The OM13496 supports the evaluation of small surface mount devices by simulating DIP packages by splitting the package leads to 100 mil center pins. OM13496 supports the following packages: QSOP16 (SOT519-1), XFBGA16 (SOT1354-1), XQFN16 (SOT1161-1) and TSSOP28 (SOT361-1).
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It is your responsibility to test the circuit yourself and determine its suitability for you. EEWorld will not be liable for direct, indirect, special, incidental, consequential or punitive damages arising from any cause or anything connected to any reference design used.
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