803-91-100-10-004000 datasheet, PDF

Datasheet> All Categories > The connector> The connector> 803-91-100-10-004000

803-91-100-10-004000: DescriptionHeaders u0026 Wire Housings; CategoryThe connector The connector; File Size125KB，3 Pages; ManufacturerMill-Max; Websitehttps://www.mill-max.com

Download Datasheet Parametric View All

803-91-100-10-004000 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	803-91-100-10-004000	-	-	View	Buy Now

803-91-100-10-004000 Overview

Headers u0026 Wire Housings

803-91-100-10-004000 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Mill-Max
Reach Compliance Code	compliant
ECCN code	EAR99
Connector type	BOARD CONNECTOR
Contact to complete cooperation	GOLD (10) OVER NICKEL (100)
Contact completed and terminated	TIN LEAD (200) OVER NICKEL (150)
Contact material	BERYLLIUM COPPER
JESD-609 code	e0
Manufacturer's serial number	803
Base Number Matches	1

Preview

Download Datasheet

View All

Product Number: 803-93-020-10-001000

Description:

Interconnect Socket

Standard Solder Tail Socket

Accepts .025"- .037" (0,635 - 0,94

mm)dia leads

Double Row

Through Hole

Plating Code:

Shell Plating:

200 μ" Tin/Lead(93/7) over 100 μ"

Nickel

Inner Contact Plating:

30 μ" Gold over 50 μ" Nickel

Pins

Mill-Max

Part

Number

803-93-020-10-001000

RoHS

Compliant

CONTACT:

Contact Used: #47, Standard 6 Finger Contact

Current Rating =

4.5 Amps

BERYLLIUM COPPER ALLOY

172 (UNS C17200) per ASTM B 194

Properties of BERYLLIUM COPPER:

Chemical composition: Cu 98.1%, Be 1.9%

Temper as stamped: TD01

Properties after heat treatment (TH01):

Hardness: 36-43 Rockwell C

Mechanical Life: 1000 Cycles Min.

Density: .298 lbs/in3

Electrical Conductivity: 22% IACS*

Resistance: 10 miliohms Max

Operating Temperature: -55°C/+125°C

Melting point: 980°C/865°C (liquidus/solidus)

Stress Relaxation†: 96% of stress remains after 1,000 hours @ 100 °C; 70% of stress remains after 1,000 hours

@ 200 °C

*International Annealed Copper Standard, i.e. as a % of pure copper.

†Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For

applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.

Mill-Max Mfg. Corp. Datasheet — Last Modified 8/23/2017

Page 1 of 3

LOOSE PIN:

Pin Used: 1304 (Brass Alloy)

BRASS ALLOY

360 per ASTM B 16, or 385 per ASTM B455

Properties of BRASS ALLOY 360 ASTM B 16:

Chemical composition: Cu 63% (max), Pb 3.7% (max)†, Fe .35% (max), Zn remainder

Temper as machined: H02/H04

Yield Strength: 25-45 ksi

Tensile strength: 57-80 ksi

Hardness as machined: 80-90 Rockwell B

Electrical conductivity: 26% IACS*

Melting point: 1000°C/840°C (liquidus/solidus)

Properties of BRASS ALLOY 385 ASTM B 455:

Chemical composition: Cu 60% (max), Pb 3.5% (max)†, Fe .35% (max), Zn remainder

Temper as machined: H02/H04

Yield Strength: 16 ksi(min)

Tensile strength: 48 ksi(min)

Hardness as machined: 80-90 Rockwell B

Electrical conductivity: 28% IACS*

Melting point: 1000°C/840°C (liquidus/solidus)

After machining, brass parts are often annealed (softened) for subsequent bending, swaging or crimping. A partial anneal

down to 60±10 RB is recommended for 90° bends, a full anneal down to 35±15 RB is recommended for pins or terminals

that are swaged (riveted) to a circuit board or crimped to a wire.

†RoHS-2 directive 2011/65/EU, exemption 6c allows up to 4% lead as an alloy agent in copper.

*International Annealed Copper Standard, i.e. as a % of pure copper.

INSULATOR INFORMATION:

PCT

Polyester, (Thermx CG933, black)

High Temperature

Properties of PCT Polyester:

Brand: Thermx

Grade: CG-933

Rated voltage: 100 VRMS/150 VDC

Insulation resistance: 10,000 Megaohms min.

Material Heat Deflection Temp (per ASTM D 648): 529°F (276°C) @ 66 psi

Dielectric strength: 1000 VRMS min. (700 VRMS min. for series 117 Shrink DIP)

Note: Materials above 446°F (230°C) are considered suitable for "eutectic" reflow soldering, above 500°F (260°C) for

"lead-free" reflow soldering.

Certificate of Compliance:

This is to Certify that the product described above is manufactured to Mill-Max quality standards in accordance with all

applicable specifications and drawing. Mill-Max certifies this product to be free from defects of materials and workmanship.

This Certificate of Compliance covers the following requirements:

Dimensional (all features verified to be within tolerances described on the applicable drawing).

Raw Material (materials and properties verified to be as described on the applicable drawing).

Plating (platings as required, thickness verified, and performance including solderability per mil-standard).

Performance (insertion extraction or other force requirements as described on the applicable drawing).

Mill-Max Mfg. Corp. Datasheet — Last Modified 8/23/2017

Page 2 of 3

Compliance Statement for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH)

Reference:

1. Regulation EC No 1907/2006 of the European Parliament and of the Council of 18 December 2006, concerning the

Registration, Evaluation, Authorization and Restriction of Chemicals (REACH)

2. ECHA, Candidate list of Substances of Very High Concern (SVHC)

http://echa.europa.eu/reach_en.asp

Mill-Max is aware of the regulation and the SVHC list the EU published (referenced above). Mill-Max does not produce or

sell any of the listed substances in their homogeneous form. These substances are not intentionally added during the

manufacturing of any Mill-Max products. To our knowledge, our products do not contain the substances described on the

ECHA SVHC list. Testing is not performed for materials and substances that were not intentionally added. No warranty,

liability of indemnification is expressed or implied with this information. Mill-Max maintains surveillance of the ECHA website

to obtain the latest information and periodically reviews the SVHC list for changes and additions.

Compliance Statement for DRC Conflict Free products.

Reference:

Dodd-Frank Wall Street Reform and Consumer Protection Act, Section 1502, reporting requirements for users of conflict

minerals.

“Conflict minerals,” are Columbite-tantalite (coltan), cassiterite, gold, wolframite, or their derivatives; or any other mineral

or its derivatives determined by the Secretary of State to be financing conflict in the Democratic Republic of the Congo

(DRC) or an adjoining country. Metals derived from these minerals are tin, tantalum, tungsten, and gold. By this definition,

the only minerals of concern that may be found in Mill-Max products are tin and gold.

Mill-Max Mfg.Corp. hereby certifies that its products are manufactured with tin and gold that is derived from material that

is considered DRC Conflict Free. Mill-Max provides this assurance as a result of a due diligence process that includes

traceability to the source and in some cases the identification of recycled and scrap materials included in the subject

material.

Mill-Max Mfg. Corp. Datasheet — Last Modified 8/23/2017

Page 3 of 3

Recommended Resources

Do you know about lithium-ion battery charging IC equipped with current path function?

Chemical mixer circuit

Detection circuit diagram of AC side voltage Us based on SG3525

Bandpass filter composed of transistors

Tianxiang brand automatic power-off electric hot water bottle circuit diagram

Automatically shut off stair light control circuit

Show off the prizes you received: [Download and get gifts] Watch TI's wireless connectivity seminar and download TI's wireless e-books to get gifts [url=https://www.eeworld.com.cn/huodong/TI_WCS_DAY_HTML20161130/index.html]https://www...; yjtyjt Talking

Nineteen bad living habits (the last one is especially important): [size=10.5pt]1. Fold the quilt first when you get up. The human body itself is also a source of pollution. During a night's sleep, the human skin will emit a large amount of water vapor, making the qu...; wanggq Talking

Mini PCIe gold finger package, according to the PDF drawing, but not tested: Mini PCIE Gold Finger Package [b][color=#5E7384] This content is created by EEWORLD forum user [size=3]xutong[/size], if you need to reprint or use it for commercial purposes, you must obtain the auth...; xutong PCB Design

About the cost-effective circuit of 48V to 5V: I would like to ask, what are the 48V to 5V circuits now? The output current is greater than 100ma. If a power module is used, the efficiency is very high, but the cost is too high. Is there any low-c...; jesse5956 Power technology

AD16: The latest version of AD16 software always pops up this question for no apparent reason, and it keeps popping up, so I have to forcefully close the software. Has anyone encountered the same problem? W...; Evil93 PCB Design

Can I use the USB port of Launchpad to communicate with the PC serial port directly? How to do it?: Can I use the USB port of Launchpad to communicate with the serial port of PC directly? How to do it? Is it the same as USB to RS-232? [[i] This post was last edited by e小强2013 on 2013-5-8 19:40 [/i]]...; e小强2013 Microcontroller MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components