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DF33-2P-33DSA24

Description
Headers u0026 Wire Housings
CategoryThe connector   
File Size363KB,8 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
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DF33-2P-33DSA24 Overview

Headers u0026 Wire Housings

DF33-2P-33DSA24 Parametric

Parameter NameAttribute value
Product CategoryBoard to Board & Mezzanine Connectors
ManufacturerHirose
RoHSDetails
ProductHeaders
Factory Pack Quantity1
3.3mm Pitch Small Size Connectors for Internal Power Source
DF33C Series
Positive
Lock
Completely enclosed
locking system
Dec.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Protection from
shorts circuits
between adjacent
contacts
Fig.1
Features
1. 5 Amps capacity
When used with 20 AWG wire, this connector has a
maximum capacity of 5A.
(For rated current with other types of wires, please refer to
the table on the next page)
Keying for multiple use
Standard type (Resin: White)
2. Secure lock mechanism
Outer locking mechanism prevents accidental unmating due
to external shocks or drops. (Fig.1)
3. Incorrect mating prevention
Two different housings, a standard and R type, are available
to ensure mis-mating does not occur when using multiple
DF33C connectors on the same design. (Fig.2)
R type (Resin: Black)
4. Accurate board placement
Guide posts are used to help with board placement and
prevent incorrect mating to the PCB.
5. Supports resin sealing
Accepts resin sealing up to 6.5mm without affecting the
performance.
6. Short circuit prevention
The housing protects each contact by enclosing them in a “box”
which also makes each contact independent of each other.
This design prevents short circuits between adjacent contacts.
7. Excellent contact retention
A retainer is available to increase contact/cable retention and
to assure complete contact insertion. The retainer should
also be used when any mechanical stress cold be applied to
the cable.
* The image on the left show header (the board
dip side), the image on the right show the
socket (cabel side).
* This guide key position is indicated in position
facing the mating surface of the header.
Fig.2
8. Prevents solder cracking
To avoid solder crack, a glass-filled resin is used in the
header housing to decrease thermal shrinkage.
9. Easy mating operation
A clear tactile click is delivered upon the completion of the
mating process. This simplifies mating and increases work
efficiency, especially when operating in a noisy environment.
10. Glow Wire compliance (Compliant with IEC 60695-2-11)
2015.11t
1

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