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NSF03A40

Description
FRD - Low Forward Voltage Drop
CategoryDiscrete semiconductor    diode   
File Size42KB,5 Pages
ManufacturerNihon Inter Electronics Corporation
Websitehttp://www.niec.co.jp
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NSF03A40 Overview

FRD - Low Forward Voltage Drop

NSF03A40 Parametric

Parameter NameAttribute value
MakerNihon Inter Electronics Corporation
package instructionSMC, 2 PIN
Contacts2
Reach Compliance Codeunknown
Other featuresLOW POWER LOSS
applicationFAST RECOVERY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1.25 V
JESD-30 codeR-PDSO-C2
Maximum non-repetitive peak forward current45 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-40 °C
Maximum output current3 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusNot Qualified
Maximum repetitive peak reverse voltage400 V
Maximum reverse current20 µA
Maximum reverse recovery time0.03 µs
surface mountYES
Terminal formC BEND
Terminal locationDUAL
OUTLINE DRAWING
FRD
*
*
*
*
*
*
*
Type
:
NSF03A40
FEATURES
FLAT-PAK
Surface Mount Device
Ultra Fsat Recovery
High Surge Capability
Low Forward Voltage Drop
Low Power Loss, High Efficiency
Packaged in 16mm Tape and Reel
Not Rolling During Assembly
Maximum Ratings
Rating
Repetitive Peak Reverse Voltage
Average Rectified Output Current
RMS Forward Current
Surge Forward Current
Operating JunctionTemperature Range
Storage Temperature Range
Approx Net Weight:016g
Symbol
V
RRM
I
O
I
F(RMS)
I
FSM
T
jw
T
stg
45
1.41
3.0
NSF03A40
400
50Hz Half Sine
Ta=25
°C
*1
Wave Resistive Load
T1=99
°C
*2
4.71
50Hz Half Sine Wave,1cycle
Non-repetitive
-40 to +150
-40 to +150
Unit
V
A
A
A
°C
°C
Electrical
Thermal Characteristics
Characteristics
Peak Reverse Current
Peak Forward Voltage
Reverse Recovery Time
Symbol
Conditions
Min.
-
-
-
-
Typ.
-
-
-
-
Max.
20
1.25
35
89
13
Unit
µA
V
ns
°C
/W
I
RM
Tj= 25°C, V
RM
= V
RRM
V
FM
Tj= 25°C, I
FM
= 3.0A
trr
Ta= 25°C, I
FM
=3 A –di/dt=50A/µs
Rth
(j-a)
Junction to Ambient *1
Thermal Resistance
Rth
(j-l)
Junction to Lead
*1 Alumina Substrate Mounted (Soldering Lands=2x3.5mm,Both Sides)
*2 Tl= Lead Temperature
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