MX23L4100 datasheet, PDF - EEWORLD Datasheet

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MX23L4100: Description4M-BIT MASK ROM (8/16 BIT OUTPUT); File Size310KB，7 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx

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MX23L4100 Overview

4M-BIT MASK ROM (8/16 BIT OUTPUT)

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MX23L4100

4M-BIT MASK ROM (8/16 BIT OUTPUT)

FEATURES

• Bit organization

- 512K x 8 (byte mode)

- 256K x 16 (word mode)

• Fast access time

- Random access: 100ns

• Current

- Operating: 30mA

- Standby: 20uA

• Supply voltage

- 3.3V±10%

• Package

- 40 pin SOP (500 mil)

- 40 pin PDIP (600 mil)

ORDER INFORMATION

Part No.

MX23L4100MC-10

MX23L4100MC-12

MX23L4100MC-15

MX23L4100PC-10

MX23L4100PC-12

MX23L4100PC-15

Access Time

100ns

120ns

150ns

100ns

120ns

150ns

Package

40 pin SOP

40 pin PDIP

PIN CONFIGURATION

40 SOP

A17

VSS

D10

D11

A10

A11

A12

A13

A14

A15

A16

BYTE

VSS

D15/A-1

D14

D13

D12

VCC

PIN DESCRIPTION

Symbol

A0~A17

D0~D14

Byte

VCC

VSS

Pin Function

Address Inputs

Data Outputs

Chip Enable Input

Output Enable Input

Word/ Byte Mode Selection

Power Supply Pin

Ground Pin

No Connection

MX23L4100

MODE SELECTION

CE OE Byte D15/A-1 D0~D7 D8~D15 Mode

Power

Stand-by

Active

40 PDIP

A17

VSS

D10

D11

A10

A11

A12

A13

A14

A15

A16

BYTE

VSS

D15/A-1

D14

D13

D12

VCC

Output

Input

High Z

D0~D7

High Z

Byte

D0~D7 D8~D15 Word

P/N:PM0344

MX23L4100

REV. 1.4, JUL. 16, 2001

MX23L4100 Related Products

	MX23L4100	MX23L4100PC-15	MX23L4100MC-15	MX23L4100PC-12	MX23L4100PC-10	MX23L4100MC-10	MX23L4100MC-12
Description	4M-BIT MASK ROM (8/16 BIT OUTPUT)	4M-BIT MASK ROM (8/16 BIT OUTPUT)	4M-BIT MASK ROM (8/16 BIT OUTPUT)	4M-BIT MASK ROM (8/16 BIT OUTPUT)	4M-BIT MASK ROM (8/16 BIT OUTPUT)	4M-BIT MASK ROM (8/16 BIT OUTPUT)	4M-BIT MASK ROM (8/16 BIT OUTPUT)
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	-	Macronix	Macronix	Macronix	Macronix	Macronix	Macronix
Parts packaging code	-	DIP	SOIC	DIP	DIP	SOIC	SOIC
package instruction	-	DIP, DIP40,.6	SOP, SOP40,.56	DIP, DIP40,.6	DIP, DIP40,.6	SOP, SOP40,.56	SOP, SOP40,.56
Contacts	-	40	40	40	40	40	40
Reach Compliance Code	-	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	-	150 ns	150 ns	120 ns	100 ns	100 ns	120 ns
Other features	-	CAN ALSO BE CONFIGURED AS 512K X 8	CAN ALSO BE CONFIGURED AS 512K X 8	CAN ALSO BE CONFIGURED AS 512K X 8	CAN ALSO BE CONFIGURED AS 512K X 8	CAN ALSO BE CONFIGURED AS 512K X 8	CAN ALSO BE CONFIGURED AS 512K X 8
Spare memory width	-	8	8	8	8	8	8
JESD-30 code	-	R-PDIP-T40	R-PDSO-G40	R-PDIP-T40	R-PDIP-T40	R-PDSO-G40	R-PDSO-G40
JESD-609 code	-	e0	e0	e0	e0	e0	e0
length	-	51.94 mm	26.06 mm	51.94 mm	51.94 mm	26.06 mm	26.06 mm
memory density	-	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	-	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	-	16	16	16	16	16	16
Number of functions	-	1	1	1	1	1	1
Number of terminals	-	40	40	40	40	40	40
word count	-	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	-	256000	256000	256000	256000	256000	256000
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	-	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	DIP	SOP	DIP	DIP	SOP	SOP
Encapsulate equivalent code	-	DIP40,.6	SOP40,.56	DIP40,.6	DIP40,.6	SOP40,.56	SOP40,.56
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	4.9 mm	3 mm	4.9 mm	4.9 mm	3 mm	3 mm
Maximum standby current	-	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Maximum slew rate	-	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	-	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V
Minimum supply voltage (Vsup)	-	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	-	NO	YES	NO	NO	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	-	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	15.24 mm	11.3 mm	15.24 mm	15.24 mm	11.3 mm	11.3 mm
Base Number Matches	-	1	1	1	1	1	1

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