EEWORLDEEWORLDEEWORLD

Part Number

Search

MC9328MXLVF20

Description
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,84 Pages
ManufacturerFREESCALE (NXP)
Download Datasheet Parametric Compare View All

MC9328MXLVF20 Overview

IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC

MC9328MXLVF20 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid2019338020
Parts packaging codeBGA
package instruction13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225
Contacts225
Reach Compliance Codenot_compliant
ECCN code3A991
Address bus width25
bit size32
boundary scanYES
maximum clock frequency16 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B225
JESD-609 codee0
length13 mm
low power modeYES
Humidity sensitivity level3
Number of terminals225
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA225,15X15,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)240
power supply1.8,1.8/3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
speed200 MHz
Maximum supply voltage2 V
Minimum supply voltage1.8 V
Nominal supply voltage1.9 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead/Silver (Sn/Pb/Ag)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width13 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Freescale Semiconductor
Advance Information
MC9328MXL/D
Rev. 5, 08/2004
MC9328MXL
MC9328MXL
Package Information
Plastic Package
(MAPBGA–225 or 256)
Ordering Information
See Table 2 on page 5
1 Introduction
The i.MX family builds on the DragonBall family of
application processors which have demonstrated leadership
in the portable handheld market. Continuing this legacy, the
i.MX (Media Extensions) series provides a leap in
performance with an ARM9™ microprocessor core and
highly integrated system functions. The i.MX products
specifically address the requirements of the personal,
portable product market by providing intelligent integrated
peripherals, an advanced processor core, and power
management capabilities.
The new MC9328MXL features the advanced and power-
efficient ARM920T™ core that operates at speeds up to
200 MHz. Integrated modules, which include an LCD
controller, USB support, and an MMC/SD host controller,
support a suite of peripherals to enhance any product seeking
to provide a rich multimedia experience. It is packaged in
either a 256-pin Mold Array Process-Ball Grid Array
(MAPBGA) or 225-pin PBGA package. Figure 1 shows the
functional block diagram of the MC9328MXL.
Contents
1
2
3
4
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Signals and Connections . . . . . . . . . . . . . . . . . . . .6
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Pin-Out and Package Information. . . . . . . . . . . . .79
Contact Information . . . . . . . . . . . . . . . . . Last Page
© Freescale Semiconductor, Inc., 2004. All rights reserved.
This document contains information on a new product. Specifications and information herein are
subject to change without notice.

MC9328MXLVF20 Related Products

MC9328MXLVF20 MC9328MXLVH20 MC9328MXLRM/D MC9328MXLDVF20 MC9328MXLDVH20 MC9328MXLCVF15 MC9328MXLCVH15 MC9328MXL/D MC9328MXLP/D
Description IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 200MHz, RISC PROCESSOR, PBGA225, 13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256
Address bus width 25 25 25 25 25 25 25 25 25
boundary scan YES YES YES YES YES YES YES YES YES
External data bus width 32 32 32 32 32 32 32 32 32
Integrated cache YES YES YES YES YES YES YES YES YES
length 13 mm 14 mm 14 mm 13 mm 14 mm 13 mm 14 mm 14 mm 14 mm
low power mode YES YES YES YES YES YES YES YES YES
Number of terminals 225 256 256 225 256 225 256 256 256
Maximum operating temperature 70 °C 70 Cel 70 Cel 70 °C 70 Cel 85 °C 70 Cel 70 Cel 70 Cel
Minimum operating temperature - 0.0 Cel 0.0 Cel -30 °C 0.0 Cel -40 °C 0.0 Cel 0.0 Cel 0.0 Cel
Maximum supply voltage 2 V 2 V 2 V 2 V 2 V 1.9 V 2 V 2 V 2 V
Minimum supply voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.7 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL OTHER COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 13 mm 14 mm 14 mm 13 mm 14 mm 13 mm 14 mm 14 mm 14 mm
Line speed - 200 MHz 200 MHz - 200 MHz - 200 MHz 200 MHz 200 MHz
Processing package description - 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256 - 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256 - 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
state - Active Active - Active - Active Active Active
microprocessor_microcontroller_peripheral_ic_type - MICROPROCESSOR, RISC MICROPROCESSOR, RISC - MICROPROCESSOR, RISC - MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Number of digits - 32 32 - 32 - 32 32 32
clock_frequency_max - 16 MHz 16 MHz - 16 MHz - 16 MHz 16 MHz 16 MHz
form - FIXED POINT FIXED POINT - FIXED POINT - FIXED POINT FIXED POINT FIXED POINT
jesd_30_code - S-PBGA-B256 S-PBGA-B256 - S-PBGA-B256 - S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
jesd_609_code - e1 e1 - e1 - e1 e1 e1
moisture_sensitivity_level - 3 3 - 3 - 3 3 3
Packaging Materials - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
ckage_code - LFBGA LFBGA - LFBGA - LFBGA LFBGA LFBGA
packaging shape - SQUARE SQUARE - SQUARE - SQUARE SQUARE SQUARE
Package Size - GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH - GRID ARRAY, LOW PROFILE, FINE PITCH - GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
eak_reflow_temperature__cel_ - 260 260 - 260 - 260 260 260
qualification_status - COMMERCIAL COMMERCIAL - COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL
seated_height_max - 1.6 mm 1.6 mm - 1.6 mm - 1.6 mm 1.6 mm 1.6 mm
Rated supply voltage - 1.9 V 1.9 V - 1.9 V - 1.9 V 1.9 V 1.9 V
terminal coating - TIN SILVER COPPER TIN SILVER COPPER - TIN SILVER COPPER - TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
Terminal spacing - 0.8000 mm 0.8000 mm - 0.8000 mm - 0.8000 mm 0.8000 mm 0.8000 mm
ime_peak_reflow_temperature_max__s_ - 40 40 - 40 - 40 40 40
dditional_feature - ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY - ALSO REQUIRES 3.3V SUPPLY - ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY

Recommended Resources

Popular Articles

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1208  2230  808  1331  2665  25  45  17  27  54 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号