MCM32512S10 datasheet, PDF - EEWORLD Datasheet

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MCM32512S10: Description512K x 32 Bit Dynamic Random Access Memory Module; Categorystorage storage; File Size554KB，13 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MCM32512S10 Overview

512K x 32 Bit Dynamic Random Access Memory Module

MCM32512S10 Parametric

Parameter Name	Attribute value
Maker	Motorola ( NXP )
Parts packaging code	SIMM
package instruction	SIMM, SSIM72
Contacts	72
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	100 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Spare memory width	16
I/O type	COMMON
JESD-30 code	R-XSMA-N72
memory density	16777216 bi
Memory IC Type	FAST PAGE DRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	72
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX32
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	SIMM
Encapsulate equivalent code	SSIM72
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	512
self refresh	NO
Maximum standby current	0.016 A
Maximum slew rate	0.496 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	SINGLE

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MCM32512S10 Related Products

	MCM32512S10	MCM32L512	MCM32512SG80	MCM32512SG70	MCM32512SG10	MCM32512S80	MCM32512S70	MCM32512
Description	512K x 32 Bit Dynamic Random Access Memory Module	512K x 32 Bit Dynamic Random Access Memory Module	512K x 32 Bit Dynamic Random Access Memory Module	512K x 32 Bit Dynamic Random Access Memory Module	512K x 32 Bit Dynamic Random Access Memory Module	512K x 32 Bit Dynamic Random Access Memory Module	512K x 32 Bit Dynamic Random Access Memory Module	512K x 32 Bit Dynamic Random Access Memory Module
Maker	Motorola ( NXP )	-	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	-
package instruction	SIMM, SSIM72	-	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	-
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow	unknow	-
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99	-
access mode	FAST PAGE	-	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	-
Maximum access time	100 ns	-	80 ns	70 ns	100 ns	80 ns	70 ns	-
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	-	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	-
Spare memory width	16	-	16	16	16	16	16	-
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON	-
JESD-30 code	R-XSMA-N72	-	R-XSMA-N72	R-XSMA-N72	R-XSMA-N72	R-XSMA-N72	R-XSMA-N72	-
memory density	16777216 bi	-	16777216 bi	16777216 bi	16777216 bi	16777216 bi	16777216 bi	-
Memory IC Type	FAST PAGE DRAM MODULE	-	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	-
memory width	32	-	32	32	32	32	32	-
Number of functions	1	-	1	1	1	1	1	-
Number of ports	1	-	1	1	1	1	1	-
Number of terminals	72	-	72	72	72	72	72	-
word count	524288 words	-	524288 words	524288 words	524288 words	524288 words	524288 words	-
character code	512000	-	512000	512000	512000	512000	512000	-
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	70 °C	-	70 °C	70 °C	70 °C	70 °C	70 °C	-
organize	512KX32	-	512KX32	512KX32	512KX32	512KX32	512KX32	-
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-
Package body material	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	-
encapsulated code	SIMM	-	SIMM	SIMM	SIMM	SIMM	SIMM	-
Encapsulate equivalent code	SSIM72	-	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72	-
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	MICROELECTRONIC ASSEMBLY	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	-
power supply	5 V	-	5 V	5 V	5 V	5 V	5 V	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
refresh cycle	512	-	512	512	512	512	512	-
self refresh	NO	-	NO	NO	NO	NO	NO	-
Maximum standby current	0.016 A	-	0.016 A	0.016 A	0.016 A	0.016 A	0.016 A	-
Maximum slew rate	0.496 mA	-	0.576 mA	0.656 mA	0.496 mA	0.576 mA	0.656 mA	-
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage (Vsup)	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	5 V	5 V	5 V	-
surface mount	NO	-	NO	NO	NO	NO	NO	-
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-
Terminal form	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	-
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-
Terminal location	SINGLE	-	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	-

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