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MCZ33889BEGR2

Description
Telecom Interface ICs SBC-LITE-LS-CAN
CategoryWireless rf/communication    Telecom circuit   
File Size538KB,56 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MCZ33889BEGR2 Overview

Telecom Interface ICs SBC-LITE-LS-CAN

MCZ33889BEGR2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOIC
package instructionSOP, SOP28,.4
Contacts28
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
data rate125 Mbps
JESD-30 codeR-PDSO-G28
JESD-609 codee3
length17.925 mm
Humidity sensitivity level3
Number of functions1
Number of terminals28
Transceiver quantity1
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
power supply5.5/18 V
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum slew rate0.018 mA
Nominal supply voltage13.5 V
surface mountYES
Telecom integrated circuit typesINTERFACE CIRCUIT
Temperature levelAUTOMOTIVE
Terminal surfaceTIN
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width7.5 mm
Base Number Matches1
NXP Semiconductors
Technical Data
Document Number: MC33889
Rev. 15.0, 8/2016
System basis chip (SBC) with low
speed fault tolerant CAN interface
The 33889 is an SBC having a fully protected, fixed 5.0 V low drop-out
regulator, with current limit, overtemperature prewarning and reset. An SBC
device is a monolithic IC combining many functions repeatedly found in
standard microcontroller-based systems, e.g., protection, diagnostics,
communication, power, etc.
An output drive with sense input is also provided to implement a second 5.0 V
regulator using an external PNP. The 33889 has Normal, Standby, Stop and
Sleep modes; an internally switched high-side power supply output with two
wake-up inputs; programmable timeout or window watchdog, Interrupt, Reset,
serial peripheral interface (SPI) input control, and a low-speed fault tolerant
CAN transceiver, compatible with CAN 2.0 A and B protocols for module-to-
module communications. The combination is an economical solution for power
management, high-speed communication, and control in MCU-based systems.
This device is powered by SMARTMOS technology.
Features
• VDD1: 5.0 V low drop voltage regulator, current limitation, overtemperature
detection, monitoring and reset function with total current capability 200 mA
• V2: tracking function of VDD1 regulator; control circuitry for external bipolar
ballast transistor for high flexibility in choice of peripheral voltage and current
supply
• Four operational modes
• Low standby current consumption in Stop and Sleep modes
• Built-in low speed 125 kbps fault tolerant CAN physical interface.
• External high voltage wake-up input, associated with HS1 V
BAT
switch
• 150 mA output current capability for HS1 V
BAT
switch allowing drive of
external switches pull-up resistors or relays
33889
SYSTEM BASIS CHIP
EG SUFFIX (PB-FREE)
PLASTIC PACKAGE
98ASB42345B
28-PIN SOICW
ORDERING INFORMATION
Device
(Add R2 Suffix for
Tape and Reel)
MC33889BPEG
*MC33889DPEG
Temperature
Range (T
A
)
-40 to 125 °C
Package
28 SOICW
*
Recommended for new designs
33889
5.0 V
VDD1
GND
VSUP
V2CTRL
V2
HS1
L0
L1
WDOG
RTH
CANH
CANL
RTL
VPWR
V2
MCU
CS
SCLK
MOSI
MISO
SPI
RST
INT
CS
SCLK
MOSI
MISO
TXD
RXD
Local Module Supply
Wake-Up Inputs
Safe Circuits
Twisted
Pair
CAN Bus
Figure 1. 33889 simplified application diagram
© 2016 NXP B.V.

MCZ33889BEGR2 Related Products

MCZ33889BEGR2 MC33889BDW MC33889DPEGR2 MC33889BPEGR2 MC33889DDW MC33889DPEG
Description Telecom Interface ICs SBC-LITE-LS-CAN Telecom Interface ICs SBC LIGHT PASS 3.3 CAN Interface IC SBC-LITE-LS-CAN Interface - Specialized SBC-LITE-LS-CAN Telecom Interface ICs SBC LIGHT REV D CAN Interface IC SBC-LITE-LS-CAN
Is it Rohs certified? conform to incompatible conform to conform to incompatible conform to
Maker NXP NXP NXP NXP NXP NXP
package instruction SOP, SOP28,.4 PLASTIC, MS-013AE, SOIC-8 18 X 7.50 MM, 1.27 MM PITCH, ROHS COMPLIANT, MS-013AE, SOIC-28 18 X 7.50 MM, 1.27 MM PITCH, ROHS COMPLIANT, MS-013AE, SOIC-28 SOP, SOP28,.4 18 X 7.50 MM, 1.27 MM PITCH, ROHS COMPLIANT, MS-013AE, SOIC-28
Reach Compliance Code compliant unknown compliant compliant unknown compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
data rate 125 Mbps 125 Mbps 125 Mbps 125 Mbps 125 Mbps 125 Mbps
JESD-30 code R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28
JESD-609 code e3 e0 e3 e3 e0 e3
length 17.925 mm 17.925 mm 17.925 mm 17.925 mm 17.925 mm 17.925 mm
Humidity sensitivity level 3 1 3 3 1 3
Number of functions 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28
Transceiver quantity 1 1 1 1 1 1
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP SOP SOP SOP
Encapsulate equivalent code SOP28,.4 SOP28,.4 SOP28,.4 SOP28,.4 SOP28,.4 SOP28,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 240 260 260 240 260
power supply 5.5/18 V 5.5/18 V 5.5/18 V 5.5/18 V 5.5/18 V 5.5/18 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm
Maximum slew rate 0.018 mA 0.018 mA 0.045 mA 0.045 mA 0.018 mA 0.045 mA
Nominal supply voltage 13.5 V 13.5 V 13.5 V 13.5 V 13.5 V 13.5 V
surface mount YES YES YES YES YES YES
Telecom integrated circuit types INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface TIN Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 30 40 40 30 40
width 7.5 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm
Base Number Matches 1 1 1 1 1 1
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