RTL9210 NVME 2230 adapter board (hard disk box)

Commercial use strictly prohibited

The reading speed under USB3.2 GEN2 can reach 750MB/S, and the temperature can reach 70°C without a heat sink.

describe:

This hard disk box only supports 2230 nvme solid state. The area is about the size of two one-yuan coins. It adopts a stacked design without a shell. The components are mounted on one side. It is recommended to directly bundle the heat sink on both sides.

REV4.3 is very hot when reading and writing under USB3.2GEN2. It is easy to overheat and drop the disk without using a heat sink.

Versions before REV4 cannot be used at all (the wiring is too bad)

REV4 has been deleted. That version can only be used under USB3.0GEN1. REV4.3 reconstructs the USB wiring of REV4.

REV4.3 can run USB3.2 GEN2, but PCIE can only run x1, otherwise the disk will be lost (there is a problem with PCIE LANE1)

I highly suspect that the reason is that the wiring here is not routed properly.

Solution: Do not solder C41 and C42 directly and use it as PCIE3.0x1 hard disk box

The reason may also be that the board material is not specified as NP-155F (the material parameter used by the JLC impedance calculator is NP-155F) or the solder oil has penetrated into the PCB, or there is something wrong with the board (only one piece has been soldered for testing now)

I don’t plan to change it (it’s faster than 2258H anyway)

---------Precautions---------

Bridging options:

In REV4, only the two bridges tested with models RTL9210-VA-CG and RTL9210-VB-CG can be used. RTL9210B-CG and RTL9210BPD-CG have not been tested!

If you choose RTL9210B-CG, you need to solder R90 (added only in REV4.3)

Welding related:

The length of the ngff connector in the BOM is slightly longer than the soldering pad. When welding, you need to tin the soldering pad first and then use a heating table to solder (any Baobao one that costs more than ten yuan is fine), and drag soldering is not possible.

The QFN pad of RTL9210 does not expose copper on the side, so it still needs to be soldered with a heating table.

Add more flux and remember to wash the board with water after soldering. It is recommended to use solder paste. ngff make sure that the pins are all covered with tin.

If you choose JLCSMT, then I strongly recommend + 20 material replacement fee to weld type-c. Hand welding is very torturous, more difficult than ngff.

Board-making related:

It is recommended to choose 1.2 plate thickness. 1.0 plate thickness may cause the problem of the type-c interface pins being too long, which will make it impossible to use the heating table for welding.

Be sure to choose impedance, structure 7628

other:

• The BOM has tried its best to use basic library components. If JLCSMT is not used, try to purchase capacitors with a withstand voltage >= 10v.
• The voltage dividing resistor R2 should be 96k according to the standard output of 3.3v. In actual use, it is not far from 95.3k to 100k.
• The distance between the type-c header and ngff in REV4 is a little small, and the hard disk may be stuck (REV4.3 has been lengthened)
• The ngff connector uses m-key 3.2h
• Remember to update the firmware, SPI FLASH must be soldered
• IC does not recommend using dismantled products. If you want to use it, it is best to prepare some spare parts, otherwise there may be metaphysical problems.

Please see the attachment for firmware and reference schematics.