EEWORLDEEWORLDEEWORLD

Part Number

Search

BA050LBSG

Description
Super-mini package regulator IC
CategoryPower/power management    The power supply circuit   
File Size104KB,8 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

BA050LBSG Overview

Super-mini package regulator IC

BA050LBSG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerROHM Semiconductor
Parts packaging codeSOIC
package instructionLSSOP, TSOP5/6,.11,37
Contacts5
Reach Compliance Codeunknow
ECCN codeEAR99
AdjustabilityFIXED
Nominal dropback voltage 10.09 V
Maximum absolute input voltage9 V
Maximum input voltage7 V
Minimum input voltage2.5 V
JESD-30 codeR-PDSO-G5
JESD-609 codee2
length2.9 mm
Maximum grid adjustment rate0.03%
Maximum load regulation0.08%
Number of functions1
Output times1
Number of terminals5
Maximum output current 10.05 A
Maximum output voltage 15.125 V
Minimum output voltage 14.875 V
Nominal output voltage 15 V
Package body materialPLASTIC/EPOXY
encapsulated codeLSSOP
Encapsulate equivalent codeTSOP5/6,.11,37
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Regulator typeFIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR
Maximum seat height1.35 mm
surface mountYES
technologyBIPOLAR
Terminal surfaceTIN COPPER
Terminal formGULL WING
Terminal pitch0.95 mm
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance2.5%
width1.6 mm
BAΟΟΟLBSG series
Regulator IC
Super-mini package regulator IC
BAΟΟΟ
ΟΟΟLBSG
series
ΟΟΟ
The BAΟΟΟLBSG (the “ΟΟΟ” indicates the output voltage value) is a low-saturation series regulator IC employing the
super-mini mold package of the SMP5 (2916 package). Equipped with a power-saving function that reduces current
consumption, it also offers outstanding ripple rejection and characteristics, and is ideal for cellular telephones and other.
!Applications
Residential / industrial device power supplies for cellular telephone such as the CDMA and GSM, and for other portable.
!Features
1) Internal output transistor (I
O
=150mA)
2) Internal temperature protection circuit
3) Power-saving function enables designs with low current consumption
4) High level of ripple rejection (R.R.=66dB)
5) SMP5 super-mini package enables space-saving designs
6) Low I / O voltage differential (90mV Typ. at I
O
=50mA)
!
Super-mini regulator lineup
Series
2.8
BA
"
Output voltage (V)
2.9
3.0
3.2
3.3
3.6
3.8
4.0
5.0
LBSG
" indicates the output voltage value. (Example : For 2.8V output, BA028LBSG)
!
Absolute maximum ratings
(Ta=25°C)
Parameter
Applid voltage
Power dissipation
Operating temperature
Storage temperature
Symbol
Vcc
Pd
Topr
Tstg
Limits
9
170
−40∼+85
−55∼+125
Unit
V
mW
°C
°C
Reduced by 1.7mW for each increase in Ta of 1˚C over 25˚C
!
Recommended operating conditions
(Ta=25°C)
Parameter
Operating power supply
voltage
Symbol
Vcc (input)
Limits
2.5∼7.0
Unit
V

BA050LBSG Related Products

BA050LBSG BA029LBSG BA030LBSG BA032LBSG BA033LBSG BA036LBSG BA038LBSG BA040LBSG BAOOOLBSG BA028LBSG
Description Super-mini package regulator IC Super-mini package regulator IC Super-mini package regulator IC Super-mini package regulator IC Super-mini package regulator IC Super-mini package regulator IC Super-mini package regulator IC Super-mini package regulator IC Super-mini package regulator IC Super-mini package regulator IC
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to - conform to
Maker ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor - -
Parts packaging code SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC - SOIC
package instruction LSSOP, TSOP5/6,.11,37 SUPER MINI PACKAGE-5 LSSOP, TSOP5/6,.11,37 LSSOP, TSOP5/6,.11,37 LSSOP, TSOP5/6,.11,37 SUPER MINI PACKAGE-5 LSSOP, TSOP5/6,.11,37 LSSOP, TSOP5/6,.11,37 - LSSOP, TSOP5/6,.11,37
Contacts 5 5 5 5 5 5 5 5 - 5
Reach Compliance Code unknow unknown unknow unknow unknow unknown unknow unknow - unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 - EAR99
Adjustability FIXED FIXED FIXED FIXED FIXED FIXED FIXED FIXED - FIXED
Nominal dropback voltage 1 0.09 V 0.09 V 0.09 V 0.09 V 0.09 V 0.09 V 0.09 V 0.09 V - 0.09 V
Maximum absolute input voltage 9 V 9 V 9 V 9 V 9 V 9 V 9 V 9 V - 9 V
Maximum input voltage 7 V 7 V 7 V 7 V 7 V 7 V 7 V 7 V - 7 V
Minimum input voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V - 2.5 V
JESD-30 code R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 - R-PDSO-G5
JESD-609 code e2 e2 e2 e2 e2 e2 e2 e2 - e2
length 2.9 mm 2.9 mm 2.9 mm 2.9 mm 2.9 mm 2.9 mm 2.9 mm 2.9 mm - 2.9 mm
Maximum grid adjustment rate 0.03% 0.03% 0.03% 0.03% 0.03% 0.03% 0.03% 0.03% - 0.03%
Maximum load regulation 0.08% 0.08% 0.08% 0.08% 0.08% 0.08% 0.08% 0.08% - 0.08%
Number of functions 1 1 1 1 1 1 1 1 - 1
Output times 1 1 1 1 1 1 1 1 - 1
Number of terminals 5 5 5 5 5 5 5 5 - 5
Maximum output current 1 0.05 A 0.05 A 0.05 A 0.05 A 0.05 A 0.05 A 0.05 A 0.05 A - 0.05 A
Maximum output voltage 1 5.125 V 2.973 V 3.075 V 3.28 V 3.382 V 3.69 V 3.895 V 4.1 V - 2.87 V
Minimum output voltage 1 4.875 V 2.828 V 2.925 V 3.12 V 3.218 V 3.51 V 3.705 V 3.9 V - 2.73 V
Nominal output voltage 1 5 V 2.9 V 3 V 3.2 V 3.3 V 3.6 V 3.8 V 4 V - 2.8 V
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code LSSOP LSSOP LSSOP LSSOP LSSOP LSSOP LSSOP LSSOP - LSSOP
Encapsulate equivalent code TSOP5/6,.11,37 TSOP5/6,.11,37 TSOP5/6,.11,37 TSOP5/6,.11,37 TSOP5/6,.11,37 TSOP5/6,.11,37 TSOP5/6,.11,37 TSOP5/6,.11,37 - TSOP5/6,.11,37
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260 - 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
Regulator type FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR - FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR
Maximum seat height 1.35 mm 1.35 mm 1.35 mm 1.35 mm 1.35 mm 1.35 mm 1.35 mm 1.35 mm - 1.35 mm
surface mount YES YES YES YES YES YES YES YES - YES
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR CMOS BIPOLAR BIPOLAR - BIPOLAR
Terminal surface TIN COPPER TIN COPPER TIN COPPER TIN COPPER TIN COPPER TIN COPPER TIN COPPER TIN COPPER - TIN COPPER
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING - GULL WING
Terminal pitch 0.95 mm 0.95 mm 0.95 mm 0.95 mm 0.95 mm 0.95 mm 0.95 mm 0.95 mm - 0.95 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL - DUAL
Maximum time at peak reflow temperature 10 10 10 10 10 10 10 10 - 10
Maximum voltage tolerance 2.5% 2.5% 2.5% 2.5% 2.5% 2.5% 2.5% 2.5% - 2.5%
width 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm - 1.6 mm
What is the difference between the ARM platform and the i386 general platform boundary alignment? How does the compiler align the stack variables in a general function?
What is the difference between byte alignment on ARM platform and i386 general platform? How does the compiler align the stack variables in general functions? I know that byte alignment is not only re...
ldr111 ARM Technology
[Award Ceremony] List of winners of the second phase of the DSP-Sitara premium course!
[b][align=left][size=14px][color=#000]Event details:[/color][/size][/align][color=#06699][size=14px][url=https://bbs.eeworld.com.cn/thread-355606-1-1.html]https://bbs.eeworld.com.cn/thread-358736-1-1....
EEWORLD社区 DSP and ARM Processors
【Digging Power】Application of TI power chips in microsystems
For this thing I made, it is very important that the PCB area must be small, the smaller the better. After searching for a long time, I chose TI's power chip TPS63000 series products to generate 3.3V,...
chenzhufly Analogue and Mixed Signal
NEC MCU - CC78K0 C Compiler Operation
[i=s]This post was last edited by paulhyde on 2014-9-15 08:58[/i]...
fish001 Electronics Design Contest
Driver does not support code coverage How to solve
When downloading a program with the cc2430DK (v2.1) emulator, the error "Driver does not support code coverage" always appears. How to solve it?...
zyhthinker RF/Wirelessly
EEWORLD University ---- Zhou Ligong Verilog
Zhou Ligong Verilog : https://training.eeworld.com.cn/course/3952...
老白菜 FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1011  617  1938  545  2550  21  13  40  11  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号