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DS3174N-

Description
Telecom Interface ICs Quad DS3/E3 Single Chip Transceiver
Categorysemiconductor    Analog mixed-signal IC   
File Size2MB,234 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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DS3174N- Overview

Telecom Interface ICs Quad DS3/E3 Single Chip Transceiver

DS3174N- Parametric

Parameter NameAttribute value
Product CategoryTelecom Interface ICs
ManufacturerMaxim
RoHSDetails
ProductDS3/E3 Framer & Line Interface Units - LIUs
Maximum Operating Temperature+ 85 C
PackagingTray
Minimum Operating Temperature- 40 C
Number of Channels4 Channel
Factory Pack Quantity1
DS3171/DS3172/DS3173/DS3174
Single/Dual/Triple/Quad
DS3/E3 Single-Chip Transceivers
www.maxim-ic.com
GENERAL DESCRIPTION
The DS3171, DS3172, DS3173, and DS3174
(DS317x) combine a DS3/E3 framer(s) and LIU(s) to
interface to as many as four DS3/E3 physical copper
lines.
FUNCTIONAL DIAGRAM
APPLICATIONS
Access Concentrators
SONET/SDH ADM
and Muxes
PBXs
Digital Cross Connect
Test Equipment
Routers and Switches
Multiservice Access
Platform (MSAP)
Multiservice Protocol
Platform (MSPP)
PDH Multiplexer/
Demultiplexer
Integrated Access Device
(IAD)
DS3/E3
PORTS
DS3/
E3
LIU
DS3/E3
FRAMER/
FORMATTER
SYSTEM
BACKPLANE
DS317x
ORDERING INFORMATION
PART
DS3171
DS3171N
DS3172
DS3172N
DS3173
DS3173N
DS3174
DS3174N
TEMP RANGE
0°C to +70°C
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
PIN-PACKAGE
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
FEATURES
Single (DS3171), Dual (DS3172), Triple
(DS3173), or Quad (DS3174) Single-Chip
Transceiver for DS3 and E3
All Four Devices are Pin Compatible for Ease of
Port Density Migration in the Same Printed
Circuit Board Platform
Each Port Independently Configurable
Performs Receive Clock/Data Recovery and
Transmit Waveshaping for DS3 and E3
Jitter Attenuator can be Placed Either in the
Receive or Transmit Paths
Interfaces to 75Ω Coaxial Cable at Lengths Up to
380 meters, or 1246 feet (DS3) or 440 meters, or
1443 feet (E3)
Uses 1:2 Transformers on Both Tx and Rx
On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or
G.832) Framer(s)
Ports Independently Configurable for DS3, E3
Built-In HDLC Controllers with 256-Byte FIFOs
for the Insertion/Extraction of DS3 PMDL, G.751
Sn Bit, and G.832 NR/GC Bytes
On-Chip BERTs for PRBS and Repetitive Pattern
Generation, Detection, and Analysis
Large Performance-Monitoring Counters for
Accumulation Intervals of at Least 1 Second
Flexible Overhead Insertion/Extraction Ports for
DS3, E3 Framers
Note:
Add the “+” suffix for the lead-free package option.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here:
www.maxim-ic.com/errata.
1
REV: 110206
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