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MC14069UBDTEL

Description
CERAMIC CHIP/MIL-PRF-55681
Categorylogic    logic   
File Size92KB,8 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Related ProductsFound14parts with similar functions to MC14069UBDTEL
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MC14069UBDTEL Overview

CERAMIC CHIP/MIL-PRF-55681

MC14069UBDTEL Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerON Semiconductor
Parts packaging codeTSSOP
package instructionTSSOP-14
Contacts14
Reach Compliance Code_compli
series4000/14000/40000
JESD-30 codeR-PDSO-G14
JESD-609 codee0
length5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
Number of functions6
Number of entries1
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5/15 V
Prop。Delay @ Nom-Su125 ns
propagation delay (tpd)125 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)18 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width4.4 mm
MC14069UB
Hex Inverter
The MC14069UB hex inverter is constructed with MOS P–channel
and N–channel enhancement mode devices in a single monolithic
structure. These inverters find primary use where low power
dissipation and/or high noise immunity is desired. Each of the six
inverters is a single stage to minimize propagation delays.
http://onsemi.com
MARKING
DIAGRAMS
14
PDIP–14
P SUFFIX
CASE 646
MC14069UBCP
AWLYYWW
1
14
SOIC–14
D SUFFIX
CASE 751A
1
14
TSSOP–14
DT SUFFIX
CASE 948G
1
500
– 55 to +125
– 65 to +150
260
mW
°C
°C
°C
SOEIAJ–14
F SUFFIX
CASE 965
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
14
MC14069U
AWLYWW
14
069U
ALYW
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky TTL Load Over the Rated Temperature Range
Triple Diode Protection on All Inputs
Pin–for–Pin Replacement for CD4069UB
Meets JEDEC UB Specifications
MAXIMUM RATINGS
(Voltages Referenced to V
SS
) (Note 2.)
Symbol
V
DD
V
in
, V
out
I
in
, I
out
P
D
T
A
T
stg
T
L
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Input or Output Current
(DC or Transient) per Pin
Power Dissipation,
per Package (Note 3.)
Ambient Temperature Range
Storage Temperature Range
Lead Temperature
(8–Second Soldering)
Value
– 0.5 to +18.0
– 0.5 to V
DD
+ 0.5
±
10
Unit
V
V
mA
14069U
AWLYWW
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/
_
C From 65
_
C To 125
_
C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, V
in
and V
out
should be constrained
to the range V
SS
(V
in
or V
out
)
V
DD
.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either V
SS
or V
DD
). Unused outputs must be left open.
ORDERING INFORMATION
Device
MC14069UBCP
MC14069UBD
MC14069UBDR2
MC14069UBDT
Package
PDIP–14
SOIC–14
SOIC–14
TSSOP–14
Shipping
2000/Box
2750/Box
2500/Tape & Reel
96/Rail
v
v
MC14069UBDTEL TSSOP–14 2000/Tape & Reel
MC14069UBDTR2 TSSOP–14 2500/Tape & Reel
MC14069UBF
MC14069UBFEL
SOEIAJ–14
SOEIAJ–14
See Note 1.
See Note 1.
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
©
Semiconductor Components Industries, LLC, 2000
1
March, 2000 – Rev. 3
Publication Order Number:
MC14069UB/D

MC14069UBDTEL Related Products

MC14069UBDTEL 4069UB R71QR2100AA00K MC14069UBDT MC14069
Description CERAMIC CHIP/MIL-PRF-55681 CERAMIC CHIP/MIL-PRF-55681 R71 Series Single Metallized Polypropylene Film, Radial, SMPS PFC Applications CERAMIC CHIP/MIL-PRF-55681 CERAMIC CHIP/MIL-PRF-55681

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