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HCF4008BEY

Description
4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT
Categorylogic    logic   
File Size277KB,13 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

HCF4008BEY Overview

4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT

HCF4008BEY Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSTMicroelectronics
Parts packaging codeDIP
package instructionPLASTIC, DIP-16
Contacts16
Reach Compliance Codecompliant
Other featuresFULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
series4000/14000/40000
JESD-30 codeR-PDIP-T16
JESD-609 codee3
Load capacitance (CL)50 pF
Logic integrated circuit typeADDER/SUBTRACTOR
Number of digits4
Number of functions1
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/15 V
propagation delay (tpd)800 ns
Certification statusNot Qualified
Maximum seat height5.1 mm
Maximum supply voltage (Vsup)20 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceMatte Tin (Sn)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1
HCC/HCF4008B
4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT
.
.
.
.
.
.
.
4 SUM OUTPUTS PLUS PARALLEL LOOK-
AHERD CARRY-OUTPUT
HIGH-SPEED OPERATION-SUM IN-TO-SUM
OUT 160ns (typ.) : CARRY IN-TO-CARRY OUT
50ns (typ.) AT V
DD
= 10V, C
L
= 50pF
QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
INPUT CURRENT OF 100nA AT 18V AND 25°C
FOR HCC DEVICE
100% TESTED FOR QUIESCENT CURRENT
5V, 10V, AND 15V PARAMETRIC RATING
MEETS ALL REQUIREMENTS OF JEDEC TEN-
TATIVE STANDARD N° 13A, ”STANDARD SPE-
CIFICATIONS FOR DESCRIPTION OF ”B”
SERIES CMOS DEVICES”
EY
(Plastic Package)
F
(Ceramic Frit Seal Package)
M1
(Micro Package)
C1
(Plastic Chip Carrier)
ORDER CODES :
HCC4008BF
HCF4008BM1
HCF4008BEY
HCF4008BC1
PIN CONNECTIONS
DESCRIPTION
The
HCC4008B
(extended temperature range) and
HCF4008B
(intermediate temperature range) are
monolithic integrated circuits, available in 16-lead
dual in-line plastic or ceramic package and plastic
micropackage.
The
HCC/HCF4008B
types consist of four full adder
stages with fast look ahead carry provision from
stage to stage. Circuitry is included to provide a fast
”parallel-carry-out” to permit high-speed operation
in arithmetic sections using several HCC/HCF
4008B’s.
HCC/HCF4008B
inputs include the four sets of bits
to be added, A
1
to A
4
and B
1
to B
4
, in addition to the
”Carry In” bit from a previous section.
HCC/HCF4008B
outputs include the four sum bits,
S
1
to S
4
. In addition to the high speed ”parallel-carry-
out” which may be utilized at a succeeding
HCC/HCF4008B
section.
June 1989
1/13

HCF4008BEY Related Products

HCF4008BEY HCC4008BF HCF4008B HCF4008BC1 HCF4008BM1
Description 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT
Is it Rohs certified? conform to incompatible - conform to conform to
Maker STMicroelectronics STMicroelectronics - STMicroelectronics STMicroelectronics
Parts packaging code DIP DIP - QLCC SOIC
package instruction PLASTIC, DIP-16 FRIT SEALED, CERAMIC, DIP-16 - PLASTIC, LCC-20 SOP-16
Contacts 16 16 - 20 16
Reach Compliance Code compliant not_compliant - compliant compliant
Other features FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING - FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
series 4000/14000/40000 4000/14000/40000 - 4000/14000/40000 4000/14000/40000
JESD-30 code R-PDIP-T16 R-GDIP-T16 - S-PQCC-J20 R-PDSO-G16
JESD-609 code e3 e0 - e3 e4
Load capacitance (CL) 50 pF 50 pF - 50 pF 50 pF
Logic integrated circuit type ADDER/SUBTRACTOR ADDER/SUBTRACTOR - ADDER/SUBTRACTOR ADDER/SUBTRACTOR
Number of digits 4 4 - 4 4
Number of functions 1 1 - 1 1
Number of terminals 16 16 - 20 16
Maximum operating temperature 125 °C 125 °C - 85 °C 125 °C
Minimum operating temperature -55 °C -55 °C - -40 °C -55 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP - QCCJ SOP
Encapsulate equivalent code DIP16,.3 DIP16,.3 - LDCC20,.4SQ SOP16,.25
Package shape RECTANGULAR RECTANGULAR - SQUARE RECTANGULAR
Package form IN-LINE IN-LINE - CHIP CARRIER SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED -
power supply 3/15 V 3/18 V - 3/15 V 3/15 V
propagation delay (tpd) 800 ns 800 ns - 800 ns 800 ns
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 5.1 mm 5.08 mm - 4.57 mm 1.75 mm
Maximum supply voltage (Vsup) 20 V 18 V - 15 V 20 V
Minimum supply voltage (Vsup) 3 V 3 V - 3 V 3 V
Nominal supply voltage (Vsup) 5 V 5 V - 5 V 5 V
surface mount NO NO - YES YES
technology CMOS CMOS - CMOS CMOS
Temperature level MILITARY MILITARY - INDUSTRIAL MILITARY
Terminal surface Matte Tin (Sn) Tin/Lead (Sn/Pb) - Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form THROUGH-HOLE THROUGH-HOLE - J BEND GULL WING
Terminal pitch 2.54 mm 2.54 mm - 1.27 mm 1.27 mm
Terminal location DUAL DUAL - QUAD DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED -
width 7.62 mm 7.62 mm - 8.9662 mm 3.9 mm
Base Number Matches 1 1 - 1 1
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