SN74AUC16244DGVR datasheet, PDF

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SN74AUC16244DGVR: DescriptionBuffer/Line Driver 16-CH Non-Inverting 3-ST CMOS 48-Pin TVSOP T/R; CategoryBuffer and line drives; File Size831KB，16 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74AUC16244DGVR Overview

Buffer/Line Driver 16-CH Non-Inverting 3-ST CMOS 48-Pin TVSOP T/R

SN74AUC16244DGVR Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.39.00.01
SVHC	Yes
Logic Family	AUC
Logic Function	Buffer/Line Driver
Number of Elements per Chip	4
Number of Channels per Chip	16
Number of Inputs per Chip	16
Number of Input Enables per Chip	0
Number of Outputs per Chip	16
Number of Output Enables per Chip	4 Low
Bus Hold	Yes
Polarity	Non-Inverting
Maximum Propagation Delay Time @ Maximum CL (ns)	1.8@1.8V to 2.5V
Absolute Propagation Delay Time (ns)	4.9
Process Technology	CMOS
Input Signal Type	Single-Ended
Output Type	3-State
Maximum Low Level Output Current (mA)	9
Maximum High Level Output Current (mA)	-9
Minimum Operating Supply Voltage (V)	0.8
Typical Operating Supply Voltage (V)	2.5\|1.8
Maximum Operating Supply Voltage (V)	2.7
Tolerant I/Os (V)	3.6
Maximum Quiescent Current (uA)	20
Propagation Delay Test Condition (pF)	30
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Commercial
Packaging	Tape and Reel
Standard Package Name	SOP
Pin Count	48
Supplier Package	TVSOP
Mounting	Surface Mount
Package Height	1.05(Max)
Package Length	9.8(Max)
Package Width	4.5(Max)
PCB changed	48
Lead Shape	Gull-wing

SN74AUC16244DGVR Related Products

	SN74AUC16244DGVR	SN74AUC16244ZQLR	SN74AUC16244DGGR	SN74AUC16244GQLR
Description	Buffer/Line Driver 16-CH Non-Inverting 3-ST CMOS 48-Pin TVSOP T/R	16-Bit Buffer/Driver With 3-State Outputs 56-BGA MICROSTAR JUNIOR -40 to 85	16-Bit Buffer/Driver With 3-State Outputs 48-TSSOP -40 to 85	Buffers & Line Drivers 16B Buffer/Driver With 3-State Outputs
Brand Name	-	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	-	conform to	conform to	incompatible
Maker	-	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	-	BGA	TSSOP	BGA
package instruction	-	VFBGA, BGA56,6X10,25	TSSOP, TSSOP48,.3,20	VFBGA, BGA56,6X10,25
Contacts	-	56	48	56
Reach Compliance Code	-	compli	compli	_compli
Factory Lead Time	-	1 week	1 week	1 week
Control type	-	ENABLE LOW	ENABLE LOW	ENABLE LOW
series	-	AUC	AUC	AUC
JESD-30 code	-	R-PBGA-B56	R-PDSO-G48	R-PBGA-B56
JESD-609 code	-	e1	e4	e0
length	-	7 mm	12.5 mm	7 mm
Load capacitance (CL)	-	15 pF	15 pF	15 pF
Logic integrated circuit type	-	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	-	0.009 A	0.009 A	0.005 A
Humidity sensitivity level	-	1	1	1
Number of digits	-	4	4	4
Number of functions	-	4	4	4
Number of ports	-	2	2	2
Number of terminals	-	56	48	56
Maximum operating temperature	-	85 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C
Output characteristics	-	3-STATE	3-STATE	3-STATE
Output polarity	-	TRUE	TRUE	TRUE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	VFBGA	TSSOP	VFBGA
Encapsulate equivalent code	-	BGA56,6X10,25	TSSOP48,.3,20	BGA56,6X10,25
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	-	TR	TR	TAPE AND REEL
Peak Reflow Temperature (Celsius)	-	260	260	240
power supply	-	1.2/2.5 V	1.2/2.5 V	1.2/2.5 V
Prop。Delay @ Nom-Su	-	2.8 ns	2.8 ns	2.8 ns
propagation delay (tpd)	-	2.8 ns	2.8 ns	2.8 ns
Certification status	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1 mm	1.2 mm	1 mm
Maximum supply voltage (Vsup)	-	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	-	0.8 V	0.8 V	0.8 V
Nominal supply voltage (Vsup)	-	1.2 V	1.2 V	1.2 V
surface mount	-	YES	YES	YES
technology	-	CMOS	CMOS	CMOS
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	-	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn/Pb)
Terminal form	-	BALL	GULL WING	BALL
Terminal pitch	-	0.65 mm	0.5 mm	0.65 mm
Terminal location	-	BOTTOM	DUAL	BOTTOM
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	4.5 mm	6.1 mm	4.5 mm

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