5962-9318707H4C datasheet, PDF

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5962-9318707H4C: DescriptionSRAM Module, 128KX32, 35ns, CMOS, PGA-66; Categorystorage storage; File Size259KB，11 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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5962-9318707H4C Overview

SRAM Module, 128KX32, 35ns, CMOS, PGA-66

5962-9318707H4C Parametric

Parameter Name	Attribute value
Parts packaging code	PGA
package instruction	PGA, PGA66,11X11
Contacts	66
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	35 ns
Other features	ALSO CONFIGURABLE AS 512K X 8
Spare memory width	16
I/O type	COMMON
JESD-30 code	S-XPGA-P66
JESD-609 code	e4
length	27.305 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Qualified
Filter level	MIL-STD-883
Maximum seat height	4.953 mm
Maximum standby current	0.0116 A
Minimum standby current	2 V
Maximum slew rate	0.6 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	27.305 mm
Base Number Matches	1

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SRAM

Austin Semiconductor, Inc.

128K x 32 SRAM

SRAM MEMORY ARRAY

AVAILABLE AS MILITARY

SPECIFICATIONS

• SMD 5962-95595: -Q

• SMD 5962-93187: -P or -PN

• MIL-STD-883

AS8S128K32

PIN ASSIGNMENT

(Top View)

68 Lead CQFP (Q)

FEATURES

• Access times of 15, 17, 20, 25, 35, and 45 ns

• Built in decoupling caps for low noise operation

• Organized as 128K x32; User configured as

256Kx16 or 512K x8

• Operation with single 5 volt supply

• Low power CMOS

• TTL Compatible Inputs and Outputs

• 2V Data Retention, Low power standby

66 Lead PGA- Pins 8, 21, 28, 39 are grounds (P)

OPTIONS

•

Timing

15ns

17ns

20ns

25ns

35ns

45ns

Package

Ceramic Quad Flatpack

Pin Grid Array -8 Series

MARKINGS

-15

-17

-20

-25

-35

-45

•

No. 702

No. 802

66 Lead PGA- Pins 8, 21, 28, 39 are no connects (PN)

NOTE:

PN indicates a no connect on pins 8, 21, 28, 39

GENERAL DESCRIPTION

The Austin Semiconductor, Inc. AS8S128K32 is a 4 Mega-

bit CMOS SRAM Module organized as 128Kx32-bits and user

configurable to 256Kx16 or 512Kx8. The AS8S128K32 achieves

high speed access, low power consumption and high reliability

by employing advanced CMOS memory technology.

The military temperature grade product is suited for mili-

tary applications.

The AS8S128K32 is offered in a ceramic quad flatpack mod-

ule per SMD-5962-95595 with a maximum height of 0.140 inches.

This module makes use of a low profile, mutlichip module de-

sign.

This device is also offered in a 1.075 inch square ceramic

pin grid array per SMD 5692-93187, which has a maximum height

of 0.195 inches. This package is also a low profile, multi-chip

module design reducing height requirements to a minimum.

CE4

WE4

128K x 8

CE3

WE3

128K x 8

I/O 24 - I/O 31

128K x 8

CE2

WE2

I/O 16 - I/O 23

CE1

WE1

A0 - 16

128K x 8

I/O 8 - I/O 23

For more products and information

please visit our web site at

www.austinsemiconductor.com

AS8S128K32

Rev. 3.5 7/00

I/O 0 - I/O 7

Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.

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