Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 2)
Symbol
R
θJL
R
θJA
Value
16.2
88.3
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Value
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(I
F
= 1 A)
(I
F
= 2 A)
Maximum Instantaneous Reverse Current (at rated DC voltage)
1. Minimum Pad Size
2. 1 inch Pad Size
3. Pulse Test: Pulse Width
≤
250
µs,
Duty Cycle
≤
2%.
IF, INSTANTANEOUS FORWARD CURRENT (AMPS
Symbol
V
F
1.1
1.18
I
R
10
1.04
1.12
50
mA
T
J
= 25°C
T
J
= 100°C
Unit
Volts
10
100E−6
IR , REVERSE CURRENT (AMPS)
T
J
= 150°C
10E−6
T
J
= 150°C
1.0
1.0E−6
100°C
−40°C
0.1
100E−9
25°C
10E−9
1.0E−9
100°C
0.01
25°C
0.4
0.6
0.8
1.0
1.2
V
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0
50
100
150
200
250 300
350
V
R
, REVERSE VOLTAGE (VOLTS)
400
Figure 1. Typical Forward Voltage
Figure 2. Typical Reverse Current
http://onsemi.com
2
MRA4003T3 Series
IO, AVERAGE FORWARD CURRENT (AMPS)
PFO , AVERAGE POWER DISSIPATION (WATTS)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
20
80
40
60
100
120
T
L
, LEAD TEMPERATURE (°C)
140
160
Freq = 20 kHz
Square Wave
I
pk
/I
O
=
p
5
10
20
1.8
1.6
1.4
Square Wave
1.2
1.0
0.8
0.6
20
0.4
0.2
0
0
0.5
1.0
1.5
I
O
, AVERAGE FORWARD CURRENT (AMPS)
2.0
10
I
pk
/I
O
=
p
5
dc
dc
Figure 3. Current Derating per Leg
Figure 4. Forward Power Dissipation per Leg
100
T
J
= 25°C
C, CAPACITANCE (pF)
10
1
0
20
40 60 80 100 120 140 160
V
R
, REVERSE VOLTAGE (VOLTS)
180 200
Figure 5. Capacitance
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
1.0
R
qJL
(Min Pad Board)
R
qJA
(1 inch Pad Board)
0.1
0.01
R
qJL(t)
= R
qJL
* r(t)
0.001
10E−6
100E−6
1E−3
10E−3
100E−3
t, TIME (s)
1E+0
10E+0
100E+0
1E+3
10E+3
Figure 6. Thermal Response
http://onsemi.com
3
MRA4003T3 Series
PACKAGE DIMENSIONS
SMA
PLASTIC PACKAGE
CASE 403D−02
ISSUE A
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS
403D−02.
DIM
A
B
C
D
H
J
K
S
INCHES
MIN
MAX
0.160
0.180
0.090
0.115
0.075
0.095
0.050
0.064
0.002
0.006
0.006
0.016
0.030
0.060
0.190
0.220
MILLIMETERS
MIN
MAX
4.06
4.57
2.29
2.92
1.91
2.41
1.27
1.63
0.05
0.15
0.15
0.41
0.76
1.52
4.83
5.59
D
B
POLARITY INDICATOR OPTIONAL
AS NEEDED
C
K
J
H
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone:
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