Power Management........................................................................................................................................................ 22
Normal Operation Mode ................................................................................................................................................. 22
Energy Detect Mode ....................................................................................................................................................... 22
Soft Power Down Mode .................................................................................................................................................. 23
Power Saving Mode........................................................................................................................................................ 23
Power Down ................................................................................................................................................................... 23
Detection of Energy ........................................................................................................................................................ 23
Detection of Linkup ......................................................................................................................................................... 24
MDI/MDI-X Auto Crossover ............................................................................................................................................ 25
Auto Negotiation ............................................................................................................................................................. 27
Inter Packet Gap (IPG) ................................................................................................................................................... 29
Late Collision .................................................................................................................................................................. 29
Address Filtering Function .............................................................................................................................................. 30
Bus Interface Unit (BIU)......................................................................................................................................................
Physical Data Bus Size .................................................................................................................................................. 31
Little and Big Endian Support ......................................................................................................................................... 32
Internal I/O Registers Space Mapping............................................................................................................................ 43
Register Map: MAC, PHY and QMU...................................................................................................................................
49
Bit Type Definition........................................................................................................................................................... 49
Bus Error Status Register (0x06 – 0x07): BESR............................................................................................................ 49
On-Chip Bus Control Register (0x20 – 0x21): OBCR .................................................................................................... 51
EEPROM Control Register (0x22 – 0x23): EEPCR ....................................................................................................... 51
Memory BIST Info Register (0x24 – 0x25): MBIR .......................................................................................................... 52
Global Reset Register (0x26 – 0x27): GRR ................................................................................................................... 52
Brother Niu's Experience at Shenzhen IIC Part 3: Consumer Electronics Brother Niu's Series of Stories Tablets need to be analyzed Smartphones need to be predicted Let's look at chip suppliers MTK and ...
I recently bought a DIY 3D printer, a Melzi main control board, and an ATMEGA1284P control chip. The agent gave me the firmware code, which is some scattered files, including some .cpp and .h. I downl...
Share a driver [code] for A8 to control two motors. /*************************************************Copyright(C)********************************************** ***************************************...
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In recent years, with the increasing demand for manufacturing and automated production management, industrial barcode scanners have gradually become an indispensable part of the industrial manufact...[Details]
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
Is electromagnetic radiation from electric vehicles harmful to the human body? Recently, the issue of electromagnetic radiation from electric vehicles has garnered widespread attention. However, pu...[Details]
Long ago, the lifespan of cars in my country was 15 years. Once a car reached 15 years old, it was forced to be scrapped. However, the policy was later changed. As long as the car does not exceed 6...[Details]
Recently,
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The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
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Intel®
Xeon®
6
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core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
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With the increasing popularity of automated equipment, linear modules, a common auxiliary device for automated equipment, have also seen a bright future. In particular, in recent years, many small ...[Details]