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SN74AUC16244ZQLR

Description
16-Bit Buffer/Driver With 3-State Outputs 56-BGA MICROSTAR JUNIOR -40 to 85
Categorylogic    logic   
File Size831KB,16 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74AUC16244ZQLR Overview

16-Bit Buffer/Driver With 3-State Outputs 56-BGA MICROSTAR JUNIOR -40 to 85

SN74AUC16244ZQLR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionVFBGA, BGA56,6X10,25
Contacts56
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time1 week
Control typeENABLE LOW
Counting directionUNIDIRECTIONAL
seriesAUC
JESD-30 codeR-PBGA-B56
JESD-609 codee1
length7 mm
Load capacitance (CL)15 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.009 A
Humidity sensitivity level1
Number of digits4
Number of functions4
Number of ports2
Number of terminals56
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA56,6X10,25
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply1.2/2.5 V
Maximum supply current (ICC)0.02 mA
Prop。Delay @ Nom-Su2.8 ns
propagation delay (tpd)2.8 ns
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
translateN/A
width4.5 mm

SN74AUC16244ZQLR Related Products

SN74AUC16244ZQLR SN74AUC16244DGGR SN74AUC16244DGVR SN74AUC16244GQLR
Description 16-Bit Buffer/Driver With 3-State Outputs 56-BGA MICROSTAR JUNIOR -40 to 85 16-Bit Buffer/Driver With 3-State Outputs 48-TSSOP -40 to 85 Buffer/Line Driver 16-CH Non-Inverting 3-ST CMOS 48-Pin TVSOP T/R Buffers & Line Drivers 16B Buffer/Driver With 3-State Outputs
Brand Name Texas Instruments Texas Instruments - Texas Instruments
Is it Rohs certified? conform to conform to - incompatible
Maker Texas Instruments Texas Instruments - Texas Instruments
Parts packaging code BGA TSSOP - BGA
package instruction VFBGA, BGA56,6X10,25 TSSOP, TSSOP48,.3,20 - VFBGA, BGA56,6X10,25
Contacts 56 48 - 56
Reach Compliance Code compli compli - _compli
Factory Lead Time 1 week 1 week - 1 week
Control type ENABLE LOW ENABLE LOW - ENABLE LOW
series AUC AUC - AUC
JESD-30 code R-PBGA-B56 R-PDSO-G48 - R-PBGA-B56
JESD-609 code e1 e4 - e0
length 7 mm 12.5 mm - 7 mm
Load capacitance (CL) 15 pF 15 pF - 15 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER - BUS DRIVER
MaximumI(ol) 0.009 A 0.009 A - 0.005 A
Humidity sensitivity level 1 1 - 1
Number of digits 4 4 - 4
Number of functions 4 4 - 4
Number of ports 2 2 - 2
Number of terminals 56 48 - 56
Maximum operating temperature 85 °C 85 °C - 85 °C
Minimum operating temperature -40 °C -40 °C - -40 °C
Output characteristics 3-STATE 3-STATE - 3-STATE
Output polarity TRUE TRUE - TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code VFBGA TSSOP - VFBGA
Encapsulate equivalent code BGA56,6X10,25 TSSOP48,.3,20 - BGA56,6X10,25
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TR TR - TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 - 240
power supply 1.2/2.5 V 1.2/2.5 V - 1.2/2.5 V
Prop。Delay @ Nom-Su 2.8 ns 2.8 ns - 2.8 ns
propagation delay (tpd) 2.8 ns 2.8 ns - 2.8 ns
Certification status Not Qualified Not Qualified - Not Qualified
Maximum seat height 1 mm 1.2 mm - 1 mm
Maximum supply voltage (Vsup) 2.7 V 2.7 V - 2.7 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V - 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V - 1.2 V
surface mount YES YES - YES
technology CMOS CMOS - CMOS
Temperature level INDUSTRIAL INDUSTRIAL - INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) - Tin/Lead (Sn/Pb)
Terminal form BALL GULL WING - BALL
Terminal pitch 0.65 mm 0.5 mm - 0.65 mm
Terminal location BOTTOM DUAL - BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
width 4.5 mm 6.1 mm - 4.5 mm

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