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5962-8851805LA

Description
OTP ROM, 512X8, 25ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24
Categorystorage    storage   
File Size225KB,9 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric Compare View All

5962-8851805LA Overview

OTP ROM, 512X8, 25ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24

5962-8851805LA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeDIP
package instructionDIP, DIP24,.3
Contacts24
Reach Compliance Codenot_compliant
ECCN codeEAR99
Base Number Matches1
1CY 7C22 5A
CY7C225A
512 x 8 Registered PROM
Features
CMOS for optimum speed/power
High speed
TTL-compatible I/O
Direct replacement for bipolar PROMs
Capable of withstanding greater than 2001V static
18 ns address set-up
12 ns clock to output
Low power
discharge
Functional Description
The CY7C225A is a high-performance 512 word by 8 bit elec-
trically programmable read only memory packaged in a slim
300-mil plastic or hermetic DIP, 28-pin leadless chip carrier,
and 28-pin PLCC. The memory cells utilize proven EPROM
floating gate technology and byte-wide intelligent program-
ming algorithms.
The CY7C225A replaces bipolar devices and offers the advan-
tages of lower power, superior performance, and high pro-
gramming yield. The EPROM cell requires only 12.5V for the
supervoltage and low current requirements allow for gang pro-
gramming. The EPROM cells allow for each memory location
to be tested 100%, as each location is written into, erased, and
repeatedly exercised prior to encapsulation. Each PROM is
also tested for AC performance to guarantee that after custom-
er programming the product will meet AC specification limits.
495 mW (commercial)
660 mW (military)
Synchronous and asynchronous output enables
On-chip edge-triggered registers
Buffered common PRESET and CLEAR inputs
EPROM technology, 100% programmable
Slim 300-mil, 24-pin plastic or hermetic DIP, 28-pin LCC,
or 28-pin PLCC
5V
±10%
V
CC
, commercial and military
Logic Block Diagram
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
COLUMN
ADDRESS
O
2
O
1
ADDRESS
DECODER
8-BIT
EDGE-
TRIGGERED
REGISTER
ROW
ADDRESS
PROGRAMMABLE
ARRAY
MULTIPLEXER
O
5
O
4
O
7
Pin Configurations
DIP
Top View
A
7
O
6
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
3
O
0
O
1
O
2
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
V
CC
A
8
PS
E
CLR
E
S
CP
O
7
O
6
O
5
O
4
O
3
C225A-2
PS
CLR
CP
S
R
CP
O
0
LCC/PLCC
Top View
E
S
E
C225A-1
A
4
A
3
A
2
A
1
A
0
NC
O
0
4 3 2 1 28 27 26
25
5
24
6
23
7
22
8
21
9
20
10
19
11
12 13 141516 17 18
E
CLR
E
S
CP
NC
O
7
O
6
C225A-3
Cypress Semiconductor Corporation
3901 North First Street
San Jose •
CA 95134 •
408-943-2600
December 1992 – Revised March 1995

5962-8851805LA Related Products

5962-8851805LA CY7C225A-30PC CY7C225A-40DC CY7C225A-40PC CY7C225A-18PC 5962-8851804LA CY7C225A-35LMB CY7C225A-35DMB
Description OTP ROM, 512X8, 25ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 OTP ROM, 512X8, 15ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 OTP ROM, 512X8, 25ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 OTP ROM, 512X8, 25ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 OTP ROM, 512X8, 12ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 OTP ROM, 512X8, 20ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 OTP ROM, 512X8, 20ns, CMOS, CQCC28, LCC-28 OTP ROM, 512X8, 20ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24
Maker Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
Parts packaging code DIP DIP DIP DIP DIP DIP QLCC DIP
package instruction DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 QCCN, LCC28,.45SQ DIP, DIP24,.3
Contacts 24 24 24 24 24 24 28 24
Reach Compliance Code not_compliant not_compliant unknown not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Is it Rohs certified? incompatible incompatible - incompatible incompatible incompatible incompatible incompatible
Base Number Matches 1 1 1 1 1 1 - -
Maximum access time - 15 ns 25 ns 25 ns 12 ns 20 ns 20 ns 20 ns
Other features - BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS - BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS
I/O type - COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code - R-PDIP-T24 R-GDIP-T24 R-PDIP-T24 R-PDIP-T24 R-GDIP-T24 S-CQCC-N28 R-GDIP-T24
JESD-609 code - e0 - e0 e0 e0 e0 e0
length - 30.099 mm 31.877 mm 30.099 mm 30.099 mm 31.877 mm 11.43 mm 31.877 mm
memory density - 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit
Memory IC Type - OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width - 8 8 8 8 8 8 8
Number of functions - 1 1 1 1 1 1 1
Number of terminals - 24 24 24 24 24 28 24
word count - 512 words 512 words 512 words 512 words 512 words 512 words 512 words
character code - 512 512 512 512 512 512 512
Operating mode - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - 70 °C 70 °C 70 °C 70 °C 125 °C 125 °C 125 °C
organize - 512X8 512X8 512X8 512X8 512X8 512X8 512X8
Output characteristics - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material - PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
encapsulated code - DIP DIP DIP DIP DIP QCCN DIP
Encapsulate equivalent code - DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 LCC28,.45SQ DIP24,.3
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form - IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER IN-LINE
Parallel/Serial - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage - 12.5 V 12.5 V 12.5 V 12.5 V 12.5 V 12.5 V 12.5 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 4.826 mm 5.08 mm 4.826 mm 4.826 mm 5.08 mm 1.9812 mm 5.08 mm
Maximum standby current - 0.09 A 0.09 A 0.09 A 0.09 A 0.12 A 0.12 A 0.12 A
Maximum slew rate - 0.09 mA 0.09 mA 0.09 mA 0.09 mA 0.12 mA 0.12 mA 0.12 mA
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount - NO NO NO NO NO YES NO
technology - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY
Terminal surface - Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal pitch - 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location - DUAL DUAL DUAL DUAL DUAL QUAD DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 11.43 mm 7.62 mm
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