MC9328MXLDVF20 datasheet, PDF - EEWORLD Datasheet

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MC9328MXLDVF20: Description200MHz, RISC PROCESSOR, PBGA225, 13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，84 Pages; ManufacturerFREESCALE (NXP)

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MC9328MXLDVF20 Overview

200MHz, RISC PROCESSOR, PBGA225, 13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225

MC9328MXLDVF20 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	2019338012
Parts packaging code	BGA
package instruction	13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225
Contacts	225
Reach Compliance Code	not_compliant
Address bus width	25
bit size	32
boundary scan	YES
maximum clock frequency	16 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B225
JESD-609 code	e0
length	13 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	225
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA225,15X15,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	240
power supply	1.8,1.8/3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
speed	200 MHz
Maximum supply voltage	2 V
Minimum supply voltage	1.8 V
Nominal supply voltage	1.9 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	13 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Freescale Semiconductor

Advance Information

MC9328MXL/D

Rev. 5, 08/2004

MC9328MXL

Package Information

Plastic Package

(MAPBGA–225 or 256)

Ordering Information

See Table 2 on page 5

1 Introduction

The i.MX family builds on the DragonBall family of

application processors which have demonstrated leadership

in the portable handheld market. Continuing this legacy, the

i.MX (Media Extensions) series provides a leap in

performance with an ARM9™ microprocessor core and

highly integrated system functions. The i.MX products

specifically address the requirements of the personal,

portable product market by providing intelligent integrated

peripherals, an advanced processor core, and power

management capabilities.

The new MC9328MXL features the advanced and power-

efficient ARM920T™ core that operates at speeds up to

200 MHz. Integrated modules, which include an LCD

controller, USB support, and an MMC/SD host controller,

support a suite of peripherals to enhance any product seeking

to provide a rich multimedia experience. It is packaged in

either a 256-pin Mold Array Process-Ball Grid Array

(MAPBGA) or 225-pin PBGA package. Figure 1 shows the

functional block diagram of the MC9328MXL.

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Signals and Connections . . . . . . . . . . . . . . . . . . . .6

Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Pin-Out and Package Information. . . . . . . . . . . . .79

Contact Information . . . . . . . . . . . . . . . . . Last Page

This document contains information on a new product. Specifications and information herein are

subject to change without notice.

MC9328MXLDVF20 Related Products

	MC9328MXLDVF20	MC9328MXLVF20	MC9328MXLVH20	MC9328MXLRM/D	MC9328MXLDVH20	MC9328MXLCVF15	MC9328MXLCVH15	MC9328MXL/D	MC9328MXLP/D
Description	200MHz, RISC PROCESSOR, PBGA225, 13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256	32-BIT, 200 MHz, RISC PROCESSOR, PBGA256
Address bus width	25	25	25	25	25	25	25	25	25
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES
External data bus width	32	32	32	32	32	32	32	32	32
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES	YES
length	13 mm	13 mm	14 mm	14 mm	14 mm	13 mm	14 mm	14 mm	14 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES	YES
Number of terminals	225	225	256	256	256	225	256	256	256
Maximum operating temperature	70 °C	70 °C	70 Cel	70 Cel	70 Cel	85 °C	70 Cel	70 Cel	70 Cel
Minimum operating temperature	-30 °C	-	0.0 Cel	0.0 Cel	0.0 Cel	-40 °C	0.0 Cel	0.0 Cel	0.0 Cel
Maximum supply voltage	2 V	2 V	2 V	2 V	2 V	1.9 V	2 V	2 V	2 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.7 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	OTHER	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	13 mm	13 mm	14 mm	14 mm	14 mm	13 mm	14 mm	14 mm	14 mm
Line speed	-	-	200 MHz	200 MHz	200 MHz	-	200 MHz	200 MHz	200 MHz
Processing package description	-	-	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	-	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256	14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
state	-	-	Active	Active	Active	-	Active	Active	Active
microprocessor_microcontroller_peripheral_ic_type	-	-	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	-	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Number of digits	-	-	32	32	32	-	32	32	32
clock_frequency_max	-	-	16 MHz	16 MHz	16 MHz	-	16 MHz	16 MHz	16 MHz
form	-	-	FIXED POINT	FIXED POINT	FIXED POINT	-	FIXED POINT	FIXED POINT	FIXED POINT
jesd_30_code	-	-	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	-	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
jesd_609_code	-	-	e1	e1	e1	-	e1	e1	e1
moisture_sensitivity_level	-	-	3	3	3	-	3	3	3
Packaging Materials	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
ckage_code	-	-	LFBGA	LFBGA	LFBGA	-	LFBGA	LFBGA	LFBGA
packaging shape	-	-	SQUARE	SQUARE	SQUARE	-	SQUARE	SQUARE	SQUARE
Package Size	-	-	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	-	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
eak_reflow_temperature__cel_	-	-	260	260	260	-	260	260	260
qualification_status	-	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL
seated_height_max	-	-	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm
Rated supply voltage	-	-	1.9 V	1.9 V	1.9 V	-	1.9 V	1.9 V	1.9 V
terminal coating	-	-	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	-	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal spacing	-	-	0.8000 mm	0.8000 mm	0.8000 mm	-	0.8000 mm	0.8000 mm	0.8000 mm
ime_peak_reflow_temperature_max__s_	-	-	40	40	40	-	40	40	40
dditional_feature	-	-	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	-	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY

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