Intel
®
RealSense™ Camera R200
Embedded Infrared Assisted Stereovision 3D
Imaging System with Color Camera
Product Datasheet
R200 Intel Production Part Number: MM#939143
†
(X) Numeric characters representing configuration or programmed firmware at manufacturing
June 2016
Revision 001
Document: 334616-001
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Contents
1
2
Description and Features .................................................................................... 9
Overview ......................................................................................................... 10
2.1
2.2
2.3
2.4
2.5
3
3.1
R200 Description ................................................................................... 10
R200 Camera Module ............................................................................. 11
Components .......................................................................................... 12
Storage and Operating Conditions ............................................................ 13
Handling Conditions ............................................................................... 13
Imaging ................................................................................................ 15
3.1.1
Color Imaging System ............................................................... 15
3.1.2
Infrared Imaging System ........................................................... 15
Infrared Light Projection ......................................................................... 16
Activity LED .......................................................................................... 17
Temperature Sensor............................................................................... 17
Camera Module Connector ...................................................................... 17
Other Components ................................................................................. 18
Embedded 3D Imaging System ................................................................ 19
Camera Video Stream Formats ................................................................ 19
Firmware Update (Windows* Only) .......................................................... 21
Infrared Camera Functions ...................................................................... 21
Color Camera Functions R200.................................................................. 21
USB Composite Device ........................................................................... 23
6.1.1
Device Endpoints ...................................................................... 23
Power States ......................................................................................... 24
6.2.1
Power Consumption .................................................................. 24
Integration Overview .............................................................................. 25
Module Stability ..................................................................................... 25
Camera Module Dimensions .................................................................... 27
Camera Module Mass.............................................................................. 27
Grounding ............................................................................................. 27
Motherboard Receptacle ......................................................................... 27
Shielding .............................................................................................. 28
Rear Cover Design Guidance ................................................................... 29
7.8.1
Transparent Cover Material ........................................................ 29
7.8.2
Gaskets ................................................................................... 30
7.8.3
Optical Isolation ....................................................................... 30
7.8.4
Dust Protection ........................................................................ 32
Component Specification ................................................................................... 15
3.2
3.3
3.4
3.5
3.6
4
4.1
4.2
5
5.1
5.2
5.3
6
6.1
6.2
7
Functional Specification ..................................................................................... 19
Firmware ......................................................................................................... 21
System Interoperability ..................................................................................... 23
System Integration ........................................................................................... 25
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
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7.9
7.10
Thermal Design Guidance ....................................................................... 32
7.9.1
Thermal Limits ......................................................................... 33
7.9.2
Thermal Management ............................................................... 34
Motherboard Routing Considerations ........................................................ 36
7.10.1 Cable TX to RX Crossover .......................................................... 37
7.10.2 Power Gate Circuit .................................................................... 37
7.10.3 Platform Specific Routing Guidance ............................................. 38
7.10.4 Motherboard Receptacle ............................................................ 38
7.10.5 High Speed Cable Assembly ....................................................... 39
8
9
Calibration ....................................................................................................... 41
System BIOS ................................................................................................... 42
9.1
9.2
UPC (USB Port Capabilities) ..................................................................... 42
PLD (Physical Device Location) ................................................................ 42
10
11
12
13
14
Packaging and Labeling ..................................................................................... 44
Regulatory Compliance R200.............................................................................. 45
R200 Interconnect Cable Drawings ..................................................................... 47
R200 Connector Drawings .................................................................................. 48
Schematic Checklist .......................................................................................... 50
4
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List of Figures
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1-1. R200 Module Assembly .......................................................................................... 9
2-1. Example Color Stream .......................................................................................... 10
2-2. Example Depth Stream ......................................................................................... 11
2-3. R200 Module Form Factor...................................................................................... 11
2-4. Component Locations (Front View) ......................................................................... 13
3-1. Infrared Projector ................................................................................................. 16
4-1. Active Stereo Technology Overview ........................................................................ 19
6-1. USB Composite Device Hardware ID ....................................................................... 23
7-1. Z Direction Module Flex Example ............................................................................ 25
7-2. Y Direction Module Flex Example ............................................................................ 26
7-3. Twist Module Flex Example .................................................................................... 26
7-4. Receptacle Ground Bar Motherboard Connections ..................................................... 28
7-5. Example IR Transmission of Acceptable Cover Material ............................................. 30
7-6. Example of Light Leakage Effects ........................................................................... 31
7-7. Example of Gasket Material Placement .................................................................... 32
7-8. Example of Separated Windows for Cover Material ................................................... 32
7-9. System Component Placement ............................................................................... 33
7-10. Module Thermal Probe Points ............................................................................... 33
7-11. Module Thermal Solution Chassis or Frame Mount .................................................. 35
7-12. Module Mounting Chassis or Frame ....................................................................... 35
7-13. Module Thermal Solution Rear Cover Mount ........................................................... 35
7-14. Module Mounting Rear Cover ............................................................................... 36
7-15. Example of Host Platform Motherboard Routing ...................................................... 37
7-16. Module Platform Power Gate Example ................................................................... 38
7-17. System Receptacle Properties .............................................................................. 38
9-1. UPC Return Package Values ................................................................................... 42
9-2. PLD System Design Considerations ......................................................................... 43
10-1. Camera Module Label .......................................................................................... 44
12-1. Cable Mechanical Drawing ................................................................................... 47
13-1. R200 Receptacle Mechanical Drawing .................................................................... 48
13-2. R200 Interconnect Plug Mechanical Drawing .......................................................... 49
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