|
MAX166BMJP |
MAX166DEWP |
MAX166DMJP |
| Description |
Analog to Digital Converters - ADC |
|
|
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
| Maker |
Maxim |
Maxim |
Maxim |
| Parts packaging code |
DIP |
SOIC |
DIP |
| package instruction |
DIP, DIP20,.3 |
SOP, SOP20,.4 |
DIP, DIP20,.3 |
| Contacts |
20 |
20 |
20 |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
| ECCN code |
3A001.A.2.C |
EAR99 |
3A001.A.2.C |
| Maximum analog input voltage |
2.58 V |
2.58 V |
2.58 V |
| Maximum conversion time |
15 µs |
15 µs |
15 µs |
| Converter type |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code |
R-GDIP-T20 |
R-PDSO-G20 |
R-GDIP-T20 |
| JESD-609 code |
e0 |
e0 |
e0 |
| Maximum linear error (EL) |
0.39% |
0.39% |
0.39% |
| Humidity sensitivity level |
1 |
1 |
1 |
| Number of analog input channels |
1 |
1 |
1 |
| Number of digits |
8 |
8 |
8 |
| Number of functions |
1 |
1 |
1 |
| Number of terminals |
20 |
20 |
20 |
| Maximum operating temperature |
125 °C |
85 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-40 °C |
-55 °C |
| Output bit code |
BINARY, OFFSET BINARY |
BINARY, OFFSET BINARY |
BINARY, OFFSET BINARY |
| Output format |
PARALLEL, 8 BITS |
PARALLEL, 8 BITS |
PARALLEL, 8 BITS |
| Package body material |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
| encapsulated code |
DIP |
SOP |
DIP |
| Encapsulate equivalent code |
DIP20,.3 |
SOP20,.4 |
DIP20,.3 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
245 |
245 |
245 |
| power supply |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Sampling rate |
0.2 MHz |
0.2 MHz |
0.2 MHz |
| Sample and hold/Track and hold |
TRACK |
TRACK |
TRACK |
| Maximum seat height |
5.08 mm |
2.65 mm |
5.08 mm |
| Maximum slew rate |
7 mA |
6 mA |
7 mA |
| Nominal supply voltage |
5 V |
5 V |
5 V |
| surface mount |
NO |
YES |
NO |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
INDUSTRIAL |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
1.27 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
7.62 mm |
7.5 mm |
7.62 mm |