Freescale Semiconductor, Inc.
Data Sheet: Advance Information
Document Number: K22P49M100SF9
Rev. 6, 10/2015
Kinetis K22F 128KB Flash 49-pin
WLCSP: MK22FN128CAK10R
100 MHz Cortex-M4 Based Microcontroller with FPU
This K22 product family member is optimized for space-
constrained, cost-sensitive applications requiring low-power,
USB connectivity, and processing efficiency with a floating point
unit. This device shares the comprehensive enablement and
scalability of the Kinetis family.
This product offers:
• Run power consumption down to 120 μA/MHz and static
power consumption down to 2.6 μA with full state retention
and 6 μs wakeup. Lowest static mode down to 120 nA.
• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO
voltage regulator. USB FS device crystal-less functionality.
MK22FN128CAK10
49 WLCSP (AK)
2.915 x 3.142 x 0.564 Pitch 0.4 mm
Performance
• 100 MHz ARM Cortex-M4 core with DSP instructions
delivering 1.25 Dhrystone MIPS per MHz
Memories and memory interfaces
• 128 KB of embedded flash and 24 KB of RAM
• Serial programming interface (EzPort)
• Preprogrammed Kinetis flashloader for one-time, in-
system factory programming
Analog modules
• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)
• One 12-bit DAC (internal connection only)
• Two analog comparators (CMP) with 6-bit DAC
• Accurate internal voltage reference
Communication interfaces
• USB LS/FS OTG 2.0 with on-chip transceiver
(Device mode only)
• USB full-speed device crystal-less operation
System peripherals
• Two SPI modules
• Flexible low-power modes, multiple wake up sources
• Three UART modules and one low-power UART
• 4-channel DMA controller
• Two I2C: Support for up to 1 Mbps operation with
• Independent External and Software Watchdog monitor
maximum bus loading
• I2S module
Clocks
• Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz or
Timers
3-32 MHz
• One 8-channel general purpose PWM timer
• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz
• Two 2-channel general-purpose timers with
• Multi-purpose clock generator with FLL
quadrature decoder functionality
• Periodic interrupt timers
Security and integrity modules
• 16-bit low-power timer
• Hardware CRC module
• Real-time clock with independent power domain
• 128-bit unique identification (ID) number per chip
• Programmable delay block
• Flash access control to protect proprietary software
Operating Characteristics
Human-machine interface
• Voltage range (including flash writes): 1.71 to 3.6 V
• 35 general-purpose I/O (GPIO)
• Temperature range (ambient): -40 to 85°C
© 2014–2015 Freescale Semiconductor, Inc. All rights reserved.
Preliminary
Ordering Information
Part Number
Flash (KB)
MK22FN128CAK10R
1
128
Memory
SRAM (KB)
24
35
Number of GPIOs
1. This package is not yet available; however, it is included in a Package Your Way program for Kinetis MCUs. Please visit
www.Freescale.com/KPYW for more details.
Related Resources
Type
Selector Guide
Reference
Manual
Data Sheet
Chip Errata
Description
The Freescale Solution Advisor is a web-based tool that features interactive
application wizards and a dynamic product selector
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet is this document. It includes electrical characteristics and
signal connections.
The chip mask set Errata provides additional or corrective information for a
particular device mask set.
Document
KINETISKMCUSELGD
K22P121M100SF9RM
K22P49M100SF9
KINETIS_xN74M
1
1. To find the associated resource, go to freescale.com and perform a search using this term with the
x
replaced by the
revision of the device you are using.
Figure 1
shows the functional modules in the chip.
2
Freescale Semiconductor, Inc.
Kinetis K22F 128KB Flash 49-pin WLCSP: MK22FN128CAK10R, Rev. 6, 10/2015
Preliminary
ARM
®
Cortex™-M4
Core
Debug
interfaces
Interrupt
controller
DSP
System
DMA (4 ch)
Memories and Memory Interfaces
Program
flash
(128 KB)
Serial
programming
interface
(EzPort)
RAM
(24 KB)
Clocks
Frequency-
locked loop
Low/high
frequency
oscillators
FPU
Low-leakage
wakeup
Internal
and external
watchdogs
Internal
reference
clocks
and Integrity
CRC
Security
Analog
16-bit
SAR ADC x2
Comparator
with 6-bit DAC
x2
12-bit DAC
1
x1
High
performance
voltage ref
Timers
Timers
x1 (8ch)
x2 (2ch)
Programmable
Communication Interfaces
I
C
x2
UART
x3
LPUART
x1
2
Human-Machine
Interface (HMI)
Up to
35 GPIOs
I
S
2
Flash access
control
delay block
USB OTG
LS/FS
2
USB LS/FS
transceiver
Periodic
interrupt
timers
16-bit
low-power
timer
Independent
real-time
clock
SPI
x2
1. This device does not have the DAC0_OUT signal available; therefore, the DAC is only usable for internal connections.
2. This device does not have the USB_CLKIN signal available and therefore cannot support Host mode operation.
Figure 1. Functional block diagram
Kinetis K22F 128KB Flash 49-pin WLCSP: MK22FN128CAK10R, Rev. 6,
10/2015
Preliminary
3
Freescale Semiconductor, Inc.
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................6
2.2.1 Voltage and current operating requirements....... 6
2.2.2 LVD and POR operating requirements................7
2.2.3 Voltage and current operating behaviors.............8
2.2.4 Power mode transition operating behaviors........ 9
2.2.5 Power consumption operating behaviors............ 10
2.2.6 EMC radiated emissions operating behaviors..... 17
2.2.7 Designing with radiated emissions in mind..........18
2.2.8 Capacitance attributes.........................................18
2.3 Switching specifications...................................................18
2.3.1 Device clock specifications..................................18
2.3.2 General switching specifications......................... 19
2.4 Thermal specifications..................................................... 20
2.4.1 Thermal operating requirements......................... 20
2.4.2 Thermal attributes................................................20
3 Peripheral operating requirements and behaviors.................. 21
3.1 Core modules.................................................................. 21
3.1.1 SWD electricals .................................................. 21
3.1.2 JTAG electricals.................................................. 22
3.2 System modules.............................................................. 25
3.3 Clock modules................................................................. 25
3.3.1 MCG specifications..............................................25
3.3.2 IRC48M specifications.........................................27
3.3.3 Oscillator electrical specifications........................28
3.3.4 32 kHz oscillator electrical characteristics........... 30
3.4 Memories and memory interfaces................................... 31
3.4.1 Flash electrical specifications.............................. 31
3.4.2 EzPort switching specifications........................... 32
3.5 Security and integrity modules........................................ 33
3.6 Analog............................................................................. 33
3.6.1 ADC electrical specifications............................... 34
3.6.2 CMP and 6-bit DAC electrical specifications....... 38
3.6.3 12-bit DAC electrical characteristics....................40
3.6.4 Voltage reference electrical specifications.......... 43
3.7 Timers..............................................................................44
3.8 Communication interfaces............................................... 44
3.8.1 USB electrical specifications............................... 45
3.8.2 DSPI switching specifications (limited voltage
range).................................................................. 45
3.8.3
DSPI switching specifications (full voltage
range).................................................................. 47
3.8.4 Inter-Integrated Circuit Interface (I2C) timing...... 48
3.8.5 UART switching specifications............................ 50
3.8.6 I2S/SAI switching specifications.......................... 50
4 Dimensions............................................................................. 56
4.1 Obtaining package dimensions....................................... 56
5 Pinout...................................................................................... 57
5.1 K22 Signal Multiplexing and Pin Assignments.................57
5.2 Recommended connection for unused analog and
digital pins........................................................................59
5.3 K22 Pinouts..................................................................... 60
6 Part identification.....................................................................61
6.1 Description.......................................................................61
6.2 Format............................................................................. 61
6.3 Fields............................................................................... 61
6.4 Example...........................................................................62
6.5 49-pin WLCSP part marking............................................ 62
7 Revision History...................................................................... 63
4
Freescale Semiconductor, Inc.
Kinetis K22F 128KB Flash 49-pin WLCSP: MK22FN128CAK10R, Rev. 6, 10/2015
Preliminary
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
1
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105°C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
1.4 Voltage and current operating ratings
Kinetis K22F 128KB Flash 49-pin WLCSP: MK22FN128CAK10R, Rev. 6,
10/2015
Preliminary
5
Freescale Semiconductor, Inc.
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