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IS27C020-12W

Description
OTP ROM, 256KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Categorystorage    storage   
File Size458KB,11 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
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IS27C020-12W Overview

OTP ROM, 256KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

IS27C020-12W Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeDIP
package instruction0.600 INCH, PLASTIC, DIP-32
Contacts32
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time120 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.91 mm
memory density2097152 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum standby current0.00005 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
Base Number Matches1

IS27C020-12W Related Products

IS27C020-12W IS27C020-12TI IS27C020-90PL IS27C020-90PLI IS27C020-90T IS27C020-90TI IS27C020-12PL IS27C020-12PLI IS27C020-12T
Description OTP ROM, 256KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 OTP ROM, 256KX8, 120ns, CMOS, PDSO32, TSOP-32 OTP ROM, 256KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 256KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 256KX8, 90ns, CMOS, PDSO32, TSOP-32 OTP ROM, 256KX8, 90ns, CMOS, PDSO32, TSOP-32 OTP ROM, 256KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 256KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 256KX8, 120ns, CMOS, PDSO32, TSOP-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code DIP TSOP QFJ QFJ TSOP TSOP QFJ QFJ TSOP
package instruction 0.600 INCH, PLASTIC, DIP-32 TSOP-32 PLASTIC, LCC-32 PLASTIC, LCC-32 TSOP-32 TSOP-32 PLASTIC, LCC-32 PLASTIC, LCC-32 TSOP-32
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 120 ns 90 ns 90 ns 90 ns 90 ns 120 ns 120 ns 120 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDIP-T32 R-PDSO-G32 R-PQCC-J32 R-PQCC-J32 R-PDSO-G32 R-PDSO-G32 R-PQCC-J32 R-PQCC-J32 R-PDSO-G32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 41.91 mm 18.4 mm 13.97 mm 13.97 mm 18.4 mm 18.4 mm 13.97 mm 13.97 mm 18.4 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32 32
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C
organize 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP TSOP1 QCCJ QCCJ TSOP1 TSOP1 QCCJ QCCJ TSOP1
Encapsulate equivalent code DIP32,.6 TSSOP32,.8,20 LDCC32,.5X.6 LDCC32,.5X.6 TSSOP32,.8,20 TSSOP32,.8,20 LDCC32,.5X.6 LDCC32,.5X.6 TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE, THIN PROFILE CHIP CARRIER CHIP CARRIER SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE CHIP CARRIER CHIP CARRIER SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.572 mm 1.2 mm 3.55 mm 3.55 mm 1.2 mm 1.2 mm 3.55 mm 3.55 mm 1.2 mm
Maximum standby current 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A
Maximum slew rate 0.03 mA 0.04 mA 0.03 mA 0.04 mA 0.03 mA 0.04 mA 0.03 mA 0.04 mA 0.03 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING J BEND J BEND GULL WING GULL WING J BEND J BEND GULL WING
Terminal pitch 2.54 mm 0.5 mm 1.27 mm 1.27 mm 0.5 mm 0.5 mm 1.27 mm 1.27 mm 0.5 mm
Terminal location DUAL DUAL QUAD QUAD DUAL DUAL QUAD QUAD DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 8 mm 11.43 mm 11.43 mm 8 mm 8 mm 11.43 mm 11.43 mm 8 mm
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