1620 rpm CFExpress-B type memory card

Introduction

As the title shows, BGA291 (1620) packaged NVME solid-state particles can be transferred through the project's base plate to make a CFExpress Type B memory card.

For example, Toshiba BG3 BG4, Hynix BC501 511 711, Intel (surface onboard solid state), etc. are all BGA291 packaged solid states.

At present, it has been tested and the official version has been iterated in several major versions. It has almost reached a stable and usable state. If you have any questions, please give us feedback.

The project remains the same. If you are interested in this project, you can join the group 824707444 to work on it together. Join the group and make a note to create the Kaiyuan Square CFE project.

The board is not very well made, so the bosses are complaining.

Please keep some moral integrity among the handouts and card dealers.

Precautions

Choose a thickness of 0.6mm for the board, preferably a immersed gold PCB. It is best to buy a feedback resistor with an accuracy of 1%.

You can buy steel mesh from Xubao, and you can buy CFExpress casing from Xubao. I also bought some in bulk from the manufacturer here, and the price is 25 sets, which is cheaper than 35 yuan per set from Xubao.

Version difference

It is currently known that Samsung, Hynix, Toshiba, and Intel have different power supply definitions, so each version will draw the board independently, and the update progress will be slower in spare time.

BOM diagram

This version does not have a graphical BOM table for the time being. You can click on the BOM suffix in the PCB to view it.

Actual picture (the version may be different, not necessarily the picture display of the current version)

The version shown in the picture is the 1.2 Toshiba base. The silk screen has not been changed yet. Let’s consider it the Toshiba version of the beta base.

Physical verification test chart

（写入速度慢是颗粒本身的锅，牙膏这个颗粒查了一下资料好像是MLC的，性能不是很强，这里作为测试颗粒使用）