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MSM5117400-80TS-L

Description
Fast Page DRAM, 4MX4, 80ns, CMOS, PDSO24
Categorystorage    storage   
File Size763KB,15 Pages
ManufacturerLAPIS Semiconductor Co., Ltd.
Download Datasheet Parametric Compare View All

MSM5117400-80TS-L Overview

Fast Page DRAM, 4MX4, 80ns, CMOS, PDSO24

MSM5117400-80TS-L Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLAPIS Semiconductor Co., Ltd.
package instructionTSOP, TSOP24/28,.46
Reach Compliance Codeunknown
Maximum access time80 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G24
JESD-609 codee0
memory density16777216 bit
Memory IC TypeFAST PAGE DRAM
memory width4
Number of terminals24
word count4194304 words
character code4000000
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP
Encapsulate equivalent codeTSOP24/28,.46
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
power supply5 V
Certification statusNot Qualified
refresh cycle2048
reverse pinoutYES
self refreshNO
Maximum standby current0.001 A
Maximum slew rate0.1 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

MSM5117400-80TS-L Related Products

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Description Fast Page DRAM, 4MX4, 80ns, CMOS, PDSO24 Fast Page DRAM, 4MX4, 80ns, CMOS, PDSO24 Fast Page DRAM, 4MX4, 70ns, CMOS, PDSO24 Fast Page DRAM, 4MX4, 70ns, CMOS, PDSO24 Fast Page DRAM, 4MX4, 80ns, CMOS, PDSO24
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
package instruction TSOP, TSOP24/28,.46 SOJ, SOJ24/28,.44 TSOP, TSOP24/28,.46 TSOP, TSOP24/28,.46 TSOP, TSOP24/28,.46
Reach Compliance Code unknown unknow unknow unknow unknown
Maximum access time 80 ns 80 ns 70 ns 70 ns 80 ns
I/O type COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G24 R-PDSO-J24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24
JESD-609 code e0 e0 e0 e0 e0
memory density 16777216 bit 16777216 bi 16777216 bi 16777216 bi 16777216 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
memory width 4 4 4 4 4
Number of terminals 24 24 24 24 24
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 4MX4 4MX4 4MX4 4MX4 4MX4
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP SOJ TSOP TSOP TSOP
Encapsulate equivalent code TSOP24/28,.46 SOJ24/28,.44 TSOP24/28,.46 TSOP24/28,.46 TSOP24/28,.46
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 2048 2048 2048 2048 2048
self refresh NO NO NO NO NO
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.1 mA 0.1 mA 0.11 mA 0.11 mA 0.1 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING J BEND GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1
Maker LAPIS Semiconductor Co., Ltd. LAPIS Semiconductor Co., Ltd. - - LAPIS Semiconductor Co., Ltd.
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