OTP ROM, 256KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | QFJ |
| package instruction | PLASTIC, LCC-32 |
| Contacts | 32 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 90 ns |
| I/O type | COMMON |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 2097152 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.55 mm |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.43 mm |
| IS27C020-90PL | IS27C020-12W | IS27C020-12TI | IS27C020-90PLI | IS27C020-90T | IS27C020-90TI | IS27C020-12PL | IS27C020-12PLI | IS27C020-12T | |
|---|---|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 256KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 256KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | OTP ROM, 256KX8, 120ns, CMOS, PDSO32, TSOP-32 | OTP ROM, 256KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 256KX8, 90ns, CMOS, PDSO32, TSOP-32 | OTP ROM, 256KX8, 90ns, CMOS, PDSO32, TSOP-32 | OTP ROM, 256KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 256KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 256KX8, 120ns, CMOS, PDSO32, TSOP-32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | QFJ | DIP | TSOP | QFJ | TSOP | TSOP | QFJ | QFJ | TSOP |
| package instruction | PLASTIC, LCC-32 | 0.600 INCH, PLASTIC, DIP-32 | TSOP-32 | PLASTIC, LCC-32 | TSOP-32 | TSOP-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | TSOP-32 |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 90 ns | 120 ns | 120 ns | 90 ns | 90 ns | 90 ns | 120 ns | 120 ns | 120 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PQCC-J32 | R-PDIP-T32 | R-PDSO-G32 | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 | R-PQCC-J32 | R-PDSO-G32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 13.97 mm | 41.91 mm | 18.4 mm | 13.97 mm | 18.4 mm | 18.4 mm | 13.97 mm | 13.97 mm | 18.4 mm |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | TSOP1 | QCCJ | TSOP1 | TSOP1 | QCCJ | QCCJ | TSOP1 |
| Encapsulate equivalent code | LDCC32,.5X.6 | DIP32,.6 | TSSOP32,.8,20 | LDCC32,.5X.6 | TSSOP32,.8,20 | TSSOP32,.8,20 | LDCC32,.5X.6 | LDCC32,.5X.6 | TSSOP32,.8,20 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.55 mm | 4.572 mm | 1.2 mm | 3.55 mm | 1.2 mm | 1.2 mm | 3.55 mm | 3.55 mm | 1.2 mm |
| Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| Maximum slew rate | 0.03 mA | 0.03 mA | 0.04 mA | 0.04 mA | 0.03 mA | 0.04 mA | 0.03 mA | 0.04 mA | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | GULL WING | J BEND | GULL WING | GULL WING | J BEND | J BEND | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm | 0.5 mm |
| Terminal location | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 11.43 mm | 15.24 mm | 8 mm | 11.43 mm | 8 mm | 8 mm | 11.43 mm | 11.43 mm | 8 mm |
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