cl4R datasheet, PDF - EEWORLD Datasheet

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ZSSC3026Cl4R: DescriptionSensor Interface Sensor Signal Conditoner; Categorysemiconductor Analog mixed-signal IC; File Size716KB，51 Pages; ManufacturerIDT (Integrated Device Technology, Inc.); Websitehttp://www.idt.com/

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ZSSC3026Cl4R Overview

Sensor Interface Sensor Signal Conditoner

ZSSC3026Cl4R Parametric

Parameter Name	Attribute value
Product Category	Sensor Interface
Manufacturer	IDT (Integrated Device Technology, Inc.)
RoHS	Details
Mounting Style	SMD/SMT
Package / Case	PQFN-24
Packaging	Reel
Factory Pack Quantity	5000
Unit Weight	0.033076 oz

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Low Power, High Resolution 16-Bit

Sensor Signal Conditioner

ZSSC3026

Datasheet

Brief Description

The ZSSC3026 is a sensor signal conditioner (SSC)

integrated circuit for high-accuracy amplification and

analog-to-digital conversion of a differential input

signal. Developed for correction of resistive bridge

sensors and optimized for high-resolution altimeter

module applications, the ZSSC3026 can perform

offset, span, and 1 and 2 order temperature com-

pensation of the measured signal. It can also provide

a corrected temperature output measured with an

internal sensor. The corrected measurement values

are provided at the digital output pins, which can be

configured as I C™* (≤3.4MHz) or SPI (≤ 20MHz).

Digital compensation of the signal offset, sensitivity,

temperature, and non-linearity is accomplished via

an 18-bit internal digital signal processor (DSP) run-

ning a correction algorithm. Calibration coefficients

are stored on-chip in a highly reliable, non-volatile,

multiple-time programmable (MTP) memory. Prog-

ramming the ZSSC3026 is simple via the serial

interface. An internal charge pump provides the

programming voltage. The interface is used for the

PC-controlled calibration procedure, which programs

the calibration coefficients in memory. The digital

mating is fast and precise, eliminating the overhead

normally associated with trimming external com-

ponents and multi-pass calibration routines.

Benefits

•

Excellent for low-voltage and low-power battery

applications

Integrated 18-bit calibration math DSP

Costs minimized via one-pass calibration

No external trimming components required

Highly integrated CMOS design

Physical Characteristics

•

Supply voltage range: 1.8 to 3.6V

Current consumption: 900µA (operating mode)

Sleep State current: 50nA (typical)

Temperature resolution: <0.003K/LSB

Operation temperatures depending on part

number: –40°C to +85°C

Small die size

Delivery options: die for wafer bonding, bumped

die for Flip Chip, PQFN24

Typical Applications

The ZSSC3026 is designed for operation in cali-

brated resistive (e.g., pressure) sensor modules:

•

Features

•

Flexible, programmable analog front-end design;

up to 16-bit scalable, charge-balancing two-

segment analog-to-digital converter (ADC)

Fully programmable gain amplifier for optimizing

sensor signals: gain range 14 to 72 (linear)

Internal auto-compensated temperature sensor

Digital compensation of individual sensor offset;

1 and 2 order compensation of sensor gain

Digital compensation of 1 and 2 order tem-

perature gain and offset drift

Intelligent power management unit

Layout customized for die-die bonding with

sensor for high-density chip-on-board assembly

Typical sensor elements can achieve accuracy of

better than ±0.10% FSO @ -40 to 85°C

Barometric altitude measurement for portable

navigation

Altitude measurement for emergency call

systems and car navigation

Inside hard disk pressure measurement

Weather forecast

Fan control

ZSSC3026 Application Example

* I

C™ is a registered trademark of NXP.

March 28, 2016

ZSSC3026

Table of Contents

IC Characteristics ............................................................................................................................................. 6

1.1. Absolute Maximum Ratings ....................................................................................................................... 6

1.2. Operating Conditions ................................................................................................................................. 6

1.3. Electrical Parameters ................................................................................................................................ 7

1.4. Power Supply Rejection Ratio (PSRR) vs. Frequency ............................................................................ 10

2 Circuit Description .......................................................................................................................................... 11

2.1. Brief Description ...................................................................................................................................... 11

2.2. Signal Flow and Block Diagram............................................................................................................... 11

2.3. Analog Front End ..................................................................................................................................... 12

2.3.1. Amplifier ............................................................................................................................................ 12

2.3.2. Analog-to-Digital Converter ............................................................................................................... 14

2.3.3. Temperature Measurement .............................................................................................................. 18

2.3.4. Bridge Supply .................................................................................................................................... 18

2.4. Digital Section .......................................................................................................................................... 18

2.4.1. Digital Signal Processor (DSP) Core ................................................................................................ 18

2.4.2. MTP Memory..................................................................................................................................... 18

2.4.3. Clock Generator ................................................................................................................................ 19

2.4.4. Power Supervision ............................................................................................................................ 19

2.4.5. Interface ............................................................................................................................................ 19

3 Functional Description .................................................................................................................................... 20

3.1. Power Up ................................................................................................................................................. 20

3.2. Measurements ......................................................................................................................................... 20

3.3. Operational Modes .................................................................................................................................. 20

3.4. Command Interpretation .......................................................................................................................... 23

3.4.1. SPI/I C™ Commands ....................................................................................................................... 23

3.5. Communication Interface......................................................................................................................... 25

3.5.1. Common Functionality ...................................................................................................................... 25

3.5.2. SPI .................................................................................................................................................... 27

3.5.3. I C™ .................................................................................................................................................. 31

3.6. Memory .................................................................................................................................................... 32

3.6.1. Programming Memory ...................................................................................................................... 33

3.6.2. Memory Status Commands .............................................................................................................. 33

3.6.3. Memory Contents .............................................................................................................................. 34

3.7. Calibration Sequence .............................................................................................................................. 40

3.7.1. Calibration Step 1 – Assigning Unique Identification ........................................................................ 40

3.7.2. Calibration Step 2 – Data Collection ................................................................................................. 40

3.7.3. Calibration Step 3 – Coefficient Calculations .................................................................................... 41

3.8. The Calibration Math ............................................................................................................................... 42

3.8.1. Bridge Signal Compensation ............................................................................................................ 42

3.8.2. Temperature Signal Compensation .................................................................................................. 44

4 Die and Package Characteristics ................................................................................................................... 45

March 28, 2016

ZSSC3026

4.1. Die Pad Assignments .............................................................................................................................. 45

4.2. Package (PQFN24) Properties ................................................................................................................ 47

Quality and Reliability ..................................................................................................................................... 49

Ordering Information ...................................................................................................................................... 49

Related Documents ........................................................................................................................................ 49

Glossary ......................................................................................................................................................... 50

Document Revision History ............................................................................................................................ 51

Table of Figures

Figure 2.1

Figure 2.2

Figure 3.1

Figure 3.2

Figure 3.3

Figure 3.4

Figure 3.5

Figure 3.6

Figure 3.7

Figure 3.8

Figure 3.9

Figure 3.10

Figure 3.11

Figure 4.1

Figure 4.2

ZSSC3026 Functional Block Diagram .............................................................................................. 11

ADC Offset ........................................................................................................................................ 17

Operational Flow Chart: Power-Up ................................................................................................... 21

Operational Flow Chart: Command Mode and Normal Mode .......................................................... 22

SPI configuration CPHA=0 ............................................................................................................... 27

SPI Configuration CPHA=1 .............................................................................................................. 28

SPI Command Request .................................................................................................................... 29

SPI Read Status ............................................................................................................................... 30

SPI Read Data .................................................................................................................................. 30

I C™ Command Request ................................................................................................................ 31

I C™ Read Status ............................................................................................................................ 31

I C™ Read Data ............................................................................................................................... 32

Memory Program Operation ............................................................................................................. 33

ZSSC3026 Pad Placement ............................................................................................................... 45

General PQFN24 Package Dimensions ........................................................................................... 47

March 28, 2016

ZSSC3026

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 2.1

Table 2.2

Table 2.3

Table 2.4

Table 2.5

Table 2.6

Table 2.7

Table 2.8

Table 3.1

Table 3.2

Table 3.3

Table 3.4

Table 3.5

Table 3.6

Table 3.7

Table 3.8

Table 4.1

Table 4.2

Table 4.3

Maximum Ratings ............................................................................................................................... 6

Operating Conditions .......................................................................................................................... 6

Constraints for VDD Power-On Reset ................................................................................................ 7

Electrical Parameters .......................................................................................................................... 7

Amplifier Gain: Stage 1 ..................................................................................................................... 12

Amplifier Gain: Stage 2 ..................................................................................................................... 13

Gain Polarity ..................................................................................................................................... 13

MSB/LSB Settings ............................................................................................................................ 14

MSB/LSB Segmentation Settings for Temperature Measurement ................................................... 14

ADC Conversion Time for a Single A2D Conversion ....................................................................... 15

Typical Conversion Time vs. Noise Performance for 16-Bit Fully Conditioned Signal Results

(AZBM, BM, AZTM, TM, and Digital SSC Correction) ...................................................................... 16

ADC Offset Settings .......................................................................................................................... 17

SPI/I2C Commands .......................................................................................................................... 23

Get_Raw Commands ....................................................................................................................... 25

General Status Byte .......................................................................................................................... 26

Status Byte for Read Operations ...................................................................................................... 26

Status Byte for Write Operations ...................................................................................................... 26

Mode Status ...................................................................................................................................... 26

Memory Status Word ........................................................................................................................ 33

MTP Memory Content Assignments ................................................................................................. 34

Die Pad Assignments ....................................................................................................................... 46

Physical Package Dimensions.......................................................................................................... 47

Pin Assignments PQFN24 ................................................................................................................ 48

March 28, 2016

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