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AM29F080B-75FC

Description
Flash, 1MX8, 70ns, PDSO40, REVERSE, MO-142CD, TSOP-40
Categorystorage    storage   
File Size829KB,38 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric Compare View All

AM29F080B-75FC Overview

Flash, 1MX8, 70ns, PDSO40, REVERSE, MO-142CD, TSOP-40

AM29F080B-75FC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeTSOP1
package instructionTSOP1-R,
Contacts40
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time70 ns
Other featuresMINIMUM 1000K PROGRAM/ERASE CYCLE ;20 YEAR DATA RETENTION
Data retention time - minimum20
JESD-30 codeR-PDSO-G40
JESD-609 codee0
length18.4 mm
memory density8388608 bit
Memory IC TypeFLASH
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals40
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1-R
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
typeNOR TYPE
width10 mm
Base Number Matches1
Am29F080B
8 Megabit (1 M x 8-Bit)
CMOS 5.0 Volt-only, Uniform Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
5.0 V
±
10%, single power supply operation
— Minimizes system level power requirements
s
Manufactured on 0.32 µm process technology
— Compatible with 0.5 µm Am29F080 device
s
High performance
— Access times as fast as 70 ns
s
Low power consumption
— 25 mA typical active read current
— 30 mA typical program/erase current
— 1 µA typical standby current (standard access
time to active mode)
s
Flexible sector architecture
— 16 uniform sectors of 64 Kbytes each
— Any combination of sectors can be erased.
— Supports full chip erase
— Group sector protection:
A hardware method of locking sector groups to
prevent any program or erase operations within
that sector group
Temporary Sector Group Unprotect allows code
changes in previously locked sectors
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies bytes at specified addresses
s
Minimum 1,000,000 program/erase cycles per
sector guaranteed
s
20-year data retention at 125°C
— Reliable operation for the life of the system
s
Package options
— 40-pin TSOP
— 44-pin SO
s
Compatible with JEDEC standards
— Pinout and software compatible with
single-power-supply Flash standard
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting program
or erase cycle completion
s
Ready/Busy# output (RY/BY#)
— Provides a hardware method for detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
— Suspends a sector erase operation to read data
from, or program data to, a non-erasing sector,
then resumes the erase operation
s
Hardware reset pin (RESET#)
— Resets internal state machine to the read mode
s
Command sequence optimized for mass storage
— Specific addresses not required for unlock cycles
This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
Publication#
21503
Rev:
G
Amendment/0
Issue Date:
December 4, 2000

AM29F080B-75FC Related Products

AM29F080B-75FC AM29F080B-75FI AM29F080B-75FF AM29F080B-75ED
Description Flash, 1MX8, 70ns, PDSO40, REVERSE, MO-142CD, TSOP-40 Flash, 1MX8, 70ns, PDSO40, REVERSE, MO-142CD, TSOP-40 Flash, 1MX8, 70ns, PDSO40, REVERSE, MO-142CD, TSOP-40 Flash, 1MX8, 70ns, PDSO40, MO-142CD, TSOP-40
Is it Rohs certified? incompatible incompatible conform to conform to
Maker SPANSION SPANSION SPANSION SPANSION
Parts packaging code TSOP1 TSOP1 TSOP1 TSOP1
package instruction TSOP1-R, TSOP1-R, TSSOP40,.8,20 TSOP1-R, TSOP1,
Contacts 40 40 40 40
Reach Compliance Code compliant not_compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 70 ns 70 ns 70 ns 70 ns
Other features MINIMUM 1000K PROGRAM/ERASE CYCLE ;20 YEAR DATA RETENTION MINIMUM 1000K PROGRAM/ERASE CYCLE ;20 YEAR DATA RETENTION MINIMUM 1000K PROGRAM/ERASE CYCLE ;20 YEAR DATA RETENTION MINIMUM 1000K PROGRAM/ERASE CYCLE ;20 YEAR DATA RETENTION
Data retention time - minimum 20 20 20 20
JESD-30 code R-PDSO-G40 R-PDSO-G40 R-PDSO-G40 R-PDSO-G40
JESD-609 code e0 e0 e3 e3
length 18.4 mm 18.4 mm 18.4 mm 18.4 mm
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH FLASH FLASH
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 40 40 40 40
word count 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C 70 °C
organize 1MX8 1MX8 1MX8 1MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1-R TSOP1-R TSOP1-R TSOP1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 260 260
Programming voltage 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin (Sn) Tin (Sn)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 40 40
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 10 mm 10 mm 10 mm 10 mm
Humidity sensitivity level 3 3 - 3

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