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DS1245AB-120

Description
NVRAM
Categorystorage    storage   
File Size205KB,10 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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DS1245AB-120 Overview

NVRAM

DS1245AB-120 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeDIP
package instruction0.740 INCH, EXTENDED MODULE, DIP-32
Contacts32
Reach Compliance Codenot_compliant
ECCN code3A991.B.2.A
Factory Lead Time1 week
Maximum access time120 ns
JESD-30 codeR-XDMA-T32
JESD-609 codee0
memory density1048576 bit
Memory IC TypeNON-VOLATILE SRAM MODULE
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Package body materialUNSPECIFIED
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum standby current0.005 A
Maximum slew rate0.085 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
19-5638; Rev 11/10
DS1245Y/AB
1024k Nonvolatile SRAM
www.maxim-ic.com
FEATURES
10 years minimum data retention in the
absence of external power
Data is automatically protected during power
loss
Replaces 128k x 8 volatile static RAM,
EEPROM or Flash memory
Unlimited write cycles
Low-power CMOS
Read and write access times of 70 ns
Lithium energy source is electrically
disconnected to retain freshness until power is
applied for the first time
Full
±10%
V
CC
operating range (DS1245Y)
Optional
±5%
V
CC
operating range
(DS1245AB)
Optional industrial temperature range of
-40°C to +85°C, designated IND
JEDEC standard 32-pin DIP package
PowerCap Module (PCM) package
- Directly surface-mountable module
- Replaceable snap-on PowerCap provides
lithium backup battery
- Standardized pinout for all nonvolatile
SRAM products
- Detachment feature on PowerCap allows
easy removal using a regular screwdriver
PIN ASSIGNMENT
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A15
NC
WE
A13
A8
A9
A11
OE
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
32-Pin Encapsulated Package
740-mil Extended
NC
A15
A16
NC
V
CC
WE
OE
CE
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
GND V
BAT
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
NC
NC
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
34-Pin PowerCap Module (PCM)
(Uses DS9034PC+ or DS9034PCI+ PowerCap)
PIN DESCRIPTION
A0 - A16
DQ0 - DQ7
CE
WE
OE
V
CC
GND
NC
- Address Inputs
- Data In/Data Out
- Chip Enable
- Write Enable
- Output Enable
- Power (+5V)
- Ground
- No Connect
1 of 10

DS1245AB-120 Related Products

DS1245AB-120 DS1245Y-100
Description NVRAM NVRAM 1024K SRAM Nonvolatile
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Maxim Maxim
Parts packaging code DIP DIP
package instruction 0.740 INCH, EXTENDED MODULE, DIP-32 0.740 INCH, EXTENDED MODULE, DIP-32
Contacts 32 32
Reach Compliance Code not_compliant not_compliant
ECCN code 3A991.B.2.A 3A991.B.2.A
Factory Lead Time 1 week 1 week
Maximum access time 120 ns 100 ns
JESD-30 code R-XDMA-T32 R-XDMA-T32
JESD-609 code e0 e0
memory density 1048576 bit 1048576 bit
Memory IC Type NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE
memory width 8 8
Number of functions 1 1
Number of terminals 32 32
word count 131072 words 131072 words
character code 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 128KX8 128KX8
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code DIP DIP
Encapsulate equivalent code DIP32,.6 DIP32,.6
Package shape RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 245
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum standby current 0.005 A 0.005 A
Maximum slew rate 0.085 mA 0.085 mA
Maximum supply voltage (Vsup) 5.25 V 5.5 V
Minimum supply voltage (Vsup) 4.75 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
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