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NTD24N06-001

Description
MOSFET 24V 60A N-Channel
Categorysemiconductor    Discrete semiconductor   
File Size78KB,8 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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NTD24N06-001 Overview

MOSFET 24V 60A N-Channel

NTD24N06-001 Parametric

Parameter NameAttribute value
Product CategoryMOSFET
ManufacturerON Semiconductor
RoHSNo
TechnologySi
Mounting StyleThrough Hole
Package / CaseTO-247-3
Number of Channels1 Channel
Transistor PolarityN-Channel
Vds - Drain-Source Breakdown Voltage60 V
Id - Continuous Drain Current24 A
Rds On - Drain-Source Resistance32 mOhms
Vgs - Gate-Source Voltage20 V
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 175 C
ConfigurationSingle
Channel ModeEnhancement
PackagingTube
Fall Time27 ns
Forward Transconductance - Min15 S
Pd - Power Dissipation62.5 W
Rise Time24 ns
Factory Pack Quantity75
Transistor Type1 N-Channel
TypeMOSFET
Typical Turn-Off Delay Time25 ns
Typical Turn-On Delay Time10 ns
Unit Weight0.139332 oz
NTD24N06
Power MOSFET
60 Volt, 24 Amp
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
http://onsemi.com
V
(BR)DSS
60 V
R
DS(on)
TYP
32 mW
N−Channel
I
D
MAX
24 A
Pb−Free Packages are Available
Typical Applications
D
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
G
S
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Rating
Drain−to−Source Voltage
Drain−to−Gate Voltage (R
GS
= 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t
p
v10
ms)
Drain Current
− Continuous @ T
A
= 25°C, T
J
= 150°C
− Continuous @ T
A
= 25°C, T
J
= 175°C
− Continuous @ T
A
= 100°C, T
J
= 175°C
− Single Pulse (t
p
v10
ms),
T
J
= 175°C
Total Power Dissipation @ T
A
= 25°C
Derate above 25°C
Total Power Dissipation @ T
A
= 25°C (Note 1)
Total Power Dissipation @ T
A
= 25°C (Note 2)
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
J
= 25°C
(V
DD
= 50 Vdc, V
GS
= 10 Vdc,
L = 1.0 mH, I
L
(pk) = 18 A, V
DS
= 60 Vdc)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
Symbol
V
DSS
V
DGR
V
GS
V
GS
I
D
I
D
I
D
I
DM
P
D
Value
60
60
"20
"30
24
27
19
80
62.5
0.42
1.88
1.36
−55 to
+175
162
Unit
Vdc
Vdc
Vdc
1 2
Adc
Adc
Adc
Apk
W
W/°C
W
W
°C
mJ
1
3
DPAK
CASE 369C
(Surface Mount)
STYLE 2
4
4
YWW
24
N06G
2
1
3
Drain
Gate
Source
4
Drain
YWW
24
N06G
3
DPAK
CASE 369D
(Straight Lead)
STYLE 2
Y
WW
24N06
G
2
1 2 3
Gate Drain Source
= Year
= Work Week
= Device Code
= Pb−Free Package
Publication Order Number:
NTD24N06/D
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
T
J
, T
stg
E
AS
°C/W
R
qJC
R
qJA
R
qJA
T
L
2.4
80
110
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.
2. When surface mounted to an FR−4 board using the minimum recommended
pad size.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2005
1
August, 2005 − Rev. 4
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