EBS25UC8APMA-75L datasheet, PDF

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EBS25UC8APMA-75L: Description256MB SDRAM Micro DIMM; Categorystorage storage; File Size140KB，14 Pages; ManufacturerELPIDA; Websitehttp://www.elpida.com/en

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EBS25UC8APMA-75L Overview

256MB SDRAM Micro DIMM

EBS25UC8APMA-75L Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ELPIDA
Parts packaging code	DIMM
package instruction	DIMM, DIMM144,20
Contacts	144
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Maximum access time	5.4 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N144
memory density	2147483648 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	64
Humidity sensitivity level	1
Number of functions	1
Number of ports	1
Number of terminals	144
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM144,20
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum standby current	0.024 A
Maximum slew rate	1.76 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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DATA SHEET

256MB SDRAM Micro DIMM

EBS25UC8APMA (32M words

64 bits, 1 bank)

Description

The EBS25UC8APMA is 32M words

64 bits, 1 bank

Synchronous Dynamic RAM Micro Dual In-line Memory

Module (Micro DIMM), mounted 8 pieces of 256M bits

SDRAM sealed in

µBGA



package. This module

provides high density and large quantities of memory in

a small space without utilizing the surface mounting

technology. Decoupling capacitors are mounted on

power supply line for noise reduction.

Note : Do not push the cover or drop the modules in

order to protect from mechanical defects, which

would be electrical defects.

Features

•

Fully compatible with 8 bytes Micro DIMM: JEDEC

standard outline

•

144-pin socket type micro dual in line memory

module (Micro DIMM)



PCB height: 30.00mm (1.18inch )



Lead pitch: 0.50mm

•

3.3V power supply

•

Clock frequency: 100MHz/133MHz (max.)

•

LVTTL interface

•

Data bus width:

64 non-ECC

•

Single pulsed /RAS

•

4 Banks can operates simultaneously and

independently

•

Burst read/write operation and burst read/single write

operation capability

•

Programmable burst length (BL): 1, 2, 4, 8, Full page

•

2 variations of burst sequence



Sequential



Interleave

•

Programmable /CAS latency (CL): 2, 3

•

Byte control by DQMB

•

Refresh cycles: 8192 refresh cycles/64ms

•

2 variations of refresh



Auto refresh



Self refresh

Document No. E0241E30 (Ver. 3.0)

Date Published May 2002 (K) Japan

URL: http://www.elpida.com

Elpida

Memory, Inc. 2002

EBS25UC8APMA-75L Related Products

	EBS25UC8APMA-75L	EBS25UC8APMA	EBS25UC8APMA-75	EBS25UC8APMA-7AL	EBS25UC8APMA-7A	EBS25UC8APMA-80	EBS25UC8APMA-80L
Description	256MB SDRAM Micro DIMM	256MB SDRAM Micro DIMM	256MB SDRAM Micro DIMM	256MB SDRAM Micro DIMM	256MB SDRAM Micro DIMM	256MB SDRAM Micro DIMM	256MB SDRAM Micro DIMM
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	ELPIDA	-	ELPIDA	ELPIDA	ELPIDA	ELPIDA	ELPIDA
Parts packaging code	DIMM	-	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM, DIMM144,20	-	DIMM, DIMM144,20	DIMM, DIMM144,20	DIMM, DIMM144,20	DIMM, DIMM144,20	DIMM, DIMM144,20
Contacts	144	-	144	144	144	144	144
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow	unknow
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	-	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
Maximum access time	5.4 ns	-	5.4 ns	5.4 ns	5.4 ns	6 ns	6 ns
Other features	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz	-	133 MHz	133 MHz	133 MHz	100 MHz	100 MHz
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N144	-	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144
memory density	2147483648 bi	-	2147483648 bi	2147483648 bi	2147483648 bi	2147483648 bi	2147483648 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE	-	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	64	-	64	64	64	64	64
Humidity sensitivity level	1	-	1	1	1	1	1
Number of functions	1	-	1	1	1	1	1
Number of ports	1	-	1	1	1	1	1
Number of terminals	144	-	144	144	144	144	144
word count	33554432 words	-	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words
character code	32000000	-	32000000	32000000	32000000	32000000	32000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	70 °C	70 °C	70 °C	70 °C
organize	32MX64	-	32MX64	32MX64	32MX64	32MX64	32MX64
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	-	DIMM	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM144,20	-	DIMM144,20	DIMM144,20	DIMM144,20	DIMM144,20	DIMM144,20
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	225	-	225	225	225	225	225
power supply	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	-	8192	8192	8192	8192	8192
self refresh	YES	-	YES	YES	YES	YES	YES
Maximum standby current	0.024 A	-	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A
Maximum slew rate	1.76 mA	-	1.76 mA	2 mA	2 mA	1.7 mA	1.7 mA
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	-	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	-	NO	NO	NO	NO	NO
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	-	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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