EEWORLDEEWORLDEEWORLD

Part Number

Search

MC9S08LL16CLH

Description
Automotive Connectors HSG ACC:WIRE SEAL GRN
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size857KB,46 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

MC9S08LL16CLH Online Shopping

Suppliers Part Number Price MOQ In stock  
MC9S08LL16CLH - - View Buy Now

MC9S08LL16CLH Overview

Automotive Connectors HSG ACC:WIRE SEAL GRN

MC9S08LL16CLH Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFP
package instructionROHS COMPLIANT, LQFP-64
Contacts64
Reach Compliance Codeunknown
ECCN code3A991.A.2
Has ADCYES
Address bus width
bit size8
maximum clock frequency20 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeS-PQFP-G64
JESD-609 codee3
length10 mm
Humidity sensitivity level3
Number of I/O lines38
Number of terminals64
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP64,.47SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply1.8/3.6 V
Certification statusNot Qualified
RAM (bytes)2048
rom(word)16384
ROM programmabilityFLASH
Maximum seat height1.6 mm
speed20 MHz
Maximum supply voltage3.6 V
Minimum supply voltage1.8 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width10 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Freescale Semiconductor
Addendum
Document Number: QFN_Addendum
Rev. 0, 07/2014
Addendum for New QFN
Package Migration
This addendum provides the changes to the 98A case outline numbers for products covered in this book.
Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
the table below for the old (gold wire) package versus the new (copper wire) package.
To view the new drawing, go to Freescale.com and search on the new 98A package number for your
device.
For more information about QFN package use, see EB806:
Electrical Connection Recommendations for
the Exposed Pad on QFN and DFN Packages.
© Freescale Semiconductor, Inc., 2014. All rights reserved.

MC9S08LL16CLH Related Products

MC9S08LL16CLH MC9S08LL16CLHR MC9S08LL16CGTR
Description Automotive Connectors HSG ACC:WIRE SEAL GRN 8-bit Microcontrollers - MCU BL Microcontrollers 8-bit Microcontrollers - MCU S08LL 8-bit MCU, S08 core, 16KB Flash, 20MHz, QFN 48
Is it lead-free? Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to
package instruction ROHS COMPLIANT, LQFP-64 ROHS COMPLIANT, LQFP-64 ROHS COMPLIANT, TQFN-48
Reach Compliance Code unknown compliant compliant
ECCN code 3A991.A.2 3A991.A.2 3A991.A.2
Has ADC YES YES YES
bit size 8 8 8
maximum clock frequency 20 MHz 20 MHz 20 MHz
DAC channel NO NO NO
DMA channel NO NO NO
JESD-30 code S-PQFP-G64 S-PQFP-G64 S-XQCC-N48
length 10 mm 10 mm 7 mm
Humidity sensitivity level 3 3 3
Number of I/O lines 38 38 31
Number of terminals 64 64 48
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
PWM channel YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code LFQFP LFQFP VQCCN
Package shape SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 260 260
rom(word) 16384 16384 16384
ROM programmability FLASH FLASH FLASH
Maximum seat height 1.6 mm 1.6 mm 1 mm
speed 20 MHz 20 MHz 20 MHz
Maximum supply voltage 3.6 V 3.6 V 3.6 V
Minimum supply voltage 1.8 V 1.8 V 1.8 V
Nominal supply voltage 3 V 3 V 3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD
Maximum time at peak reflow temperature 40 40 40
width 10 mm 10 mm 7 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Maker NXP NXP -
JESD-609 code e3 e3 -
Terminal surface Matte Tin (Sn) Matte Tin (Sn) -
Brand Name - Freescale Freescale

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1030  1185  865  2164  714  21  24  18  44  15 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号