NXP Semiconductors
Technical Data
Document Number: MC10XS3435
Rev. 12.0, 8/2018
Quad high-side switch
(dual 10 mOhm, dual 35 mOhm)
The 10XS3435 is one in a family of devices designed for low voltage automotive
lighting applications. Its four low R
DS(on)
MOSFETs (dual 10 mOhm/dual
35 mOhm) can control four separate 55/28 W bulbs, and/or Xenon modules,
and/or LEDs.
Programming, control and diagnostics are accomplished using a 16-bit SPI
interface. Its output with selectable slew rate improves electromagnetic
compatibility (EMC) behavior. Additionally, each output has its own parallel input
or SPI control for pulse-width modulation (PWM) control. The 10XS3435 allows
the user to program via the SPI the fault current trip levels and duration of
acceptable lamp inrush. The device has Fail-safe mode to provide functionality
of the outputs in case of MCU damage. This device is powered using
SMARTMOS technology.
Features
• Four protected 10 mOhm and 35 mOhm high-side switches (at 25 °C)
• Operating voltage range of 6.0 to 20 V with sleep current < 5.0
μA,
extended mode from 4.0 to 28 V
• 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy
chain capability
• PWM module using external clock or calibratable internal oscillator with
programmable outputs delay management
• Smart overcurrent shutdown, severe short-circuit, overtemperature
protections with time limited autoretry, and Fail-safe mode in case of MCU
damage
• Output OFF or ON openload detection compliant to bulbs or LEDs and
short to battery detection
• Analog current feedback with selectable ratio and board temperature
feedback
10XS3435
HIGH-SIDE SWITCH
FK SUFFIX
98ARL10596D
24-PIN PQFN
Applications
• Low-voltage automotive lighting
• Xenon bulbs
• Halogen bulbs
• Light-emitting diodes (LEDs)
• High beam
• Low beam
• Flashers
• Low-voltage industrial lighting
V
DD
V
DD
V
PWR
V
DD
V
PWR
10XS3435
VDD
I/O
SCLK
CS
SI
I/O
MCU
SO
I/O
I/O
I/O
I/O
A/D
GND
WAKE
FS
SCLK
CS
SO
RST
SI
IN0
IN1
IN2
IN3
CSNS
FSI
GND
VPWR
HS0
LOAD
HS1
LOAD
HS2
LOAD
HS3
LOAD
Figure 1. 10XS3435 simplified application diagram
© 2018 NXP B.V.
Table of Contents
Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Device variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2 Static electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 Dynamic electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.4 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.2 Functional pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.3 Functional internal block description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7 Functional device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.1 SPI protocol description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.2 Operational modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.3 Protection and diagnostic features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.4 Logic commands and registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
9.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
9.2 Package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
10 Additional documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
10.1Thermal addendum (Rev 2.0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
1
2
3
4
5
10XS3435
2
NXP Semiconductors
1
Orderable parts
Table 1. Orderable part variations
Part number(1)
MC10XS3435BHFK
MC10XS3435DHFK
Notes
1. To order parts in tape and reel, add the R2 suffix to the part number.
Temperature
- 40 to 125 °C
Package
24-pin PQFN
2
Device variations
Table 2. Device variations
Characteristic
Wake input clamp voltage, I
CL(WAKE)
< 2.5 mA
• 10XS3435B
• 10XS3435D
Fault detection blanking time
• 10XS3435B
• 10XS3435D
Output shutdown delay time
• 10XS3435B
• 10XS3435D
Peak Package Reflow Temperature During Reflow
(2)
,
(3)
Symbol
V
CL(WAKE)
Min
18
20
-
-
-
-
Typ
25
27
5.0
5.0
7.0
7.0
Note 3
Max
32
35
20
10
30
20
Unit
V
t
FAULT
μs
t
DETECT
T
PPRT
μs
°C
Notes
2. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature
and Moisture Sensitivity Levels (MSL), go to
www.nxp.com,
search by part number (remove prefixes/suffixes) and enter the core ID to view all
orderable parts, and review parametrics.
10XS3435
NXP Semiconductors
3
3
Internal block diagram
VDD
VPWR
I
UP
CS
SCLK
I
DWN
SO
SI
RST
WAKE
FS
IN0
IN1
IN2
IN3
Vdd Failure
Detection
Internal
Regulator
V
REG
POR
Over/Undervoltage
Protections
Charge
Pump
VPWR
Voltage Clamp
Selectable Slew Rate
Gate Driver
Selectable Overcurrent
Detection
Severe Short-circuit
Detection
Short to VPWR
Detection
Overtemperature
Detection
Openload
Detections
HS0
Logic
HS0
R
DWN
I
DWN
R
DWN
HS1
Calibratable
Oscillator
V
REG
PWM
Module
HS1
HS2
HS2
HS3
FSI
Programmable
Watchdog
Temperature
Feedback
Overtemperature
Prewarning
Analog MUX
V
DD
HS3
Selectable Output
Current Recopy
GND
CSNS
Figure 2. 10XS3435 simplified internal block diagram
10XS3435
4
NXP Semiconductors
4
Pin connections
Transparent Top View of Package
WAKE
CSNS
1
24
14
GND
23
22
FSI
GND
HS2
SCLK
VDD
RST
IN3
IN2
IN1
3
13 12 11 10
SO
GND
16
17
18
9
8
7
6
5
4
HS3
15
VPWR
19
HS1
20
NC
21
HS0
Figure 3. 10XS3435 pin connections
Table 3. 10XS3435 pin definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page
25.
Pin
number
Pin name
Pin function
Formal name
Definition
This pin reports an analog value proportional to the designated HS[0:3] output
current or the temperature of the GND flag (pin 14). It is used externally to generate
a ground-referenced voltage for the microcontroller (MCU). Current recopy and
temperature feedback is SPI programmable.
Each direct input controls the device mode. The IN[0 : 3] high-side input pins are
used to directly control HS0 : HS3 high-side output pins.
The PWM frequency can be generated from IN0 pin to PWM module in case of
external clock is set.
This pin is an open drain configured output requiring an external pull-up resistor to
V
DD
for fault reporting.
This input pin controls the device mode.
This input pin is used to initialize the device configuration and fault registers, as well
as place the device in a low-current sleep mode.
This input pin is connected to a chip select output of a master microcontroller (MCU).
This input pin is connected to the MCU providing the required bit shift clock for SPI
communication.
This pin is a command data input pin connected to the SPI Serial Data Output of the
MCU or to the SO pin of the previous device of a daisy-chain of devices.
This pin is an external voltage input pin used to supply power interfaces to the SPI
bus.
These pins, internally shorted, are the ground for the logic and analog circuitry of the
device. These ground pins must be also shorted in the board.
1
CSNS
Output
Output current
monitoring
2
3
5
6
7
8
9
10
11
12
13
14, 17, 23
IN0
IN1
IN2
IN3
FS
WAKE
RST
CS
SCLK
SI
VDD
GND
Input
Direct inputs
Output
Input
Input
Input
Input
Input
Power
Ground
Fault status
(active low)
Wake
Reset
Chip select
(active low)
Serial clock
Serial input
Digital drain voltage
Ground
IN0
2
NC
CS
FS
SI
10XS3435
NXP Semiconductors
5
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