MC9328MXL/D datasheet, PDF - EEWORLD Datasheet

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MC9328MXL/D: Description32-BIT, 200 MHz, RISC PROCESSOR, PBGA256; Categorysemiconductor The embedded processor and controller; File Size1MB，84 Pages; ManufacturerFREESCALE (NXP)

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MC9328MXL/D Overview

32-BIT, 200 MHz, RISC PROCESSOR, PBGA256

MC9328MXL/D Parametric

Parameter Name	Attribute value
External data bus width	32
Number of terminals	256
Minimum operating temperature	0.0 Cel
Maximum operating temperature	70 Cel
Line speed	200 MHz
Processing package description	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
state	Active
microprocessor_microcontroller_peripheral_ic_type	MICROPROCESSOR, RISC
Address bus width	25
Number of digits	32
boundary scan	YES
clock_frequency_max	16 MHz
form	FIXED POINT
Integrated cache	YES
jesd_30_code	S-PBGA-B256
jesd_609_code	e1
low power mode	YES
moisture_sensitivity_level	3
Packaging Materials	PLASTIC/EPOXY
ckage_code	LFBGA
packaging shape	SQUARE
Package Size	GRID ARRAY, LOW PROFILE, FINE PITCH
eak_reflow_temperature__cel_	260
qualification_status	COMMERCIAL
seated_height_max	1.6 mm
Rated supply voltage	1.9 V
Minimum supply voltage	1.8 V
Maximum supply voltage	2 V
surface mount	YES
Temperature level	COMMERCIAL
terminal coating	TIN SILVER COPPER
Terminal form	BALL
Terminal spacing	0.8000 mm
Terminal location	BOTTOM
ime_peak_reflow_temperature_max__s_	40
length	14 mm
width	14 mm
dditional_feature	ALSO REQUIRES 3.3V SUPPLY

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Freescale Semiconductor

Advance Information

MC9328MXL/D

Rev. 5, 08/2004

MC9328MXL

Package Information

Plastic Package

(MAPBGA–225 or 256)

Ordering Information

See Table 2 on page 5

1 Introduction

The i.MX family builds on the DragonBall family of

application processors which have demonstrated leadership

in the portable handheld market. Continuing this legacy, the

i.MX (Media Extensions) series provides a leap in

performance with an ARM9™ microprocessor core and

highly integrated system functions. The i.MX products

specifically address the requirements of the personal,

portable product market by providing intelligent integrated

peripherals, an advanced processor core, and power

management capabilities.

The new MC9328MXL features the advanced and power-

efficient ARM920T™ core that operates at speeds up to

200 MHz. Integrated modules, which include an LCD

controller, USB support, and an MMC/SD host controller,

support a suite of peripherals to enhance any product seeking

to provide a rich multimedia experience. It is packaged in

either a 256-pin Mold Array Process-Ball Grid Array

(MAPBGA) or 225-pin PBGA package. Figure 1 shows the

functional block diagram of the MC9328MXL.

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Signals and Connections . . . . . . . . . . . . . . . . . . . .6

Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Pin-Out and Package Information. . . . . . . . . . . . .79

Contact Information . . . . . . . . . . . . . . . . . Last Page

This document contains information on a new product. Specifications and information herein are

subject to change without notice.

MC9328MXL/D Related Products

	MC9328MXL/D	MC9328MXLVF20	MC9328MXLVH20	MC9328MXLRM/D	MC9328MXLDVF20	MC9328MXLDVH20	MC9328MXLCVF15	MC9328MXLCVH15	MC9328MXLP/D
Description	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	200MHz, RISC PROCESSOR, PBGA225, 13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256
External data bus width	32	32	32	32	32	32	32	32	32
Number of terminals	256	225	256	256	225	256	225	256	256
Minimum operating temperature	0.0 Cel	-	0.0 Cel	0.0 Cel	-30 °C	0.0 Cel	-40 °C	0.0 Cel	0.0 Cel
Maximum operating temperature	70 Cel	70 °C	70 Cel	70 Cel	70 °C	70 Cel	85 °C	70 Cel	70 Cel
Address bus width	25	25	25	25	25	25	25	25	25
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES	YES
low power mode	YES	YES	YES	YES	YES	YES	YES	YES	YES
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.7 V	1.8 V	1.8 V
Maximum supply voltage	2 V	2 V	2 V	2 V	2 V	2 V	1.9 V	2 V	2 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	OTHER	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
length	14 mm	13 mm	14 mm	14 mm	13 mm	14 mm	13 mm	14 mm	14 mm
width	14 mm	13 mm	14 mm	14 mm	13 mm	14 mm	13 mm	14 mm	14 mm
Line speed	200 MHz	-	200 MHz	200 MHz	-	200 MHz	-	200 MHz	200 MHz
Processing package description	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	-	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	-	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	-	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
state	Active	-	Active	Active	-	Active	-	Active	Active
microprocessor_microcontroller_peripheral_ic_type	MICROPROCESSOR, RISC	-	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	-	MICROPROCESSOR, RISC	-	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Number of digits	32	-	32	32	-	32	-	32	32
clock_frequency_max	16 MHz	-	16 MHz	16 MHz	-	16 MHz	-	16 MHz	16 MHz
form	FIXED POINT	-	FIXED POINT	FIXED POINT	-	FIXED POINT	-	FIXED POINT	FIXED POINT
jesd_30_code	S-PBGA-B256	-	S-PBGA-B256	S-PBGA-B256	-	S-PBGA-B256	-	S-PBGA-B256	S-PBGA-B256
jesd_609_code	e1	-	e1	e1	-	e1	-	e1	e1
moisture_sensitivity_level	3	-	3	3	-	3	-	3	3
Packaging Materials	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
ckage_code	LFBGA	-	LFBGA	LFBGA	-	LFBGA	-	LFBGA	LFBGA
packaging shape	SQUARE	-	SQUARE	SQUARE	-	SQUARE	-	SQUARE	SQUARE
Package Size	GRID ARRAY, LOW PROFILE, FINE PITCH	-	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	-	GRID ARRAY, LOW PROFILE, FINE PITCH	-	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
eak_reflow_temperature__cel_	260	-	260	260	-	260	-	260	260
qualification_status	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	-	COMMERCIAL	COMMERCIAL
seated_height_max	1.6 mm	-	1.6 mm	1.6 mm	-	1.6 mm	-	1.6 mm	1.6 mm
Rated supply voltage	1.9 V	-	1.9 V	1.9 V	-	1.9 V	-	1.9 V	1.9 V
terminal coating	TIN SILVER COPPER	-	TIN SILVER COPPER	TIN SILVER COPPER	-	TIN SILVER COPPER	-	TIN SILVER COPPER	TIN SILVER COPPER
Terminal spacing	0.8000 mm	-	0.8000 mm	0.8000 mm	-	0.8000 mm	-	0.8000 mm	0.8000 mm
ime_peak_reflow_temperature_max__s_	40	-	40	40	-	40	-	40	40
dditional_feature	ALSO REQUIRES 3.3V SUPPLY	-	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	-	ALSO REQUIRES 3.3V SUPPLY	-	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY

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