Advance Technical Data
High Voltage
IGBT
IXGQ 6N170AM
V
CES
I
C25
V
CE(sat)
t
fi(typ)
= 1700 V
=
6
A
= 7.0 V
=
32 ns
Symbol
V
CES
V
CGR
V
GES
V
GEM
I
C25
I
C90
I
CM
SSOA
(RBSOA)
t
SC
P
C
T
J
T
JM
T
stg
M
d
V
ISOL
Test Conditions
T
J
= 25°C to 150°C
T
J
= 25°C to 150°C; R
GE
= 1 MΩ
Continuous
Transient
T
C
= 25°C
T
C
= 90°C
T
C
= 25°C, 1 ms
V
GE
= 15 V, T
VJ
= 125°C, R
G
= 33Ω
Clamped inductive load
T
J
= 125°C, V
CE
= 1200 V; V
GE
= 15 V, R
G
= 33Ω
T
C
= 25°C
Maximum Ratings
1700
1700
±20
±30
6
3
14
I
CM
= 12
@ 0.8 V
CES
10
75
-55 ... +150
150
-55 ... +150
V
V
V
V
A
A
A
A
µs
W
°C
°C
°C
TO-3PM (IXGQ)
G
D
S
G = Gate,
E = Emitter,
C = Collector,
Mounting torque
50/60Hz, RMS, 10 s
1.13/10 Nm/lb.in.
2500
300
6
V
°C
g
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Weight
Features
Isolated Package
High current handling capability
MOS Gate turn-on
- drive simplicity
Rugged NPT structure
Molding epoxies meet UL 94 V-0
flammability classification
Applications
Capacitor discharge & pulser circuits
AC motor speed control
DC servo and robot drives
DC choppers
Uninterruptible power supplies (UPS)
Switched-mode and resonant-mode
power supplies
Advantages
High power density
Suitable for surface mounting
Easy to mount with 1 screw,
(isolated mounting screw hole)
Symbol
Test Conditions
Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
1700
3.0
Note 1
T
J
= 25°C
T
J
= 125°C
5.0
10
500
±100
T
J
= 25°C
T
J
= 125°C
5.5
6.5
7.0
V
V
µA
µA
nA
V
V
BV
CES
V
GE(th)
I
CES
I
GES
V
CE(sat)
I
C
I
C
= 250
µA,
V
GE
= 0 V
= 250
µA,
V
CE
= V
GE
V
CE
= 0.8 • V
CES
V
GE
= 0 V
V
CE
= 0 V, V
GE
=
±20
V
I
C
= I
C90
, V
GE
= 15 V
© 2003 IXYS All rights reserved
DS99057(06/03)
IXGQ 6N170AM
Symbol
Test Conditions
Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
2
3.5
330
V
CE
= 25 V, V
GE
= 0 V, f = 1 MHz
23
6
20
I
C
= I
C90
, V
GE
= 15 V, V
CE
= 0.5 V
CES
Inductive load, T
J
= 25°C
°
I
C
= I
C25
, V
GE
= 15 V
R
G
= 33
Ω,
V
CE
= 6.5 V
CES
Note 3
3.6
8
46
40
220
32
0.19
Inductive load, T
J
= 125°C
°
I
C
= I
C25
, V
GE
= 15 V
R
G
= 33
Ω,
V
CE
= 6.5 V
CES
Note 3
48
43
0.7
230
41
0.26
TBD
450
65
S
pF
pF
pF
nC
nC
nC
ns
ns
ns
ns
TO-3PM (IXGQ) Outline
g
fs
C
ies
C
oes
C
res
Q
g
Q
ge
Q
gc
t
d(on)
t
ri
t
d(off)
t
fi
E
off
t
d(on)
t
ri
E
on
t
d(off)
t
fi
E
off
R
thJC
R
thCK
I
C
= I
C25
; V
CE
= 10 V
Note 2
0.40 mJ
ns
ns
mJ
ns
ns
mJ
1.65 K/W
Notes: 1.
2.
3.
Device must be heatsunk for high temperature leakage current
measurements to avoid thermal runaway.
Pulse test, t
≤
300
µs,
duty cycle
≤
2 %
Switching times may increase for V
CE
(Clamp) > 0.8 • V
CES
, higher T
J
or
increased R
G
.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents:
4,835,592
4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,486,715
5,381,025
6,306,728B1