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AT24C64D-UUM-T

Description
EEPROM 1MHz, Ind Temp, 6-WLCSP
Categorystorage   
File Size1MB,25 Pages
ManufacturerAtmel (Microchip)
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AT24C64D-UUM-T Overview

EEPROM 1MHz, Ind Temp, 6-WLCSP

AT24C64D-UUM-T Parametric

Parameter NameAttribute value
Product CategoryEEPROM
ManufacturerAtmel (Microchip)
RoHSDetails
Mounting StyleSMD/SMT
Package / CaseWLCSP-6
Memory Size64 kbit
Interface TypeSerial, 2-Wire, I2C
Organization8 k x 8
Data Retention100 Year
Maximum Clock Frequency1 MHz
Supply Current - Max1 mA, 3 mA
Operating Supply Voltage1.7 V to 5.5 V
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
PackagingReel
Operating Supply Current400 uA, 2 mA
Factory Pack Quantity5000
Supply Voltage - Max5.5 V
Supply Voltage - Min1.7 V
AT24C64D
I
2
C-Compatible (2-Wire) Serial EEPROM
64-Kbit (8,192 x 8)
DATASHEET
Features
Low-voltage and Standard-voltage Operation
̶
V
CC
= 1.7V to 5.5V
Internally Organized as 8,192 x 8 (64K)
I
2
C-compatible (2-Wire) Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
400kHz (1.7V) and 1MHz (2.5V, 2.7V, 5.0V) Compatibility
Write Protect Pin for Hardware Protection
32-byte Page Write Mode
̶
Partial Page Writes Allowed
Self-timed Write Cycle (5ms Max)
High Reliability
̶
̶
Endurance: 1,000,000 Write Cycles
Data Retention: 100 Years
Lead-free/Halogen-free Devices Available
Green Package Options (Pb/Halide-free/RoHS Compliant)
̶
8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN, 8-ball
VFBGA, and 4-ball/5-ball/6-ball WLCSP Packages
Die Sale Options: Wafer Form, Waffle Pack, and Bumped Wafers
Description
The Atmel
®
AT24C64D provides 65,536-bits of Serial Electrically Erasable and
Programmable Read-Only Memory (EEPROM) organized as 8,192 words of 8 bits
each. The device’s cascading feature allows up to eight devices to share a
common 2-wire bus. The device is optimized for use in many industrial and
commercial applications where low-power and low-voltage operation are
essential. The devices are available in space-saving 8-lead JEDEC SOIC, 8-lead
TSSOP, 8-pad UDFN, 8-pad XDFN, 8-ball VFBGA, and 4-ball/5-ball/6-ball
WLCSP packages. In addition, this device operates from 1.7V to 5.5V.
Atmel-8850D-SEEPROM-AT24C64D-Datasheet_052015

AT24C64D-UUM-T Related Products

AT24C64D-UUM-T AT24C64D-XHM-B AT24C64D-WWU11M AT24C64D-WWU27M AT24C64D-SSHM-B
Description EEPROM 1MHz, Ind Temp, 6-WLCSP EEPROM SERIAL EEPROM 64K 2-WIRE 1.7V EEPROM SEEPROM, 64k, I2C - 1MHz, Ind Tmp , 11mil Unsawn Wafer EEPROM SEEPROM, 64k, I2C - WAFER SALE, 1.7V, 27 MIL EEPROM SERIAL EEPROM 64K 2-WIRE 1.7V
Maker - Atmel (Microchip) Atmel (Microchip) - Atmel (Microchip)
Parts packaging code - TSSOP DIE - SOIC
package instruction - TSSOP, TSSOP8,.25 DIE, - SOP, SOP8,.25
Reach Compliance Code - compliant unknown - unknown
ECCN code - EAR99 EAR99 - EAR99
Maximum clock frequency (fCLK) - 1 MHz 1 MHz - 1 MHz
JESD-30 code - R-PDSO-G8 X-XUUC-N - R-PDSO-G8
memory density - 65536 bit 65536 bit - 65536 bit
Memory IC Type - EEPROM EEPROM - EEPROM
memory width - 8 8 - 8
Number of functions - 1 1 - 1
word count - 8192 words 8192 words - 8192 words
character code - 8000 8000 - 8000
Operating mode - SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS
Maximum operating temperature - 85 °C 85 °C - 85 °C
Minimum operating temperature - -40 °C -40 °C - -40 °C
organize - 8KX8 8KX8 - 8KX8
Package body material - PLASTIC/EPOXY UNSPECIFIED - PLASTIC/EPOXY
encapsulated code - TSSOP DIE - SOP
Package shape - RECTANGULAR UNSPECIFIED - RECTANGULAR
Package form - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH UNCASED CHIP - SMALL OUTLINE
Parallel/Serial - SERIAL SERIAL - SERIAL
Certification status - Not Qualified Not Qualified - Not Qualified
Serial bus type - I2C I2C - I2C
Maximum supply voltage (Vsup) - 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) - 1.7 V 1.7 V - 1.7 V
surface mount - YES YES - YES
technology - CMOS CMOS - CMOS
Temperature level - INDUSTRIAL INDUSTRIAL - INDUSTRIAL
Terminal form - GULL WING NO LEAD - GULL WING
Terminal location - DUAL UPPER - DUAL
Maximum write cycle time (tWC) - 5 ms 5 ms - 5 ms

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