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HCF4008B

Description
4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT
File Size277KB,13 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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HCF4008B Overview

4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT

HCC/HCF4008B
4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT
.
.
.
.
.
.
.
4 SUM OUTPUTS PLUS PARALLEL LOOK-
AHERD CARRY-OUTPUT
HIGH-SPEED OPERATION-SUM IN-TO-SUM
OUT 160ns (typ.) : CARRY IN-TO-CARRY OUT
50ns (typ.) AT V
DD
= 10V, C
L
= 50pF
QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
INPUT CURRENT OF 100nA AT 18V AND 25°C
FOR HCC DEVICE
100% TESTED FOR QUIESCENT CURRENT
5V, 10V, AND 15V PARAMETRIC RATING
MEETS ALL REQUIREMENTS OF JEDEC TEN-
TATIVE STANDARD N° 13A, ”STANDARD SPE-
CIFICATIONS FOR DESCRIPTION OF ”B”
SERIES CMOS DEVICES”
EY
(Plastic Package)
F
(Ceramic Frit Seal Package)
M1
(Micro Package)
C1
(Plastic Chip Carrier)
ORDER CODES :
HCC4008BF
HCF4008BM1
HCF4008BEY
HCF4008BC1
PIN CONNECTIONS
DESCRIPTION
The
HCC4008B
(extended temperature range) and
HCF4008B
(intermediate temperature range) are
monolithic integrated circuits, available in 16-lead
dual in-line plastic or ceramic package and plastic
micropackage.
The
HCC/HCF4008B
types consist of four full adder
stages with fast look ahead carry provision from
stage to stage. Circuitry is included to provide a fast
”parallel-carry-out” to permit high-speed operation
in arithmetic sections using several HCC/HCF
4008B’s.
HCC/HCF4008B
inputs include the four sets of bits
to be added, A
1
to A
4
and B
1
to B
4
, in addition to the
”Carry In” bit from a previous section.
HCC/HCF4008B
outputs include the four sum bits,
S
1
to S
4
. In addition to the high speed ”parallel-carry-
out” which may be utilized at a succeeding
HCC/HCF4008B
section.
June 1989
1/13

HCF4008B Related Products

HCF4008B HCC4008BF HCF4008BC1 HCF4008BEY HCF4008BM1
Description 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT
Is it Rohs certified? - incompatible conform to conform to conform to
Maker - STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code - DIP QLCC DIP SOIC
package instruction - FRIT SEALED, CERAMIC, DIP-16 PLASTIC, LCC-20 PLASTIC, DIP-16 SOP-16
Contacts - 16 20 16 16
Reach Compliance Code - not_compliant compliant compliant compliant
Other features - FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
series - 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000
JESD-30 code - R-GDIP-T16 S-PQCC-J20 R-PDIP-T16 R-PDSO-G16
JESD-609 code - e0 e3 e3 e4
Load capacitance (CL) - 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type - ADDER/SUBTRACTOR ADDER/SUBTRACTOR ADDER/SUBTRACTOR ADDER/SUBTRACTOR
Number of digits - 4 4 4 4
Number of functions - 1 1 1 1
Number of terminals - 16 20 16 16
Maximum operating temperature - 125 °C 85 °C 125 °C 125 °C
Minimum operating temperature - -55 °C -40 °C -55 °C -55 °C
Package body material - CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - DIP QCCJ DIP SOP
Encapsulate equivalent code - DIP16,.3 LDCC20,.4SQ DIP16,.3 SOP16,.25
Package shape - RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form - IN-LINE CHIP CARRIER IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
power supply - 3/18 V 3/15 V 3/15 V 3/15 V
propagation delay (tpd) - 800 ns 800 ns 800 ns 800 ns
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 5.08 mm 4.57 mm 5.1 mm 1.75 mm
Maximum supply voltage (Vsup) - 18 V 15 V 20 V 20 V
Minimum supply voltage (Vsup) - 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V 5 V
surface mount - NO YES NO YES
technology - CMOS CMOS CMOS CMOS
Temperature level - MILITARY INDUSTRIAL MILITARY MILITARY
Terminal surface - Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form - THROUGH-HOLE J BEND THROUGH-HOLE GULL WING
Terminal pitch - 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location - DUAL QUAD DUAL DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
width - 7.62 mm 8.9662 mm 7.62 mm 3.9 mm
Base Number Matches - 1 1 1 1
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