USB 3.0 master market "core" show: NS1081 - using patented technology and innovative architecture, it can be used as both a super-fast USB 3.0 U disk (Flash Drive) and a high-end USB3.0 card reader (Card Reader).
Beijing, China --- May 15, 2014 - Tianjin Ruifake Semiconductor Technology Co., Ltd., a fabless chip design company focusing on high-speed analog circuit technology and innovative I/O architecture, announced its new generation USB 3.0 master controller NS1081 series The chips (NS1081, NS1081S and NS1081C) have all obtained USB-IF (USB Implementers Forum) SuperSpeed USB product certification. The USB-IF SuperSpeed USB certification program provides standard testing specifications for product features and compatibility. Products that obtain certification will be included in the Integrators List and gain the right to use the USB-IF certification mark.
Tianjin Ruifake Semiconductor Technology Co., Ltd. is the first and so far the only semiconductor company in mainland China to have USB-IF SuperSpeed USB certification and mass-produce USB 3.0 master control chips. After its first USB 3.0 main control chip NS1066 and NS1068 series USB 3.0-SATA bridge controllers won the USB-IF official certification in February 2013, they have been mass-produced by major brands such as Lenovo and Toshiba. In September 2013, Ruifake Semiconductor launched the second USB 3.0 main control chip NS1081 series, which is used in USB 3.0 U disks and USB 3.0 card readers. It has been imported by domestic and foreign mainstream brand customers and major module OEMs. mass production. In February 2014, the NS1081 series of chips received official USB-IF certification. At the same time, NS1081 has also obtained Microsoft WHQL certification, ensuring its compatibility with various Microsoft operating systems.
The NS1081 series chips of Tianjin Ruifake Semiconductor Technology Co., Ltd. that have passed the USB-IF certification adopt the industry's first USB 3.0 multi-channel eMMC innovative architecture. Its innovative methods and high-efficiency RAID0 technology have been authorized by the Chinese invention patent and have applied for it. Multi-national patents. Based on this architecture, NS1081 can make a dual-channel 8-bit eMMC into a high-end USB 3.0 U disk. Its capacity and speed are doubled based on the original eMMC, and the read and write speed can be as high as 200MB/s. Different from traditional USB 3.0 U disks that directly use NAND Flash memory, the NS1081-controlled USB 3.0 U disk uses eMMC memory that is widely used in mobile devices such as smartphones and tablets. Due to the high performance and high reliability requirements of mobile devices, eMMC uses the industry's highest quality NAND Flash storage cores, which are mainly directly supplied by Samsung, Toshiba, SanDisk, Micron, Hynix and other original manufacturers, so as to provide the best quality and performance guaranteed. Therefore, the NS1081 USB 3.0 U disk solution far exceeds the traditional USB 3.0 U disk that directly uses NAND Flash memory in terms of reliability and performance, especially in small file reading and writing performance. Its solution is the most comprehensively competitive in the USB 3.0 industry. Benefiting from the explosive growth of today's smartphones and tablets, more memory manufacturers have increased their eMMC production capacity, and there is a huge supply of eMMC in the market. Moreover, NS1081 can fully support eMMC chips of different versions, processes, capacities, and read and write speeds launched by different memory manufacturers. There is no need to modify the main control firmware (Firmware) for different types of eMMC, which greatly improves the factory's engineering , production and testing efficiency, which increases the market competitiveness of this solution, further narrows the cost gap with USB 2.0 U disks, and accelerates the arrival of the USB 3.0 high-speed transmission era.
NS1081 can also be used as a multi-functional high-end USB 3.0 card reader: when it is used in a dual-SIM dual-drive letter reader, both drive letters can work in high-speed mode at the same time without affecting each other, and the two drive letters They can also copy each other at high speed, and the copy speed is far ahead of other competitors; when it is applied to a RAID0 card reader, the customer's two cards are superimposed and displayed as one drive letter, and its capacity and speed are doubled. NS1081 not only supports various SD cards, microSD cards (TF cards), MMC cards, etc., but also supports various large-capacity memory cards (up to 2TB), and perfectly supports high-speed memory cards such as SD3.0 UHS-I and eMMC4.5 HS200.
The NS1081 chip integrates a 5V to 1.2V high-efficiency DCDC circuit, a 5V to 3.3V and 1.8V LDO circuit, and is packaged in a 48 pin 6x6 QFN package. The cost structure is also very competitive. At the same time, in order to support entry-level USB 3.0 U disk applications, Ruifake Semiconductor has also launched a single-channel main control chip NS1081S, which uses a single eMMC to make a mid-range USB 3.0 U disk. NS1081S can share the same board and mode with NS1081, reducing the cost. Reduce the customer's inventory risks and costs. As a simplified version of the NS1081 card reader function, the main controller NS1081C is a chip specially optimized for the dual-card single drive letter/single card single drive letter function that has the highest demand on the market. It responds to market demand and also helps manufacturing Businessmen save costs.
As a provider of USB 3.0 "one-stop" chip solutions, Ruifake Semiconductor is also actively developing USB 3.1 master control chips with transmission speeds up to 10Gbit/s.
Rifa Semiconductor will continue to participate in "COMPUTEX TAIPEI 2014" from June 3 to 7, 2014 this year. At booth N0608 in the "SuperSpeed USB Community" exhibition area, the USB 3.0 master control series chips NS1081/NS1081S/NS1081C are grandly displayed, as well as the finished products of brand customers using this solution. At the same time, the latest brand customer finished products of the USB3.0-SATA2/3 bridge controller S1066/NS1068 series chips will be displayed. Ruifake Semiconductor sincerely invites system manufacturers, industry experts and the consumer public to visit, guide and negotiate.



The plate thickness is 1mm.
The lamination sequence is: Gerber_TopLayer.GTLGerber_InnerLayer1.G1Gerber_InnerLayer2.G2Gerber_BottomLayer.GBL
Choose the free one for the lamination structure.