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MC9S08RE32FJ

Description
Microcontrollers
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size790KB,232 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MC9S08RE32FJ Overview

Microcontrollers

MC9S08RE32FJ Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeQFP
package instructionLQFP, QFP32,.35SQ,32
Contacts32
Reach Compliance Codeunknow
Has ADCNO
Address bus width
bit size8
maximum clock frequency16 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeS-PQFP-G32
length7 mm
Number of I/O lines27
Number of terminals32
Maximum operating temperature70 °C
Minimum operating temperature
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP32,.35SQ,32
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8/3.6 V
Certification statusNot Qualified
RAM (bytes)2048
rom(word)32768
ROM programmabilityFLASH
Maximum seat height1.6 mm
speed8 MHz
Maximum slew rate4.8 mA
Maximum supply voltage3.6 V
Minimum supply voltage1.8 V
Nominal supply voltage2 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width7 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
MC9S08RC8/16/32/60
MC9S08RD8/16/32/60
MC9S08RE8/16/32/60
MC9S08RG32/60
Data Sheet
HCS08
Microcontrollers
MC9S08RG60/D
Rev 1.10
08/2004
freescale.com

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