[Training Camp_Advanced Class] Intelligent Internet of Things

# Smart IoT devices for controlling indoor furniture. #

Originally, I didn’t plan to make a finished product, because I had never been exposed to the Internet of Things before, and I didn’t understand chips, so it would be easy to overturn it, so I didn’t continue to work on it after I handed in the project link last time, and I didn’t make plans. However, yesterday’s live broadcast said that the assignments will not be judged until August 24th, which means there is still a week left. So I plan to make a finished product to improve my level, and also try to win awards ( after all, I don’t even know what it feels like to win awards ). So after the live broadcast, I worked all night, modified the schematic, and redrawed the PCB. Finally, at four o'clock in the morning the next day, I perfected the schematic and completed the PCB design, and placed an order on Jiali's order assistant. Attached is the order picture as proof.

August 19 This is the schematic diagram on Lichuang EDA

This is the front side of the PCB diagram on Lichuang EDA:

back:

I bought more than 100 components on August 19th (I had coupons, so I only spent less than 12 in the end, thank you Lichuang, hehe). There are some that I won’t use for this project, but may use them in the future. Arrived

Also, my PCB has been shipped, hehehe.

On August 22, the purchased components arrived, and so did the PCB. The logistics was really fast.

I originally wanted to record a video on how to solder patches, but then I got excited and accidentally finished soldering them all. Attached is a picture of the finished product

Experience

1. I used STC15F2K60S2 at the beginning, but I was afraid of overturning, so I changed to the STC15W4K56S4 in the example. I followed Song Gong in the hope that it would not overturn, although Song Gong also overturned every day, haha.
2. It was originally intended to be a development board, but the effect was not good and the layout was too messy, so the plan was abandoned and directly made into a dedicated PCB for the Internet of Things.