thermal imager

Project Source
: 【Ultra-Small】Infrared Thermal Imager 1 - JLCPCB EDA Open Source Hardware Platform (oshwhub.com).
I only modified the PCB appearance of this project. For details, please see the link above or the source project link: https://github.com/huxiangjs/hoozz_play.
Source Author Video: 【Implementing Mobile Phone Thermal Imaging Hoozz Play - MLX90640】 https://www.bilibili.com/video/BV1qh4y1v7mr.
Rendering and Display.
3D Structure
and Physical Display.
Due to a sudden malfunction of the 3D printer, the back cover was not properly made and looks a bit ugly. It is recommended to apply some B7000 glue.
Step 1: Direct Insertion and Connection
Function Demonstration.
Using my computer case as a reference.
Tutorial:
1. Material Preparation:


Solder the components according to the PCB (do not solder the CC2 resistor and header pins here), and burn the firmware into it. The pull-down resistor on the left side does not need to be soldered!
Inject the T-shaped nut into the 3D shell. You can use a soldering iron here, set the temperature to about 120℃, and carefully inject the nut into the 3D shell (care is required).
First, solder the pin headers to the Type-C board (the first PCB). This is crucial; adjust the pin header length so that they are just exposed on the second PCB (the one with the main controller and sensors) for easy installation of the back cover. See the pin header port in the second image. (If you don't understand, continue reading.)
Next, install the first board into the 3D housing. This requires a little skill. Then, tighten the screws.
The back cover has been slightly recessed where there is solder. You can apply a little B7000 glue to the edge of the back cover before screwing in the four screws.
Here, the back cover flew off, and the 3D printer collapsed!
Manufacturing Instructions:
    1. Select a board thickness of 0.8mm
    . 2. The board has already been assembled in the project.
    3. The thermal imaging sensor has been rotated at a slight angle; the initial design using the default angle resulted in a rotated image
    . 4. The CC2 resistor does not need to be soldered.
    5. Before inserting the phone, ensure that VCC and GND are not short-circuited (measured with a multimeter), and that the LDO input is approximately 5V and the LDO output is 3.3V (tested with a power bank and measured with a multimeter) to avoid potential damage to your property.
    6. Please be aware!