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MCM32512S80

Description
512K x 32 Bit Dynamic Random Access Memory Module
Categorystorage    storage   
File Size554KB,13 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MCM32512S80 Overview

512K x 32 Bit Dynamic Random Access Memory Module

MCM32512S80 Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeSIMM
package instructionSIMM, SSIM72
Contacts72
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFAST PAGE
Maximum access time80 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Spare memory width16
I/O typeCOMMON
JESD-30 codeR-XSMA-N72
memory density16777216 bi
Memory IC TypeFAST PAGE DRAM MODULE
memory width32
Number of functions1
Number of ports1
Number of terminals72
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeSIMM
Encapsulate equivalent codeSSIM72
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle512
self refreshNO
Maximum standby current0.016 A
Maximum slew rate0.576 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationSINGLE

MCM32512S80 Related Products

MCM32512S80 MCM32L512 MCM32512SG80 MCM32512SG70 MCM32512SG10 MCM32512S70 MCM32512S10 MCM32512
Description 512K x 32 Bit Dynamic Random Access Memory Module 512K x 32 Bit Dynamic Random Access Memory Module 512K x 32 Bit Dynamic Random Access Memory Module 512K x 32 Bit Dynamic Random Access Memory Module 512K x 32 Bit Dynamic Random Access Memory Module 512K x 32 Bit Dynamic Random Access Memory Module 512K x 32 Bit Dynamic Random Access Memory Module 512K x 32 Bit Dynamic Random Access Memory Module
Maker Motorola ( NXP ) - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) -
package instruction SIMM, SSIM72 - SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 -
Reach Compliance Code unknow - unknow unknow unknow unknow unknow -
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99 -
access mode FAST PAGE - FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE -
Maximum access time 80 ns - 80 ns 70 ns 100 ns 70 ns 100 ns -
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH - RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH -
Spare memory width 16 - 16 16 16 16 16 -
I/O type COMMON - COMMON COMMON COMMON COMMON COMMON -
JESD-30 code R-XSMA-N72 - R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 -
memory density 16777216 bi - 16777216 bi 16777216 bi 16777216 bi 16777216 bi 16777216 bi -
Memory IC Type FAST PAGE DRAM MODULE - FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE -
memory width 32 - 32 32 32 32 32 -
Number of functions 1 - 1 1 1 1 1 -
Number of ports 1 - 1 1 1 1 1 -
Number of terminals 72 - 72 72 72 72 72 -
word count 524288 words - 524288 words 524288 words 524288 words 524288 words 524288 words -
character code 512000 - 512000 512000 512000 512000 512000 -
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
Maximum operating temperature 70 °C - 70 °C 70 °C 70 °C 70 °C 70 °C -
organize 512KX32 - 512KX32 512KX32 512KX32 512KX32 512KX32 -
Output characteristics 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE -
Package body material UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED -
encapsulated code SIMM - SIMM SIMM SIMM SIMM SIMM -
Encapsulate equivalent code SSIM72 - SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 -
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY -
power supply 5 V - 5 V 5 V 5 V 5 V 5 V -
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
refresh cycle 512 - 512 512 512 512 512 -
self refresh NO - NO NO NO NO NO -
Maximum standby current 0.016 A - 0.016 A 0.016 A 0.016 A 0.016 A 0.016 A -
Maximum slew rate 0.576 mA - 0.576 mA 0.656 mA 0.496 mA 0.656 mA 0.496 mA -
Maximum supply voltage (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V -
Nominal supply voltage (Vsup) 5 V - 5 V 5 V 5 V 5 V 5 V -
surface mount NO - NO NO NO NO NO -
technology CMOS - CMOS CMOS CMOS CMOS CMOS -
Temperature level COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL -
Terminal form NO LEAD - NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD -
Terminal pitch 1.27 mm - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm -
Terminal location SINGLE - SINGLE SINGLE SINGLE SINGLE SINGLE -
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